IP Library › Granted Patent US 12,578,766
Granted Patent B2
US 12,578,766 · App. 17/790,926 · Granted Mar 17, 2026

Hinge with translatable axis

Inventors: Anthony E. Hillyerd (Sammamish, WA); Christina Ashley Yee (Redmond, WA); Aseem Singla (Redmond, WA); Robyn Rebecca Reed McLaughlin (Seattle, WA); Kaitlyn Marley Schoeck (Seattle, WA); Hua Wang (Redmond, WA); Daniel Dhondt (Redmond, WA); Brian David Bitz (Woodinville, WA); Joseph Benjamin Gault (Seattle, WA)
Assignee: Microsoft Technology Licensing, LLC
G06F1/1681G06F1/1618G06F1/162H04M1/022E05D3/122E05D3/18E05Y2999/00G06F1/1616H04M1/0216
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Quick Facts
Patent No.
US 12,578,766
App. No.
17/790,926
Granted
Mar 17, 2026
Kind
B2
Abstract

A hinge system has a first body and a second body rotatably connected to one another around a first pivot point. The second body has a top surface and bottom surface positioned opposite one another in a vertical direction of the second body. A translation mechanism is connected to the second body and the first pivot point to displace the first pivot point in the vertical direction relative to the second body.

Claims (14)

1 . A hinge system for electronic devices, the hinge system comprising: a first body; a second body rotatably connected to the first body around a first pivot point, the second body having a top surface and bottom surface positioned opposite one another in a vertical direction of the second body; a third body supported by the first body; and a translation mechanism including a link, the link connected to the first body and the second body and configured to be horizontally in-line with the second body when the first body and the third body are perpendicular to the second body, and wherein the link is configured to be perpendicular to the second body when the first body and the third body are parallel with the second body in a clamshell position and the link is configured to be parallel to the second body when the first body and the third body are parallel with the second body in a nested position, and wherein the translation mechanism positions the first pivot point at a first position in the vertical direction when the first body is in the nested position and at a second position in the vertical direction when the first body is in the clamshell position, wherein, and the first position and second position are different.

2 . The hinge system of claim 1 , the translation mechanism including the link connected to a second pivot point and the first pivot point, the link rotatable about the second pivot point to displace the first pivot point in the vertical direction relative to the second body.

3 . The hinge system of claim 2 , wherein a contact between the third body and the link provides a physical hardstop on a rotational range of motion of the first pivot point.

4 . The hinge system of claim 3 , wherein the physical hardstop on the rotational range of motion of the first pivot point forces any further rotation to be around the second pivot point.

5 . The hinge system of claim 1 , wherein the translation mechanism positions the first pivot point at a lowest position in the vertical direction when the first body is in the nested position and at a highest position in the vertical direction when the first body in the clamshell position.

6 . An electronic device comprising:

the hinge system of claim 1 ;

the third body rotatably connected to the first body; and

wherein the translation mechanism displaces the first pivot point in the vertical direction between an upper position and a lower position relative to the second body,

wherein the upper position allows the third body and second body to attain the clamshell position and the lower position allows the third body and second body to attain the nested position.

7 . The hinge system of claim 1 , wherein the first body functions as a stand for the third body.

8 . The hinge system of claim 1 , wherein the first body provides electrical communication between the second body and the third body.

9 . A method of moving a hinge in an electronic device, the method comprising: rotating a first body of the electronic device around a first pivot point connected to a second body of the electronic device via a link from a closed position to an open position and wherein the link translates from a vertical position to a horizontal position, the second body having a top surface and bottom surface positioned opposite one another in the vertical direction, a third body supported by the first body, wherein the link is configured to be horizontally in-line with the second body when the first body and the third body are perpendicular to the second body, and wherein the link is configured to be perpendicular to the second body when the first body and the third body are parallel with the second body in a clamshell position and the link is configured to be parallel to the second body when the first body and the third body are parallel with the second body in a nested position, and wherein the translation mechanism positions the first pivot point at a first position in the vertical direction when the first body is in the nested position and at a second position in the vertical direction when the first body is in the clamshell position, wherein, and the first position and second position are different; and rotating the first body of the electronic device from the open position to the closed position wherein the link translates from the horizontal position to the vertical position.

