Memory device and method of fabricating memory device including a test circuit
A memory device which including a memory chip that includes a memory cell array connected to word lines and bit lines, a test circuit connected to the word lines and the bit lines, and a first bonding metal pattern connected to the word lines and the bit lines, and a peripheral circuit chip that includes a peripheral circuit and a second bonding metal pattern. The test circuit performs a test process on the memory cell array, and the memory chip and the peripheral circuit chip are connected in a bonding method for electrically connecting the first bonding metal pattern and the second bonding metal pattern.
1 . A memory device comprising:
a memory chip including:
a memory cell array connected to word lines and bit lines;
a test circuit connected to the word lines and the bit lines, the test circuit being disposed in a test circuit region that surrounds the memory cell array; and
a first bonding metal pattern connected to the word lines and the bit lines; and
a bit line connection line contacting upper surfaces of the bit lines and extending into the test circuit region, and
a peripheral circuit chip including a peripheral circuit and a second bonding metal pattern,
wherein the test circuit is configured to perform a test process on the memory cell array, and
wherein the memory chip and the peripheral circuit chip are connected in a bonding method for electrically connecting the first bonding metal pattern and the second bonding metal pattern.
2 . The memory device of claim 1 , wherein the bonding method is a Cu—Cu bonding method.
3 . The memory device of claim 1 ,
wherein the test circuit includes:
a first state buffer connected to the word lines; and
a second state buffer connected to the bit lines, and
wherein the test circuit performs the test process on the memory cell array before bonding the peripheral circuit chip and the memory chip together.
4 . The memory device of claim 3 , wherein the test process includes an electrical die sorting (EDS) process.
5 . The memory device of claim 3 , wherein the test circuit includes:
a test pad configured to receive a control signal from an external test device; and
a test controller configured to generate a test control signal based on the control signal received from the test pad.
6 . The memory device of claim 5 ,
wherein the test circuit further includes:
a test address generator configured to generate a test row address; and
a test row decoder configured to select one of the word lines based on the test row address, and
wherein the test circuit is configured to perform the test process on memory cells corresponding to the one of the word lines selected by the test row decoder.
7 . The memory device of claim 5 ,
wherein the test control signal includes a test pattern generation signal and test reference data,
wherein the test circuit further includes:
a test pattern generator configured to generate test pattern data based on the test pattern generation signal;
a data buffer configured to provide the test pattern data to the memory cell array and to receive test data from the memory cell array; and
a comparator configured to compare the test reference data and the test data and to generate a comparison result, and
wherein the test controller is configured to determine whether the memory cells of the memory cell array are defective, based on the comparison result.
8 . The memory device of claim 1 ,
wherein the memory cell array includes a three-dimensional cell array including a plurality of memory blocks, and
wherein each of the plurality of memory blocks includes a plurality of vertical NAND strings.
9 . The memory device of claim 8 , wherein the peripheral circuit includes:
a control logic circuit configured to generate a row address;
a row decoder configured to select one of the word lines of the memory cell array based on the row address; and
a page buffer connected to the memory cell array through the bit lines.
10 . The memory device of claim 1 , wherein an operating voltage of the test circuit is smaller than an operating voltage of the peripheral circuit.
11 . A memory chip includes:
a cell array placement region in which a memory cell array including word lines and bit lines is disposed;
a test circuit region surrounding the cell array placement region and in which is disposed, a test circuit configured to perform a test process on the memory cell array; and
a bit line connection line provided on the bit lines and contacting upper surfaces of the bit lines,
wherein the test circuit is electrically connected to the bit lines through the bit line connection line, and
wherein the bit line connection line is configured to extend from the cell array placement region into at least a portion of the test circuit region.
12 . The memory chip of claim 11 , wherein a test pad configured to receive a control signal for performing the test process from an external test device.
13 . The memory chip of claim 12 , wherein the test circuit includes:
a test controller configured to generate a test control signal based on the control signal received from the test pad.
14 . The memory chip of claim 13 ,
wherein the test circuit includes:
a test address generator configured to generate a test row address; and
a test row decoder configured to select one of the word lines based on the test row address, and
wherein the test circuit is configured to perform the test process on memory cells of the memory cell array corresponding to the one of the word lines selected by the test row decoder.
15 . The memory chip of claim 11 ,
wherein the memory cell array includes a three-dimensional cell array including a plurality of memory blocks, and
wherein each of the plurality of memory blocks includes a plurality of vertical NAND strings.
16 . A method of fabricating a memory device, the method comprising:
fabricating a memory chip including a memory cell array and a test circuit;
fabricating a peripheral circuit chip including a peripheral circuit;
performing a test process on the memory cell array; and
when the memory chip passes the test process, bonding the peripheral circuit chip and the memory chip together to fabricate the memory device,
wherein the memory cell array is a three-dimensional memory cell array.
17 . The method of claim 16 , wherein the test process includes an electrical die sorting (EDS) process.
18 . The method of claim 16 , wherein the test circuit is configured to perform the test process on the memory cell array.
19 . The method of claim 18 , wherein the test circuit includes:
a test pad configured to receive a control signal from an external test device; and
a test controller configured to generate a test control signal based on the control signal received from the test pad.
20 . The method of claim 19 ,
wherein the memory cell array includes word lines,
wherein the test circuit further includes:
a test address generator configured to generate a test row address; and
a test row decoder configured to select one of the word lines based on the test row address, and
wherein the test circuit is configured to perform the test process on memory cells corresponding to the one of the word lines selected by the test row decoder.