IP Library Granted Patent US 12,737,013
Granted Patent B2
US 12,737,013 · App. 17/793,624 · Granted Sep 15, 2026

Computing device hinges

Inventor: Anthony E. Hillyerd (Sammamish, WA)
Assignee: Microsoft Technology Licensing, LLC
G06F1/1681F16C11/045F16M11/10F16M11/2021F16M11/38G06F1/1679E05D11/08E05Y2999/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,737,013
App. No.
17/793,624
Granted
Sep 15, 2026
Kind
B2
Abstract

A hinge of a computing device includes a primary support connecting a display to a stand. As the display rotates about the stand, the primary support slides along a friction strip, which stabilizes the display with respect to the stand. A stabilizer may connect the stand to the base or the stand to the display.

Claims (35)

1 . A computing device, comprising:

a first hinge rotatably connecting a stand to a base, the first hinge having a first coefficient of friction sufficient to maintain a first angular position between the stand and the base; and

a second hinge rotatably connecting the stand to a display, the second hinge having a second coefficient of friction sufficient to maintain a second angular position between the display and the stand;

a primary support including a primary support first end rotationally connected to the display and a primary support second end being slidably connected to the stand;

a stabilizer, including:

an upper member having an upper member first end slidably connected to the stand and an upper member second end;

a lower member; and

a stabilizer connector, the upper member second end and the lower member being connected to the stabilizer connector, and wherein the stabilizer connector is releasably connected to the display in a first configuration and the stabilizer connector releasably connected to the base in a second configuration wherein the first configuration is different from the second configuration.

2 . The computing device of claim 1 , wherein the computing device includes the first configuration in which the display is parallel or approximately parallel to the stand.

3 . The computing device of claim 1 , wherein the computing device includes the second configuration in which the display is non-parallel to the stand.

4 . The computing device of claim 3 , wherein in the second configuration, the display overlaps at least 50% of the base.

5 . The computing device of claim 3 , wherein in the second configuration, the display does not contact the base.

6 . The computing device of claim 3 , wherein in the second configuration, the display overlaps an input device on the base.

7 . The computing device of claim 3 , wherein in the second configuration, the display can withstand a display torque of 1.0 N m while maintaining the second angular position.

8 . The computing device of claim 1 , wherein the second angular position is between 0° and 180°.

9 . A method of manipulating the computing device of claim 1 , comprising:

rotating the display into a first position;

rotating the display into a second position with the second hinge, wherein rotating the display into the second position includes rotating the display about the stand; and

sliding the primary support along a friction strip on the stand.

10 . The method of claim 9 , wherein rotating the display into the second position includes:

disconnecting the stabilizer from the display; and

connecting the stabilizer to the base.

11 . The method of claim 9 , wherein rotating the display into the second position includes rotating the display from the first position to the second position.

12 . The method of claim 9 , wherein, as the display is rotated to the second position, the primary support is slid along the friction strip.

13 . A hinge, comprising:

a primary support including a primary support first end and a primary support second end, the primary support second end being slidably connected to a stand via a first slidable connection at a primary friction strip; and

a stabilizer including:

an upper member having an upper member first end and an upper member second end, wherein the upper member second end is slidably connected to the stand via a second slidable connection, different from the first slidable connection, at a stabilizer friction strip, wherein the first slidable connection is slidable along the stand at the primary friction strip independent of the second slidable connection;

a lower member having a lower member first end and a lower member second end, wherein the lower member second end is rotatably connected to the stand; and

a stabilizer connector, the upper member first end and the lower member first end being connected to the stabilizer connector.

14 . The hinge of claim 13 , wherein, in a first configuration, the stabilizer is connected to a display with the stabilizer connector, and in a second configuration, the stabilizer is connected to a base with the stabilizer connector and the stabilizer connector is not connected to the display.

15 . The hinge of claim 13 , wherein the stabilizer connector is magnetic.

16 . The hinge of claim 13 , wherein the upper member includes an upper member magnet, and the stabilizer friction strip is magnetic, the upper member magnet being magnetically attracted to the stabilizer friction strip.

17 . The hinge of claim 13 , wherein the lower member is connected to a base at a base hinge.

