IP Library Granted Patent US 12,580,672
Granted Patent B2
US 12,580,672 · App. 18/115,916 · Granted Mar 17, 2026

Photonic integrated circuit and opto-electronic system comprising the same

Inventors: Niall Patrick Kelly (Eindhoven, NL); Tim Koene (Utrecht, NL); Emil Kleijn (Son en Breugel, NL)
Assignee: EFFECT PHOTONICS B.V.
H04J14/0204H04J14/0282H04B10/60H04B10/61H04B10/614H04B10/615H04B10/6151
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Quick Facts
Patent No.
US 12,580,672
App. No.
18/115,916
Granted
Mar 17, 2026
Kind
B2
Abstract

A PIC having at least three fiber-to-chip coupling locations, an InP-based polarization handling unit, at least two optical splitter-combiners, at least two optical receivers, and a plurality of semiconductor-based optical waveguides. The plurality of semiconductor-based optical waveguides are configured and arranged to optically connect a first fiber-to-chip coupling location with a first optical receiver via a first optical splitter-combiner, a second fiber-to-chip coupling location with the at least two optical receivers via the InP-based polarization handling unit and the at least two optical splitter-combiners, and a third fiber-to-chip coupling location with a second optical receiver via a second optical splitter-combiner. An opto-electronic system including said PIC.

Claims (72)

1 . A photonic integrated circuit, PIC, comprising:

at least three fiber-to-chip coupling locations;

an InP-based polarization handling unit;

at least two optical splitter-combiners;

at least two optical receivers; and

a plurality of semiconductor-based optical waveguides;

wherein the plurality of semiconductor-based optical waveguides are configured and arranged to optically connect:

a first fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with a first optical receiver of the at least two optical receivers via a first optical splitter-combiner of the at least two optical splitter-combiners;

a second fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the at least two optical receivers via the InP-based polarization handling unit and the at least two optical splitter-combiners; and

a third fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with a second optical receiver of the at least two optical receivers via a second optical splitter-combiner of the at least two optical splitter-combiners; and

wherein the first optical receiver of the at least two optical receivers has a first optical input port;

the second optical receiver of the at least two optical receivers has a second optical input port;

the first optical splitter-combiner has;

a first end part that is provided with at least a first optical interface and a second optical interface; and

a second end part that is provided with at least a third optical interface;

the second optical splitter-combiner has:

a third end part that is provided with at least a fourth optical interface and a fifth optical interface; and

a fourth end part that is provided with at least a sixth optical interface;

the InP-based polarization handling unit comprises a combined InP-based polarization splitter and rotator device having a third optical input port, a first optical output port and a second optical output port; and

the plurality of semiconductor-based optical waveguides comprises:

a first semiconductor-based optical waveguide that is arranged to optically connect the first fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the first optical interface of the first optical splitter-combiner;

a second semiconductor-based optical waveguide that is arranged to optically connect the second fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the third optical input port of the combined InP-based polarization splitter and rotator device;

a third semiconductor-based optical waveguide that is arranged to optically connect the third fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the fourth optical interface of the second optical splitter-combiner;

a fourth semiconductor-based optical waveguide that is arranged to optically connect the first optical output port of the combined InP-based polarization splitter and rotator device with the second optical interface of the first optical splitter-combiner:

a fifth semiconductor-based optical waveguide that is arranged to optically connect the second optical output port of the combined InP-based polarization splitter and rotator device with the fifth optical interface of the second optical splitter-combiner;

a sixth semiconductor-based optical waveguide that is arranged to optically connect the third optical interface of the first optical splitter-combiner with the first optical input port of the first optical receiver; and

a seventh semiconductor-based optical waveguide that is arranged to optically connect the sixth optical interface of the second optical splitter-combiner with the second optical input port of the second optical receiver.

2 . The PIC according to claim 1 , wherein the at least two optical receivers are:

coherent optical receivers; or

configured to recover information from an optical signal that is encoded using amplitude modulation.

3 . The PIC according to claim 1 , wherein at least the first fiber-to-chip coupling location and the third fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations are arranged apart at a distance, D, that is in a range from 20 μm to 1000 μm.

4 . The PIC according to claim 1 , wherein at least the first fiber-to-chip coupling location and the third fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations are arranged apart at a distance, D, that is in a range from 250 μm to 500 μm.

5 . The PIC according to claim 1 , wherein the at least three fiber-to-chip coupling locations are arranged at a same facet of the PIC.

