IP Library › Granted Patent US 12,574,008
Granted Patent B2
US 12,574,008 · App. 17/987,933 · Granted Mar 10, 2026

Acoustic wave device with an IDT electrode including an outer layer

Inventors: Masakazu Mimura (Nagaokakyo, JP); Soichiro Tegawa (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H9/25
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Quick Facts
Patent No.
US 12,574,008
App. No.
17/987,933
Granted
Mar 10, 2026
Kind
B2
Abstract

An acoustic wave device includes a piezoelectric substrate and an IDT electrode including electrode fingers, a barrier layer on the piezoelectric substrate, and a first layer on the barrier layer, and including Cu as a main component. The first layer includes a first principal surface on a side closest to the piezoelectric substrate, a second principal surface opposite to the first principal surface, and a side surface connected to the first principal surface and the second principal surface. The barrier layer covers the first principal surface 5 a and the side surface of the first layer. A thickness of a portion of the barrier layer covering the first principal surface of the first layer is smaller than a thickness of a portion of the barrier layer covering the side surface of the first layer.

Claims (26)

1 . An acoustic wave device comprising:

a piezoelectric substrate; and

an IDT electrode including a plurality of electrode fingers, an outer layer on the piezoelectric substrate, and an electrode layer on the outer layer and including Cu as a main component; wherein

the electrode layer includes a first principal surface positioned on a side closest to the piezoelectric substrate, a second principal surface opposite to the first principal surface, and a side surface connected to the first principal surface and the second principal surface;

the outer layer covers the first principal surface and the side surface of the electrode layer; and

a thickness of a portion of the outer layer covering the first principal surface of the electrode layer is smaller than a thickness of a portion of the outer layer covering the side surface of the electrode layer.

2 . The acoustic wave device according to claim 1 , further comprising a protective film on the piezoelectric substrate and covering the IDT electrode.

3 . The acoustic wave device according to claim 1 , wherein the electrode layer is a first layer of the IDT electrode, and the IDT electrode further includes a second layer on the second principal surface of the first layer.

4 . The acoustic wave device according to claim 2 , wherein the electrode layer is a first layer of the IDT electrode, and the IDT electrode further includes a second layer on the second principal surface of the first layer.

5 . The acoustic wave device according to claim 1 , wherein the outer layer covers the first principal surface, the side surface, and the second principal surface of the electrode layer.

6 . The acoustic wave device according to claim 2 , wherein the outer layer covers the first principal surface, the side surface, and the second principal surface of the electrode layer.

7 . The acoustic wave device according to claim 1 , wherein the outer layer is made of a metal oxide.

8 . The acoustic wave device according to claim 2 , wherein the outer layer is made of a metal oxide.

9 . The acoustic wave device according to claim 3 , wherein the outer layer is made of a metal oxide.

10 . The acoustic wave device according to claim 5 , wherein the outer layer is made of a metal oxide.

11 . The acoustic wave device according to claim 7 , wherein the outer layer is made of an oxide of one metal selected from the group consisting of Mn, Al, Mg, and Sn.

12 . The acoustic wave device according to claim 8 , wherein the outer layer is made of an oxide of one metal selected from the group consisting of Mn, Al, Mg, and Sn.

13 . The acoustic wave device according to claim 9 , wherein the outer layer is made of an oxide of one metal selected from the group consisting of Mn, Al, Mg, and Sn.

14 . The acoustic wave device according to claim 10 , wherein the outer layer is made of an oxide of one metal selected from the group consisting of Mn, Al, Mg, and Sn.

15 . The acoustic wave device according to claim 11 , wherein the outer layer is made of the oxide of Mn.

16 . The acoustic wave device according to claim 12 , wherein the outer layer is made of the oxide of Mn.

17 . The acoustic wave device according to claim 13 , wherein the outer layer is made of the oxide of Mn.

18 . The acoustic wave device according to claim 14 , wherein the outer layer is made of the oxide of Mn.

19 . The acoustic wave device according to claim 1 , wherein the piezoelectric substrate includes a support substrate and a piezoelectric layer on the support substrate.

20 . The acoustic wave device according to claim 1 , further comprising a dielectric film between the piezoelectric substrate and the IDT electrode; wherein

when a wavelength specified by an electrode finger pitch of the IDT electrode is denoted by λ, a thickness of the dielectric film is about 1% or less of the wavelength λ.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2022
From: MIMURA, MASAKAZU; TEGAWA, SOICHIRO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 061788/0465 →
Priority Claims (1)
JP 2020-093436 · May 28, 2020 · national
Continuity (2)
Continuation PCTJP2021019339 · May 21, 2021
Related Publication 20230076316A1 · Mar 9, 2023
References Cited (23)
US 10763813B2 · Nakamura · 2020 [cited by examiner]
US 20060076851A1 · Fujimoto et al. · 2006 [cited by applicant]
US 20060175639A1 · Leidl et al. · 2006 [cited by applicant]
US 20080061657A1 · Matsuda et al. · 2008 [cited by applicant]
US 20100187493A1 · Takahashi · 2010 [cited by applicant]
US 20130285768A1 · Watanabe et al. · 2013 [cited by applicant]
US 20150033521A1 · Watanabe et al. · 2015 [cited by applicant]
US 20170250335A1 · Taniguchi · 2017 [cited by applicant]
US 20210305487A1 · Li · 2021 [cited by examiner]
CN 101145767A · 2008 [cited by applicant]
CN 103262410A · 2013 [cited by applicant]
JP 2004289441A · 2004 [cited by applicant]
JP 2005518127A · 2005 [cited by applicant]
JP 2006109287A · 2006 [cited by applicant]
JP 2008067289A · 2008 [cited by applicant]
JP 2010177393A · 2010 [cited by applicant]
JP 2017157944A · 2017 [cited by applicant]
JP 2018050135A · 2018 [cited by applicant]
JP 2019068309A · 2019 [cited by applicant]
WO 2012086639A1 · 2012 [cited by applicant]
International Search Report in PCT/JP2021/019339, mailed Aug. 3, 2021, 3 pages. [cited by applicant]
Written Opinion in PCT/JP2021/019339, mailed Aug. 3, 2021, 4 pages. [cited by applicant]
Official Communication issued in corresponding Chinese Patent Application No. 202180037234.1, mailed on May 9, 2025, 8 pages. [cited by applicant]