18 . The hinge of claim 13 , wherein the stabilizer connector is releasably connected to one or more of (a) a display in a first configuration or (b) a base in a second configuration.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: HILLYERD, ANTHONY E.
To: MICROSOFT TECHNOLOGY LICENSING, LLC
Reel/Frame 069426/0304 →
Continuity (1)
Related Publication 20230049295A1 · Feb 16, 2023
References Cited (160)
US 5489924A · Shima · 1996 [cited by applicant]
US 5564163A · Lowry et al. · 1996 [cited by applicant]
US 5644469A · Shioya · 1997 [cited by applicant]
US 6266236B1 · Ku et al. · 2001 [cited by applicant]
US 6464195B1 · Hildebrandt · 2002 [cited by applicant]
US 6826043B2 · Chang · 2004 [cited by applicant]
US 7061753B2 · Michoux · 2006 [cited by applicant]
US 7403378B2 · Lo et al. · 2008 [cited by applicant]
US 7478786B2 · Copeland · 2009 [cited by applicant]
US 7742285B2 · Ishikura · 2010 [cited by applicant]
US 8074323B2 · Lin · 2011 [cited by applicant]
US 8253648B2 · Nagai · 2012 [cited by applicant]
US 8908364B2 · Tseng et al. · 2014 [cited by applicant]
US 8914946B2 · Hsu et al. · 2014 [cited by applicant]
US 9107301B2 · Pan · 2015 [cited by applicant]
US 9261906B2 · Arima · 2016 [cited by applicant]
US 9291299B2 · Richard · 2016 [cited by applicant]
US 9405325B2 · Kim · 2016 [cited by applicant]
US 9523226B1 · Lam et al. · 2016 [cited by applicant]
US 9557778B2 · Sung · 2017 [cited by applicant]
US 9644412B2 · Novin · 2017 [cited by applicant]
US 9791674B1 · Topliss · 2017 [cited by examiner]
US 9927844B2 · Park · 2018 [cited by applicant]
US 10025348B2 · Arima · 2018 [cited by applicant]
US 10061360B1 · Magi et al. · 2018 [cited by applicant]
US 10151128B2 · Hatano · 2018 [cited by applicant]
US 10324501B1 · Zimmerman et al. · 2019 [cited by applicant]
US 10407957B1 · Camp et al. · 2019 [cited by applicant]
US 10474203B2 · Tazbaz et al. · 2019 [cited by applicant]
US 10558245B2 · Morrison et al. · 2020 [cited by applicant]
US 10648212B2 · Novin · 2020 [cited by applicant]
US 10761571B1 · Cooper · 2020 [cited by applicant]
US 10852765B2 · Sanchez · 2020 [cited by applicant]
US 10996710B2 · Park · 2021 [cited by applicant]
US 11008789B2 · Hatano · 2021 [cited by applicant]
US 11106249B1 · Zimmerman · 2021 [cited by applicant]
US 11237643B2 · Kulkarni · 2022 [cited by applicant]
US 11507145B2 · Nakamura · 2022 [cited by applicant]
US 11573611B2 · Channaiah · 2023 [cited by applicant]
US 20040021051A1 · Chiu · 2004 [cited by applicant]
US 20050138775A1 · Oakley · 2005 [cited by applicant]
US 20060211457A1 · Otsuka · 2006 [cited by applicant]
US 20060288258A1 · Lo · 2006 [cited by applicant]
US 20070058329A1 · Ledbetter · 2007 [cited by applicant]
US 20070183123A1 · Chuan · 2007 [cited by applicant]
US 20080094792A1 · Chen · 2008 [cited by applicant]
US 20080271288A1 · Senatori · 2008 [cited by applicant]
US 20110312392A1 · Reeves · 2011 [cited by examiner]
US 20120124775A1 · Ceci · 2012 [cited by applicant]
US 20130160244A1 · Sayama · 2013 [cited by examiner]
US 20130318746A1 · Kuramochi · 2013 [cited by applicant]
US 20140026368A1 · Katsuta · 2014 [cited by examiner]
US 20140043736A1 · Onda · 2014 [cited by examiner]
US 20140157546A1 · Ho et al. · 2014 [cited by applicant]
US 20140165334A1 · Liu · 2014 [cited by applicant]
US 20140338483A1 · Hsu et al. · 2014 [cited by applicant]
US 20140375194A1 · Arima · 2014 [cited by applicant]
US 20140375196A1 · Nguyen · 2014 [cited by examiner]
US 20150002998A1 · Arima · 2015 [cited by applicant]
US 20150077915A1 · Saito · 2015 [cited by applicant]
US 20150121654A1 · Novin · 2015 [cited by applicant]
US 20150185786A1 · Yeh et al. · 2015 [cited by applicant]
US 20160147267A1 · Bitz et al. · 2016 [cited by applicant]
US 20170097657A1 · Hampton et al. · 2017 [cited by applicant]
US 20170208703A1 · Lin · 2017 [cited by applicant]
US 20170218672A1 · Novin · 2017 [cited by applicant]
US 20180044958A1 · Tazbaz et al. · 2018 [cited by applicant]
US 20180059735A1 · Tazbaz et al. · 2018 [cited by applicant]
US 20180066465A1 · Tazbaz et al. · 2018 [cited by applicant]
