Masking layer with post treatment
A method includes forming a semiconductor layer over a substrate; etching a portion of the semiconductor layer to form a first recess and a second recess; forming a first masking layer over the semiconductor layer; performing a first thermal treatment on the first masking layer, the first thermal treatment densifying the first masking layer; etching the first masking layer to expose the first recess; forming a first semiconductor material in the first recess; and removing the first masking layer.
1 . A method, comprising:
forming a semiconductor layer over a first substrate;
etching the semiconductor layer to form a first recess in a first region and a second recess in a second region;
forming a first masking layer over the first region, forming the first masking layer comprising:
depositing a metal oxide layer over the first region and the second region;
performing a post-deposition treatment on the metal oxide layer, wherein performing the post-deposition treatment comprises increasing a roughness of the metal oxide layer; and
removing the metal oxide layer from the second region;
forming a first epitaxial source/drain region in the second recess; and
removing a remainder of the first masking layer.
2 . The method of claim 1 , wherein performing the post-deposition treatment comprises increasing a deposition selectivity of an epitaxial material of the first epitaxial source/drain region.
3 . The method of claim 1 , wherein the post-deposition treatment comprises a thermal treatment.
4 . The method of claim 1 , wherein the post-deposition treatment comprises a plasma treatment.
5 . The method of claim 1 , wherein performing the post-deposition treatment comprises crystallizing a portion of the metal oxide layer.
6 . The method of claim 1 , wherein forming the first epitaxial source/drain region in the second recess further comprises forming discontinuous nodules over the metal oxide layer.
7 . The method of claim 1 , further comprising, after removing the remainder of the first masking layer, forming a second masking layer over the second region, forming the second masking layer comprising:
depositing an additional metal oxide layer over the first region and the second region;
performing an additional post-deposition treatment on the additional metal oxide layer; and
removing the additional metal oxide layer from the first region.
8 . The method of claim 7 , further comprising:
forming a second epitaxial source/drain region in the first recess; and
removing a remainder of the second masking layer.
9 . A method, comprising:
forming a first fin and a second fin over a substrate;
etching a first recess in the first fin and a second recess in the second fin;
depositing an oxide mask layer over the first fin and the second fin;
performing a treatment process on the oxide mask layer, the treatment process increasing a deposition selectivity of a semiconductor material on the first fin compared with the oxide mask layer, wherein increasing the deposition selectivity comprises making the semiconductor material less easily deposited over the oxide mask layer;
etching to remove a portion of the oxide mask layer from the first fin;
depositing a first silicon material in the first recess and a second silicon material over a remaining portion of the oxide mask layer, the first silicon material being a continuous material having a crystalline structure of the first fin, the second silicon material comprising discontinuous nodules; and
etching to remove the discontinuous nodules and the remaining portion of the oxide mask layer.
10 . The method of claim 9 , wherein the oxide mask layer comprises a metal oxide.
11 . The method of claim 9 , wherein performing the treatment process on the oxide mask layer comprises a UV radiation treatment.
12 . The method of claim 11 , wherein performing the treatment process on the oxide mask layer further comprises a thermal treatment.
13 . The method of claim 12 , wherein the thermal treatment comprises a temperature between 650° C. and 900° C.
14 . The method of claim 9 , wherein performing the treatment process comprises increasing a density of the oxide mask layer.
15 . A method, comprising:
forming a first dummy gate stack over a semiconductor substrate in a first region, the first region having a first conductivity type;
forming a second dummy gate stack over the semiconductor substrate in a second region, the second region having a second conductivity type;
forming a first metal oxide layer over the first region and the second region;
performing a first treatment process on the first metal oxide layer;
after performing the first treatment process, removing a portion of the first metal oxide layer from the first region;
forming a first epitaxial source/drain region in the semiconductor substrate adjacent to the first dummy gate stack and first nodules of semiconductor material over a remainder of the first metal oxide layer;
performing a first etch process to remove the first metal oxide layer and the first nodules of semiconductor material;
after performing the first etch process, forming a second metal oxide layer over the first region and the second region;
forming a second epitaxial source/drain region in the semiconductor substrate adjacent to the second dummy gate stack and second nodules of semiconductor material over a remainder of the second metal oxide layer;
performing a second etch process to remove the second metal oxide layer and the second nodules of semiconductor material; and
replacing at least a portion of the first dummy gate stack with a gate electrode.
16 . The method of claim 15 , further comprising:
performing a second treatment process on the second metal oxide layer; and
after performing the second treatment process, removing a portion of the second metal oxide layer from the second region.
17 . The method of claim 16 , wherein the first treatment process comprises a thermal treatment process, and wherein the second treatment process comprises a plasma treatment process.
18 . The method of claim 15 , wherein the first treatment process comprises increasing a surface roughness of the first metal oxide layer.
19 . The method of claim 18 , wherein increasing the surface roughness of the first metal oxide layer comprises increasing a semiconductor material deposition selectivity between the semiconductor substrate and the first metal oxide layer.
20 . The method of claim 9 , wherein etching to remove the portion of the oxide mask layer from the first fin comprises an anisotropic etch, and wherein etching to remove the remaining portion of the oxide mask layer comprises an isotropic etch.