6 . The PIC according to claim 1 , wherein at least one of the at least two optical splitter-combiners is a thermally tunable optical splitter-combiner or an electro-optically tunable optical splitter-combiner.

7 . The PIC according to claim 1 , wherein at least one of the at least two optical splitter-combiners is a multimode interference-based, MMI-based coupler.

8 . The PIC according to claim 7 , wherein the MMI-based coupler is a thermally tunable MMI-based coupler or an electro-optically tunable MMI-based coupler.

9 . The PIC according to claim 8 , wherein the MMI-based coupler is configured and arranged to be an asymmetric MMI-based coupler.

10 . The PIC according to claim 7 , wherein the MMI-based coupler is configured and arranged to be an asymmetric MMI-based coupler.

11 . The PIC according to claim 1 , wherein at least one of the first semiconductor-based optical waveguide at the first fiber-to-chip coupling location, the second semiconductor-based optical waveguide at the second fiber-to-chip coupling location, and the third semiconductor-based optical waveguide at the third fiber-to-chip coupling location is provided with a tapered section.

12 . The PIC according to claim 1 , wherein at least one of the at least two optical receivers, the at least two optical splitter-combiners, and the plurality of semiconductor-based optical waveguides comprise InP-based semiconductor material.

13 . The PIC according to claim 1 , wherein the PIC is a hybrid PIC or an InP-based monolithic PIC.

14 . An opto-electronic system comprising a PIC according to claim 1 .

15 . A photonic integrated circuit, PIC, comprising:

at least three fiber-to-chip coupling locations;

an InP-based polarization handling unit;

at least two optical splitter-combiners;

at least two optical receivers; and

a plurality of semiconductor-based optical waveguides;

wherein the plurality of semiconductor-based optical waveguides are configured and arranged to optically connect:

a first fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with a first optical receiver of the at least two optical receivers via a first optical splitter-combiner of the at least two optical splitter-combiners;

a second fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the at least two optical receivers via the InP-based polarization handling unit and the at least two optical splitter-combiners; and

a third fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with a second optical receiver of the at least two optical receivers via a second optical splitter-combiner of the at least two optical splitter-combiners; and wherein:

the first optical receiver of the at least two optical receivers has a first optical input port;

the second optical receiver of the at least two optical receivers has a second optical input port;

the first optical splitter-combiner has:

a first end part that is provided with at least a first optical interface and a second optical interface; and

a second end part that is provided with at least a third optical interface;

the second optical splitter-combiner has:

a third end part that is provided with at least a fourth optical interface and a fifth optical interface; and

a fourth end part that is provided with at least a sixth optical interface;

the InP-based polarization handling unit comprises:

an InP-based polarization splitter having a fourth optical input port, a third optical output port, and a fourth optical output port; and

an InP-based polarization rotator having a fifth optical input port and a fifth optical output port; and

the plurality of semiconductor-based optical waveguides comprises:

a first semiconductor-based optical waveguide that is arranged to optically connect the first fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the first optical interface of the first optical splitter-combiner;

a second semiconductor-based optical waveguide that is arranged to optically connect the second fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the fourth optical input port of the InP-based polarization splitter;

a third semiconductor-based optical waveguide that is arranged to optically connect the third fiber-to-chip coupling location of the at least three fiber-to-chip coupling locations with the fourth optical interface of the second optical splitter-combiner;

a fourth semiconductor-based optical waveguide that is arranged to optically connect the third optical output port of the InP-based polarization splitter with the fifth optical input port of the InP-based polarization rotator;

a fifth semiconductor-based optical waveguide that is arranged to optically connect the fourth optical output port of the InP-based polarization splitter with the fifth optical interface of the second optical splitter-combiner;

a sixth semiconductor-based optical waveguide that is arranged to optically connect the fifth optical output port of the InP-based polarization rotator with the second optical interface of the first optical splitter-combiner;

a seventh semiconductor-based optical waveguide that is arranged to optically connect the third optical interface of the first splitter-combiner with the first optical input port of the first optical receiver; and

an eighth semiconductor-based optical waveguide that is arranged to optically connect the sixth optical interface of the second optical splitter-combiner with the second optical input port of the second optical receiver.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2023
From: KELLY, NIALL PATRICK; KOENE, TIM; KLEIJN, EMIL
To: EFFECT PHOTONICS B.V.
Reel/Frame 062999/0102 →
Priority Claims (1)
EP 22160056 · Mar 3, 2022 · regional
Continuity (1)
Related Publication 20230283394A1 · Sep 7, 2023
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