IP Library › Granted Patent US 12,575,093
Granted Patent B2
US 12,575,093 · App. 18/165,011 · Granted Mar 10, 2026

Anti-fuse structure, anti-fuse array and method for manufacturing same

Inventor: Chuangming Hou (Hefei City, CN)
Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
H10B20/25
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Quick Facts
Patent No.
US 12,575,093
App. No.
18/165,011
Granted
Mar 10, 2026
Kind
B2
Abstract

Provided is an anti-fuse structure, an anti-fuse array and a method for forming the same. The anti-fuse structure includes: a substrate; a switching device including a first gate structure, a second gate structure, a first doped region, a second doped region and a third doped region, the first and the second gate structures being arranged on the substrate, the first and the second doped regions being respectively located in the substrate at two sides of the first gate structure, and the second and the third doped regions being respectively located in the substrate at two sides of the second gate structure; and an anti-fuse device including a third gate structure and the third doped region, the second and the third gate structures being respectively located on the substrate at two sides of the third doped region, and the doped regions being configured to form a source or a drain, respectively.

Claims (45)

1 . An anti-fuse structure, comprising:

a substrate;

a switching device comprising a first gate structure, a second gate structure, a first doped region, a second doped region and a third doped region; the first gate structure and the second gate structure being arranged on the substrate, the first doped region and the second doped region being respectively located in the substrate at two sides of the first gate structure, and the second doped region and the third doped region being respectively located in the substrate at two sides of the second gate structure; and

an anti-fuse device comprising a third gate structure and the third doped region, the second gate structure and the third gate structure being respectively located on the substrate at two sides of the third doped region, wherein the doped regions are respectively configured to form a source or a drain;

wherein the first gate structure is connected with the second gate structure to form a bent gate or an annular gate.

2 . The anti-fuse structure of claim 1 , wherein

a spacing distance between the first gate structure and the second gate structure is the same as a spacing distance between the second gate structure and the third gate structure.

3 . The anti-fuse structure of claim 1 , wherein

the first gate structure comprises a first gate conductive layer and a first gate oxide layer, the second gate structure comprises a second gate conductive layer and a second gate oxide layer, and the third gate structure comprises a third gate conductive layer and a third gate oxide layer, wherein,

the first gate oxide layer is provided between the first gate conductive layer and the substrate;

the second gate oxide layer is provided between the second gate conductive layer and the substrate; and

the third gate oxide layer is provided between the third gate conductive layer and the substrate.

4 . The anti-fuse structure of claim 3 , wherein

thicknesses of the first gate oxide layer, the second gate oxide layer and the third gate oxide layer are the same.

5 . The anti-fuse structure of claim 1 , wherein

the first doped region is a source of the switching device;

the second doped region and the third doped region are a first drain and a second drain of the switching device, respectively.

6 . The anti-fuse structure of claim 1 , further comprising

lightly doped drain regions, wherein the lightly doped drain regions are provided at two sides of the first doped region, at two sides of the second doped region and at two sides of the third doped region, respectively.

7 . The anti-fuse structure of claim 1 , further comprising:

a word line, wherein the word line is electrically connected with the first gate structure and the second gate structure; and

a bit line connecting structure that electrically connects a bit line to the first doped region.

8 . The anti-fuse structure of claim 1 , wherein

the substrate is provided with a well region, wherein

the first doped region, the second doped region and the third doped region are provided in the well region; and

the first gate structure, the second gate structure and the third gate structure are provided on the well region.

9 . An anti-fuse array, comprising:

multiple anti-fuse sub-arrays arranged along a first direction, wherein each of the anti-fuse sub-arrays comprises two anti-fuse unit rows, each of the anti-fuse unit rows comprises N anti-fuse structures according to claim 1 , where N is an integer greater than or equal to 1; the two anti-fuse unit rows are axially symmetrically arranged along a symmetry axis extending parallel to a second direction, the N anti-fuse structures of each anti-fuse unit row are spaced apart from each other along the second direction, and the first gate structures, the second gate structures and the third gate structures of the N anti-fuse structures are respectively connected and extend along the second direction; and

N bit lines extending along the first direction and spaced apart from each other along the second direction, wherein each of the bit lines is electrically connected to the first doped regions spaced apart from each other along the first direction in the multiple anti-fuse sub-arrays.

10 . The anti-fuse array of claim 9 , wherein

in each of the anti-fuse unit rows, the first gate structure and the second gate structure of at least one of two anti-fuse structures located at two ends in the second direction are connected.

11 . The anti-fuse array of claim 10 , wherein

in each of the anti-fuse unit rows, the first gate structures and the second gate structures of the N anti-fuse structures are connected and are bent or annular.

12 . The anti-fuse array of claim 9 , wherein

in each of the anti-fuse unit rows, a spacing distance of adjacent first doped regions, a spacing distance of adjacent second doped regions, and a spacing distance of adjacent third doped regions are all the same.

13 . The anti-fuse array of claim 9 , wherein

the anti-fuse sub-arrays are all spaced at a same spacing distance in the first direction.

14 . The anti-fuse array of claim 9 , wherein

in the anti-fuse sub-array, two adjacent and symmetrical ones of the anti-fuse structures in the first direction share the first doped region.

15 . An anti-fuse structure, comprising:

a substrate;

a switching device comprising a first gate structure, a second gate structure, a first doped region, a second doped region and a third doped region; the first gate structure and the second gate structure being arranged on the substrate, the first doped region and the second doped region being respectively located in the substrate at two sides of the first gate structure, and the second doped region and the third doped region being respectively located in the substrate at two sides of the second gate structure;

an anti-fuse device comprising a third gate structure and the third doped region, the second gate structure and the third gate structure being respectively located on the substrate at two sides of the third doped region, wherein the doped regions are respectively configured to form a source or a drain;

a word line, wherein the word line is electrically connected with the first gate structure and the second gate structure; and

a bit line connecting structure that electrically connects a bit line to the first doped region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2023
From: HOU, CHUANGMING
To: CHANGXIN MEMORY TECHNOLOGIES, INC.
Reel/Frame 062603/0668 →
Priority Claims (1)
CN 202210741019.6 · Jun 27, 2022 · national
Continuity (2)
Continuation PCTCN2022105529 · Jul 13, 2022
Related Publication 20230422493A1 · Dec 28, 2023
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