US 20180088634A1 · Bitz · 2018 [cited by applicant]
US 20180112447A1 · Hatano · 2018 [cited by applicant]
US 20180188781A1 · Park, Jr. · 2018 [cited by examiner]
US 20180209473A1 · Park et al. · 2018 [cited by applicant]
US 20190011957A1 · Wendt · 2019 [cited by applicant]
US 20190029135A1 · Park et al. · 2019 [cited by applicant]
US 20190064886A1 · Wendt · 2019 [cited by applicant]
US 20190243426A1 · Morrison et al. · 2019 [cited by applicant]
US 20200040626A1 · Hatano · 2020 [cited by applicant]
US 20200233459A1 · Sanchez · 2020 [cited by applicant]
US 20210289644A1 · Zarnowitz · 2021 [cited by applicant]
US 20220057844A1 · Nakamura · 2022 [cited by applicant]
US 20230034612A1 · Hillyerd · 2023 [cited by applicant]
US 20230049811A1 · Krahn · 2023 [cited by applicant]
US 20230084038A1 · Yee et al. · 2023 [cited by applicant]
US 20230123520A1 · Yee et al. · 2023 [cited by applicant]
US 20230129909A1 · Yee et al. · 2023 [cited by applicant]
US 20240111330A1 · Yu · 2024 [cited by applicant]
US 20240111339A1 · Sun · 2024 [cited by applicant]
CN 201301889Y · 2009 [cited by applicant]
CN 101672322A · 2010 [cited by applicant]
CN 102572029A · 2012 [cited by applicant]
CN 103291163A · 2013 [cited by applicant]
CN 103576772A · 2014 [cited by applicant]
CN 104765412A · 2015 [cited by applicant]
CN 104767843A · 2015 [cited by applicant]
CN 204553526U · 2015 [cited by applicant]
CN 107771308A · 2018 [cited by applicant]
CN 109564449A · 2019 [cited by applicant]
CN 109643144A · 2019 [cited by applicant]
CN 110168470A · 2019 [cited by applicant]
CN 110226149A · 2019 [cited by applicant]
CN 108691470A · 2021 [cited by applicant]
EP 2397929A1 · 2011 [cited by applicant]
EP 2557473A1 · 2013 [cited by applicant]
EP 2615331A1 · 2013 [cited by applicant]
EP 2696255A2 · 2014 [cited by applicant]
EP 2911030A2 · 2015 [cited by applicant]
EP 3069208A1 · 2016 [cited by applicant]
GB 931284A · 1963 [cited by applicant]
WO 2010015931A2 · 2010 [cited by applicant]
WO 2019099171A2 · 2019 [cited by applicant]
Office Action Received for Chinese Application No. 202080092254.4, mailed on Dec. 11, 2023, 11 pages (English Translation Provided). [cited by applicant]
Office Action received for Chinese Application No. 202080092255.9, mailed on Dec. 1, 2023, 16 Pages (English Translation Provided). [cited by applicant]
Office Action Received for Chinese Application No. 202080093593.4, mailed on Dec. 28, 2023, 11 pages. [cited by applicant]
Communication pursuant to Article 94(3) EPC, Received for European Application No. 20720607.9, mailed on Jul. 5, 2024, 8 pages. [cited by applicant]
Communication under Rule 71(3) received in European Application No. 20719884.7, mailed on Jun. 18, 2024, 8 pages. [cited by applicant]
Second Office Action Received for Chinese Application No. 202080092255.9, mailed on May 23, 2024, 11 pages. (English Translation Provided). [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/014025”, Mailed Date: Oct. 9, 2020, 14 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/024692”, Mailed Date: Dec. 11, 2020, 15 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/024700”, Mailed Date: Nov. 23, 2020, 12 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/040030”, Mailed Date: Oct. 9, 2020, 13 Pages. [cited by applicant]
“International Search Report and Written Opinion Issued in PCT Application No. PCT/US20/040031”, Mailed Date: Dec. 2, 2020, 17 Pages. [cited by applicant]
“Invitation To Pay Additional Fees Issued in PCT Application No. PCT/US20/040031”, Mailed Date: Oct. 7, 2020, 10 Pages. [cited by applicant]
First Office Action Received for Chinese Application No. 202080099087.6, mailed on Aug. 17, 2024, 17 pages (English Translation Provided). [cited by applicant]
Non-Final Office Action mailed on Sep. 28, 2024, in U.S. Appl. No. 17/790,914, 09 pages. [cited by applicant]
Non-Final Office Action mailed on Aug. 27, 2024, in U.S. Appl. No. 17/790,926, 9 pages. [cited by applicant]
Office Action Received for Chinese Application No. 202080092254.4, mailed on Aug. 29, 2024, 9 pages. (English Translation Provided). [cited by applicant]