10 . The method of claim 9 , wherein the link includes a first pivot point and a second pivot point and rotating the first body of the electronic device relative to the second body of the electronic device includes translating the first pivot point in an arcuate path around the second pivot point.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2025
From: HILLYERD, ANTHONY E.; YEE, CHRISTINA ASHLEY; SINGLA, ASEEM; MCLAUGHLIN, ROBYN REBECCA REED; SCHOECK, KAITLYN MARLEY; WANG, HUA; DHONDT, DANIEL; BITZ, BRIAN DAVID; GAULT, JOSEPH BENJAMIN
To: MICROSOFT TECHNOLOGY LICENSING, LLC
Reel/Frame 070476/0040 →
Continuity (2)
Provisional Application 62957641 · Jan 6, 2020
Related Publication 20230034612A1 · Feb 2, 2023
References Cited (152)
US 5489924A · Shima · 1996 [cited by applicant]
US 5564163A · Lowry et al. · 1996 [cited by applicant]
US 5644469A · Shioya · 1997 [cited by applicant]
US 6266236B1 · Ku et al. · 2001 [cited by applicant]
US 6464195B1 · Hildebrandt · 2002 [cited by applicant]
US 6826043B2 · Chang · 2004 [cited by applicant]
US 7061753B2 · Michoux · 2006 [cited by applicant]
US 7403378B2 · Lo et al. · 2008 [cited by applicant]
US 7478786B2 · Copeland · 2009 [cited by applicant]
US 7742285B2 · Ishikura · 2010 [cited by applicant]
US 8074323B2 · Lin · 2011 [cited by applicant]
US 8253648B2 · Nagai · 2012 [cited by applicant]
US 8908364B2 · Tseng et al. · 2014 [cited by applicant]
US 8914946B2 · Hsu et al. · 2014 [cited by applicant]
US 9107301B2 · Pan · 2015 [cited by examiner]
US 9261906B2 · Arima · 2016 [cited by applicant]
US 9291299B2 · Richard · 2016 [cited by applicant]
US 9405325B2 · Kim · 2016 [cited by examiner]
US 9523226B1 · Lam et al. · 2016 [cited by applicant]
US 9557778B2 · Sung · 2017 [cited by examiner]
US 9644412B2 · Novin · 2017 [cited by applicant]
US 9791674B1 · Topliss · 2017 [cited by applicant]
US 9927844B2 · Park · 2018 [cited by applicant]
US 10025348B2 · Arima · 2018 [cited by applicant]
US 10061360B1 · Magi · 2018 [cited by examiner]
US 10151128B2 · Hatano · 2018 [cited by applicant]
US 10324501B1 · Zimmerman et al. · 2019 [cited by applicant]
US 10407957B1 · Camp et al. · 2019 [cited by applicant]
US 10474203B2 · Tazbaz · 2019 [cited by examiner]
US 10558245B2 · Morrison et al. · 2020 [cited by applicant]
US 10648212B2 · Novin · 2020 [cited by applicant]
US 10761571B1 · Cooper · 2020 [cited by applicant]
US 10852765B2 · Sanchez · 2020 [cited by applicant]
US 10996710B2 · Park · 2021 [cited by applicant]
US 11008789B2 · Hatano · 2021 [cited by applicant]
US 11106249B1 · Zimmerman · 2021 [cited by applicant]
US 11237643B2 · Kulkarni · 2022 [cited by applicant]
US 11507145B2 · Nakamura · 2022 [cited by applicant]
US 11573611B2 · Channaiah · 2023 [cited by examiner]
US 20040021051A1 · Chiu · 2004 [cited by applicant]
US 20050138775A1 · Oakley · 2005 [cited by examiner]
US 20060211457A1 · Otsuka · 2006 [cited by applicant]
US 20060288258A1 · Lo · 2006 [cited by examiner]
US 20070058329A1 · Ledbetter · 2007 [cited by applicant]
US 20070183123A1 · Chuan · 2007 [cited by examiner]
US 20080094792A1 · Chen · 2008 [cited by examiner]
US 20080271288A1 · Senatori · 2008 [cited by examiner]
US 20110312392A1 · Reeves · 2011 [cited by examiner]
US 20120124775A1 · Ceci · 2012 [cited by applicant]
US 20130160244A1 · Sayama · 2013 [cited by examiner]
US 20130318746A1 · Kuramochi · 2013 [cited by applicant]
US 20140157546A1 · Ho · 2014 [cited by examiner]
US 20140165334A1 · Liu · 2014 [cited by applicant]
US 20140338483A1 · Hsu et al. · 2014 [cited by applicant]
US 20140375194A1 · Arima · 2014 [cited by applicant]
US 20140375196A1 · Nguyen · 2014 [cited by applicant]
US 20150002998A1 · Arima · 2015 [cited by applicant]
US 20150077915A1 · Saito · 2015 [cited by applicant]
US 20150121654A1 · Novin · 2015 [cited by applicant]
US 20150185786A1 · Yeh et al. · 2015 [cited by applicant]
