Substrate processing apparatus and a method of processing a substrate using the same
A substrate processing apparatus includes an outer bath, an inner bath in the outer bath, a chemical solution supply pipe in fluid communication with a portion of the outer bath, and an outer gas supply pipe in fluid communication with another portion of the outer bath. The outer bath includes an outer body providing an outer receiving space, and an outer door coupled to the outer body and configured to close the outer receiving space. An end of the outer gas supply pipe is located in the outer receiving space between the outer body and the inner bath, and a portion of the chemical solution supply pipe is located in the inner bath.
1 . A substrate processing apparatus comprising:
an outer bath;
an inner bath in the outer bath;
a chemical solution supply pipe extending into a portion of the outer bath;
an outer gas supply pipe in fluid communication with the outer bath,
a gas supply unit configured to supply a gas into the outer gas supply pipe,
a pressure measuring unit comprising a pressure sensor,
a control unit configured to control the gas supply unit,
wherein the outer bath comprises:
an outer body defining an outer receiving space, wherein the pressure sensor is in the outer receiving space; and
an outer door coupled to the outer body and configured to cover the outer receiving space,
wherein an end of the outer gas supply pipe is configured to supply gas to the outer receiving space between the outer body and the inner bath, and
wherein the chemical solution supply pipe is configured to supply a chemical solution to the inner bath,
wherein the control unit is configured to receive data from the pressure measuring unit and to control the gas supply unit to thereby adjust a pressure of the outer receiving space.
2 . The substrate processing apparatus of claim 1 , wherein the chemical solution supply pipe extends into a portion of the outer body, and
wherein the outer gas supply pipe extends into another portion of the outer body.
3 . The substrate processing apparatus of claim 2 , wherein the outer body comprises:
a lower body of which a top end is opened; and
a top plate member coupled onto the lower body,
wherein the top plate member provides a substrate insertion opening on the top plate member,
wherein the outer door is configured to close the substrate insertion opening to seal the outer receiving space, and
wherein each of the chemical solution supply pipe and the outer gas supply pipe vertically extends through the top plate member.
4 . The substrate processing apparatus of claim 2 , further comprising:
a chemical solution circulation unit configured to supply a chemical solution into the chemical solution supply pipe,
wherein the chemical solution supply pipe comprises:
an outer chemical solution pipe connected to the chemical solution circulation unit; and
a chemical solution fitting pipe coupled to the outer body,
wherein the outer chemical solution pipe is fixed to the outer body through the chemical solution fitting pipe.
5 . The substrate processing apparatus of claim 1 , wherein the chemical solution supply pipe comprises:
an inner chemical solution pipe located below the outer door and extending vertically; and
a chemical solution jet pipe coupled to a bottom end of the inner chemical solution pipe and horizontally extending in the inner bath,
wherein the chemical solution jet pipe provides a nozzle hole, and
wherein a chemical solution flow path in the chemical solution jet pipe is connected to an inner space of the inner bath through the nozzle hole.
6 . The substrate processing apparatus of claim 5 , further comprising:
an inner gas supply pipe extending in the outer bath,
wherein the inner gas supply pipe comprises:
a gas connection pipe of which at least a portion is located in the inner bath and which extends vertically; and
a gas jet pipe which is coupled to a bottom end of the gas connection pipe and extends horizontally,
wherein the gas jet pipe is located below the chemical solution jet pipe.
7 . The substrate processing apparatus of claim 1 , wherein:
the pressure sensor is between the outer body and the inner bath,
wherein a level of a top end of the inner bath is lower than a level of a bottom end of the outer door, and
wherein the top end of the inner bath is opened such that an inner space of the inner bath is connected to the outer receiving space.
8 . A substrate processing apparatus comprising:
an outer bath;
an inner bath in the outer bath;
an outer gas supply pipe configured to supply a gas to an outer receiving space between the outer bath and the inner bath;
a gas supply unit configured to supply the gas into the outer gas supply pipe;
a pressure measuring unit comprising a pressure sensor; and
a control unit configured to control gas supply unit;
wherein the outer bath comprises:
an outer body providing the outer receiving space; and
an outer door coupled to the outer body and configured to cover the outer receiving space;
wherein the outer gas supply pipe comprises:
a first outer gas pipe connected to the gas supply unit; and
an outer gas fitting pipe coupled to the outer body;
wherein the first outer gas pipe is fixed to the outer body through the outer gas fitting pipe;
wherein the control unit is configured to receive data from the pressure measuring unit and to control the gas supply unit to thereby adjust a pressure of the outer receiving space.
9 . The substrate processing apparatus of claim 8 , wherein the outer body comprises:
a lower body of which a top end is opened; and
a top plate member coupled onto the lower body,
wherein the top plate member provides a substrate insertion hole on the top plate member, and
wherein the outer door is configured to seal the substrate insertion hole to separate the outer receiving space from an space outside the outer body.
10 . The substrate processing apparatus of claim 9 , further comprising:
a chemical solution supply pipe configured to supply a chemical solution into the inner bath,
wherein the chemical solution supply pipe comprises:
an outer chemical solution pipe located above the top plate member;
a chemical solution fitting pipe extending into the top plate member and coupled to the top plate member;
an inner chemical solution pipe located below the top plate member and extending vertically; and
a chemical solution jet pipe coupled to a bottom end of the inner chemical solution pipe and extending horizontally,
wherein the chemical solution jet pipe provides a nozzle hole, and
wherein the nozzle hole connects a flow path in the chemical solution jet pipe to an inner space of the inner bath.
11 . The substrate processing apparatus of claim 8 , wherein the outer gas supply pipe further comprises: a flow control unit on the first outer gas pipe.
12 . The substrate processing apparatus of claim 8 , further comprising:
a gas exhaust pipe coupled to the outer body and connected to the outer receiving space between the outer bath and the inner bath.
13 . The substrate processing apparatus of claim 8 , wherein:
the pressure sensor is located in the outer receiving space between the outer bath and the inner bath.
14 . The substrate processing apparatus of claim 8 , wherein the outer door provides a supporting arm insertion hole vertically extending into the outer door.