U.S. Appl. No. 17/790,914, filed Jul. 5, 2022. [cited by applicant]
U.S. Appl. No. 17/914,640, filed Sep. 26, 2022. [cited by applicant]
U.S. Appl. No. 17/790,926, filed Jul. 5, 2022. [cited by applicant]
U.S. Appl. No. 17/914,684, filed Sep. 26, 2022. [cited by applicant]
Communication pursuant to Article 94(3) Received in European Patent Application No. 20743462.2, mailed on Dec. 10, 2024, 5 pages. [cited by applicant]
Non-Final Office Action mailed on Dec. 11, 2024, in U.S. Appl. No. 17/914,684, 10 pages. [cited by applicant]
Office Action Received for Chinese Application No. 202080099092.7, mailed on Nov. 21, 2024, 15 Pages (English Translation Provided). [cited by applicant]
Communication pursuant to Article 94(3) Received in European Patent Application No. 20743461.4, mailed on Jan. 16, 2025, 8 pages. [cited by applicant]
Decision on Rejection Received for Chinese Application No. 202080092255.9, mailed on Jan. 13, 2025, 8 pages (English Translation Provided). [cited by applicant]
Decision to Grant pursuant to Article 97(1) Received for European Application No. 20719884.7, mailed on Oct. 24, 2024, 02 pages. [cited by applicant]
Final office action mailed on Jan. 16, 2025, in U.S. Appl. No. 17/790,914, 15 pages. [cited by applicant]
Notice of grant Received for Chinese Application No. 202080093593.4, mailed on May 10, 2024, 4 pages. [cited by applicant]
Notice of Grant Received for Chinese Application No. 202080099087.6, mailed on Feb. 8, 2025, 9 pages (English Translation Provided). [cited by applicant]
Communication Under Rule 71(3) EPC, Received in European Patent Application No. 20743462.2, mailed on May 14, 2025, 08 pages. [cited by applicant]
Examination report Received for Indian Application No. 202247046431, mailed on Jun. 2, 2025, 7 pages. [cited by applicant]
Final Office Action mailed on Apr. 14, 2025, in U.S. Appl. No. 17/914,684, 11 pages. [cited by applicant]
Final Office Action mailed on Mar. 13, 2025, in U.S. Appl. No. 17/790,926, 8 pages. [cited by applicant]
Notice of Allowance mailed on Apr. 29, 2025, in U.S. Appl. No. 17/790,914, 10 pages. [cited by applicant]
Second Office Action Received for Chinese Application No. 202080099092.7, mailed on May 16, 2025, 15 Pages (English Translation Provided). [cited by applicant]
Decision on Rejection Received for Chinese Application No. 202080099092.7, mailed on Sep. 8, 2025, 07 Pages (English Translation Provided). [cited by applicant]
Decision to grant a European patent pursuant to Article 97(1) EPC, Received in European Patent Application No. 20743462.2, mailed on Jul. 31, 2025, 03 pages. [cited by applicant]
Decision to Grant pursuant to Article 97(1) received in European Application No. 20707880.9, mailed on Jul. 3, 2025, 2 pages. [cited by applicant]
Non-Final Office Action mailed on Aug. 22, 2025, in U.S. Appl. No. 17/914,684, 10 Pages. [cited by applicant]
Non-Final Office Action mailed on Jul. 22, 2025, in U.S. Appl. No. 17/790,926, 17 pages. [cited by applicant]
Non-Final Office Action mailed on Jun. 26, 2025 in U.S. Appl. No. 17/914,640, 13 pages. [cited by applicant]
Notice of Allowance mailed on Aug. 26, 2025, in U.S. Appl. No. 17/790,914, 10 pages. [cited by applicant]
Communication under Rule 71(3) Received in European Patent Application No. 19707672.2, mailed on Mar. 24, 2025, 05 pages. [cited by applicant]
Decision to grant 97(1) received in European Application No. 19707672.2, mailed on Aug. 7, 2025, 2 Pages. [cited by applicant]
Notice of Allowance mailed on Jan. 7, 2026, in U.S. Appl. No. 17/914,684, 09 pages. [cited by applicant]
Notice of Allowance mailed on Nov. 19, 2025, in U.S. Appl. No. 17/790,926, 12 pages. [cited by applicant]
Office Action Issued in European Patent Application No. 19707672.2 mailed on Jan. 4, 2023. [cited by applicant]
First Examination report Received for Indian Application No. 202247041584, mailed on Jun. 11, 2026, 07 pages. [cited by applicant]
U.S. Appl. No. 17/790,926 filed 2022-07-05. [cited by applicant]