US 20160147267A1 · Bitz et al. · 2016 [cited by applicant]
US 20160327994A1 · Lee · 2016 [cited by applicant]
US 20170097657A1 · Hampton et al. · 2017 [cited by applicant]
US 20170208703A1 · Lin · 2017 [cited by examiner]
US 20170218672A1 · Novin · 2017 [cited by applicant]
US 20180044958A1 · Tazbaz et al. · 2018 [cited by applicant]
US 20180059735A1 · Tazbaz · 2018 [cited by examiner]
US 20180066465A1 · Tazbaz · 2018 [cited by examiner]
US 20180088634A1 · Bitz · 2018 [cited by applicant]
US 20180112447A1 · Hatano · 2018 [cited by applicant]
US 20180188781A1 · Park, Jr. · 2018 [cited by examiner]
US 20180209473A1 · Park · 2018 [cited by examiner]
US 20190011957A1 · Wendt · 2019 [cited by applicant]
US 20190029135A1 · Park et al. · 2019 [cited by applicant]
US 20190064886A1 · Wendt · 2019 [cited by examiner]
US 20190243426A1 · Morrison et al. · 2019 [cited by applicant]
US 20200040626A1 · Hatano · 2020 [cited by applicant]
US 20200233459A1 · Sanchez · 2020 [cited by applicant]
US 20210289644A1 · Zarnowitz · 2021 [cited by applicant]
US 20220057844A1 · Nakamura · 2022 [cited by applicant]
US 20230049295A1 · Hillyerd · 2023 [cited by applicant]
US 20230049811A1 · Krahn · 2023 [cited by applicant]
US 20230084038A1 · Yee et al. · 2023 [cited by applicant]
US 20230123520A1 · Yee · 2023 [cited by examiner]
US 20230129909A1 · Yee et al. · 2023 [cited by applicant]
US 20240111330A1 · Yu · 2024 [cited by applicant]
US 20240111339A1 · Sun · 2024 [cited by applicant]
CN 201301889Y · 2009 [cited by applicant]
CN 101672322A · 2010 [cited by applicant]
CN 102572029A · 2012 [cited by applicant]
CN 103291163A · 2013 [cited by applicant]
CN 103576772A · 2014 [cited by applicant]
CN 104765412A · 2015 [cited by applicant]
CN 104767843A · 2015 [cited by applicant]
CN 204553526U · 2015 [cited by applicant]
CN 107771308A · 2018 [cited by applicant]
CN 109564449A · 2019 [cited by applicant]
CN 109643144A · 2019 [cited by applicant]
CN 110168470A · 2019 [cited by applicant]
CN 110226149A · 2019 [cited by applicant]
CN 108691470A · 2021 [cited by applicant]
EP 2397929A1 · 2011 [cited by applicant]
EP 2557473A1 · 2013 [cited by applicant]
EP 2615331A1 · 2013 [cited by applicant]
EP 2696255A2 · 2014 [cited by applicant]
EP 2911030A2 · 2015 [cited by applicant]
EP 3069208A1 · 2016 [cited by applicant]
GB 931284A · 1963 [cited by applicant]
WO 2010015931A2 · 2010 [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/014025”, Mailed Date: Oct. 9, 2020, 14 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/024692”, Mailed Date: Dec. 11, 2020, 15 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/024700”, Mailed Date: Nov. 23, 2020, 12 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/040030”, Mailed Date: Oct. 9, 2020, 13 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/040031”, Mailed Date: Dec. 2, 2020, 17 Pages. [cited by applicant]
“Invitation to Pay Additional Fees Issued in PCT Application No. PCT/US20/040031”, Mailed Date: Oct. 7, 2020, 10 Pages. [cited by applicant]
Communication pursuant to Article 94(3) EPC, Received for European Application No. 20720607.9, mailed on Jul. 5, 2024, 8 pages. [cited by applicant]
Communication under Rule 71(3) received in European Application No. 20719884.7, mailed on Jun. 18, 2024, 8 pages. [cited by applicant]
Second Office Action Received for Chinese Application No. 202080092255.9, mailed on May 23, 2024, 11 pages. (English Translation Provided). [cited by applicant]
Office Action Received for Chinese Application No. 202080092254.4, mailed on Dec. 11, 2023, 11 pages (English Translation Provided). [cited by applicant]
Office Action received for Chinese Application No. 202080092255.9, mailed on Dec. 1, 2023, 16 Pages (English Translation Provided). [cited by applicant]
Office Action Received for Chinese Application No. 202080093593.4, mailed on Dec. 28, 2023, 11 pages. [cited by applicant]
