Circuit system and method of manufacturing a printed circuit board
A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area of the cutout. A method of manufacturing a printed circuit board includes forming a cutout in the printed circuit board, the cutout having an area less than a footprint of an integrated circuit package, mounting the integrated circuit package over the cutout on a first side of the printed circuit board, coupling a power regulator to power terminals of the integrated circuit package through the cutout, and interfacing the power regulator to a power plane of the printed circuit board by way of a shelf region extending beyond the area of the cutout on a second side of the printed circuit board.
1 . A circuit system comprising:
an integrated circuit package mounted on a first side of a printed circuit board;
a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board; and
wherein the power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area within the cutout occupied by the power regulator.
2 . The circuit system of claim 1 , wherein the integrated circuit package is mounted on top of the printed circuit board and the power regulator is mounted under the integrated circuit package.
3 . The circuit system of claim 2 , further comprising a heat sink shared by the integrated circuit package and the power regulator.
4 . The circuit system of claim 1 , wherein the connections on the shelf region comprise a ball grid array.
5 . The circuit system of claim 1 , wherein the cutout is smaller than a footprint of the integrated circuit package and the power terminals are located in a central region of the integrated circuit package.
6 . The circuit system of claim 5 , wherein the power regulator is connected to the power terminals of the central region via a ball grid array.
7 . The circuit system of claim 5 , wherein the power regulator is connected to the power terminals of the central region via spring pins.
8 . A circuit system comprising:
a graphics processing unit mounted on a first side of a printed circuit board;
a power regulator connected to power terminals of the graphics processing unit through a cutout in the printed circuit board; and
the power regulator coupled to a power plane of the printed circuit board via a shelf region of the power regulator on an underside of the printed circuit board.
9 . The circuit system of claim 8 , wherein the integrated circuit package is mounted on top of the printed circuit board and the power regulator is mounted under the integrated circuit package.
10 . The circuit system of claim 9 , further comprising a heat sink shared by the integrated circuit package and the power regulator.
11 . The circuit system of claim 8 , wherein connections on the shelf region comprise a ball grid array.
12 . The circuit system of claim 8 , wherein the cutout is smaller than a footprint of the integrated circuit package and the power regulator is interfaced to a central region of the integrated circuit package comprising the power terminals.
13 . The circuit system of claim 12 , wherein the power regulator is coupled to the power terminals of the central region via a ball grid array.
14 . The circuit system of claim 12 , wherein the power regulator is coupled to power terminals of the central region via spring pins.
15 . The circuit system of claim 14 , wherein the spring pins are part of the power regulator.
16 . The circuit system of claim 14 , wherein the spring pins are part of the integrated circuit package.
17 . A method of manufacturing a printed circuit board, the method comprising:
forming a cutout in the printed circuit board, the cutout having an area less than a footprint of an integrated circuit package;
mounting the integrated circuit package over the cutout on a first side of the printed circuit board;
coupling a power regulator to power terminals of the integrated circuit package through the cutout; and
interfacing the power regulator to a power plane of the printed circuit board by way of a shelf region extending beyond the area of the cutout on a second side of the printed circuit board.
18 . The method of claim 17 , wherein terminals on the shelf region comprise a ball grid array.
19 . The method of claim 17 , wherein the integrated circuit package and the power regulator are centered on the cutout.
20 . The method of claim 19 , wherein the power terminals of the integrated circuit package are located in the area of the cutout.