First Office Action Received for Chinese Application No. 202080099087.6, mailed on Aug. 17, 2024, 17 pages (English Translation Provided). [cited by applicant]
Non-Final Office Action mailed on Sep. 28, 2024, in U.S. Appl. No. 17/790,914, 09 pages. [cited by applicant]
Non-Final Office Action mailed on Aug. 28, 2024, in U.S. Appl. No. 17/793,624, 12 pages. [cited by applicant]
Office Action Received for Chinese Application No. 202080092254.4, mailed on Aug. 29, 2024, 9 pages. (English Translation Provided). [cited by applicant]
Office Action Received for Chinese Application No. 202080099092.7, mailed on Nov. 21, 2024, 15 Pages (English Translation Provided). [cited by applicant]
Communication pursuant to Article 94(3) Received in European Patent Application No. 20743461.4, mailed on Jan. 16, 2025, 8 pages. [cited by applicant]
Decision on Rejection Received for Chinese Application No. 202080092255.9, mailed on Jan. 13, 2025, 8 pages (English Translation Provided). [cited by applicant]
Decision to Grant pursuant to Article 97(1) Received for European Application No. 20719884.7, mailed on Oct. 24, 2024, 02 pages. [cited by applicant]
Final office action mailed on Jan. 16, 2025, in U.S. Appl. No. 17/790,914, 15 pages. [cited by applicant]
Notice of grant Received for Chinese Application No. 202080093593.4, mailed on May 10, 2024, 4 pages. [cited by applicant]
Notice of Grant Received for Chinese Application No. 202080099087.6, mailed on Feb. 8, 2025, 9 pages (English Translation Provided). [cited by applicant]
Communication pursuant to Article 94(3) Received in European Patent Application No. 20743462.2, mailed on Dec. 10, 2024, 5 pages. [cited by applicant]
Non-Final Office Action mailed on Dec. 11, 2024, in U.S. Appl. No. 17/914,684, 10 pages. [cited by applicant]
Communication under Rule 71(3) EPC Received for European Application No. 20707880,9, mailed on Mar, 5, 2025, 08 pages. [cited by applicant]
Examination report Received for Indian Application No. 202247046431, mailed on Jun. 2, 2025, 7 pages. [cited by applicant]
Final Office Action mailed on Apr. 14, 2025, in U.S. Appl. No. 17/914,684, 11 pages. [cited by applicant]
Final Office Action mailed on Mar. 25, 2025, in U.S. Appl. No. 17/793,624,10 pages. [cited by applicant]
Notice of Allowance mailed on Apr. 29, 2025, in U.S. Appl. No. 17/790,914, 10 pages. [cited by applicant]
Second Office Action Received for Chinese Application No. 202080099092.7, mailed on May 16, 2025, 15 Pages (English Translation Provided). [cited by applicant]
U.S. Appl. No. 17/790,914, filed Jul. 5, 2022. [cited by applicant]
U.S. Appl. No. 17/793,624, filed Jul. 18, 2022. [cited by applicant]
U.S. Appl. No. 17/914,640, filed Sep. 26, 2022. [cited by applicant]
U.S. Appl. No. 17/914,684, filed Sep. 26, 2022. [cited by applicant]
Communication Under Rule 71(3) EPC, Received in European Patent Application No. 20743462.2, mailed on May 14, 2025, 08 pages. [cited by applicant]
Decision on Rejection Received for Chinese Application No. 202080099092.7, mailed on Sep. 8, 2025, 07 Pages (English Translation Provided). [cited by applicant]
Decision to grant a European patent pursuant to Article 97(1) EPC, Received in European Patent Application No. 20743462.2, mailed on Jul. 31, 2025, 03 pages. [cited by applicant]
Decision to Grant pursuant to Article 97(1) received in European Application No. 20707880.9, mailed on Jul. 3, 2025, 2 pages. [cited by applicant]
Non-Final Office Action mailed on Aug. 22, 2025, in U.S. Appl. No. 17/914,684, 10 Pages. [cited by applicant]
Non-Final Office Action mailed on Jul. 2, 2025, in U.S. Appl. No. 17/793,624, 14 pages. [cited by applicant]
Non-Final Office Action mailed on Jun. 26, 2025 in U.S. Appl. No. 17/914,640, 13 pages. [cited by applicant]
Notice of Allowance mailed on Aug. 26, 2025, in U.S. Appl. No. 17/790,914, 10 pages. [cited by applicant]