Granted Patent B2

US 12,581,900 · App. 18/141,909 · Granted Mar 17, 2026

Inventors: Bhaskar Prasad (Jamshedpur, IN); Kirankumar Neelasandra Savandaiah (Bangalore, IN); Thomas Brezoczky (Los Gatos, CA); Lakshmikanth Krishnamurthy Shirahatti (Bangalore, IN)

Assignee: Applied Materials, Inc.

H01L21/67709H01J37/32733H01L21/67201H01L21/677H01L21/67706H01L21/67712H01L21/6773H01L21/67742H01L21/67748H01L21/6838H01L21/68742H01L21/68785

Abstract

Claims (46)

1 . A substrate process station, comprising:

a housing including a transport region and a process region;

a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier, the magnetic levitation assembly including a track segment including rails disposed in the transport region and below the process region, wherein the rails each include a plurality of magnets; and

a pedestal assembly comprising a pedestal disposed within the housing,

wherein the pedestal is moveable between a pedestal transfer position and a process position,

wherein when the pedestal is in the pedestal transfer position, the pedestal is disposed between the rails in the transport region to receive a substrate from the substrate carrier, and

wherein when the pedestal is in the process position, the pedestal is raised from the pedestal transfer position to lift the substrate into the process region and to isolate the process region from the transport region.

2 . The substrate process station of claim 1 , wherein the track segment comprises a first track segment, the rails comprise first rails, and the plurality of magnets comprise a first plurality of magnets, wherein the magnetic levitation assembly further includes a second track segment separated from the first track segment by a gap, wherein the second track segment includes second rails, and wherein the second rails each include a second plurality of magnets.

3 . The substrate process station of claim 2 , further comprising a slit valve configured to close across the gap to bifurcate the transport region.

4 . The substrate process station of claim 2 , further comprising:

a controller configured to operate the first plurality of magnets in the first track segment and the second plurality of magnets in the second track segment to move the substrate carrier disposed in the transport region between a carrier transfer position above the first track segment and a park position above the second track segment.

5 . The substrate process station of claim 4 , wherein the pedestal assembly further comprises one or more lift pins, and wherein the controller is further configured to raise the one or more of the lift pins to disengage the substrate from a supporting surface of the substrate carrier and to lower the one or more lift pins to place the substrate onto a surface of the pedestal.

6 . The substrate process station of claim 1 , further comprising a source assembly that is configured to process the substrate disposed in the process region when the pedestal is in the process position, wherein the process may be at least one of chemical vapor deposition, plasma enhanced chemical vapor deposition, atomic layer deposition, plasma enhanced atomic layer deposition, etch, lithography, ion implantation, ashing, cleaning, a thermal process, or a degas.

7 . The substrate process station of claim 1 , wherein the rails comprise first rails, wherein the track segment includes second rails disposed below the first rails, and wherein the magnetic levitation assembly is configured to levitate and propel the carrier between the first rails and the second rails.

8 . The substrate process station of claim 7 , wherein the substrate is disposed in an opening formed in the carrier and engaged with one or more engagement members protruding from a surface of the carrier.

9 . The substrate process station of claim 1 , wherein the plurality of magnets includes electromagnets.

10 . A substrate process station, comprising:

a housing including a transport region and a process region;

a magnetic levitation assembly disposed in the transport region configured to levitate and propel a carrier, the magnetic levitation assembly including a track segment including rails disposed in the transport region and below the process region, wherein the rails each include a plurality of magnets; and

a pedestal assembly comprising a pedestal disposed within the housing,

wherein the pedestal is moveable between a pedestal transfer position and a process position,

wherein when the pedestal is in the pedestal transfer position, the pedestal is disposed between the rails to receive an object from the carrier, and

wherein when the pedestal is in the process position, the pedestal is raised from the pedestal transfer position to isolate the process region from the transport region.

11 . The substrate process station of claim 10 , wherein the track segment comprises a first track segment, the rails comprise first rails, and the plurality of magnets comprise a first plurality of magnets, wherein the magnetic levitation assembly further includes a second track segment separated from the first track segment by a gap, wherein the second track segment includes second rails, and where the second rails each include a second plurality of magnets.

12 . The substrate process station of claim 11 , further comprising:

a controller configured to operate the first plurality of magnets in the first track segment and the second plurality of magnets in the second track segment to move the carrier disposed in the transport region between a carrier transfer position above the first track segment and a park position above the second track segment.

13 . The substrate process station of claim 10 , wherein the object is a substrate.

14 . The substrate process station of claim 10 , wherein the rails comprise first rails, wherein the track segment includes second rails disposed below the first rails, and wherein the magnetic levitation assembly is configured to levitate and propel the carrier between the first rails and the second rails.

15 . The substrate process station of claim 14 , wherein the object is disposed in an opening formed in the carrier and engaged with one or more engagement members protruding from a surface of the carrier.

16 . A method of transferring an object within the substrate process station of claim 10 , the method comprising:

moving the carrier, with the object disposed thereon, by use of the magnetic levitation assembly to a carrier transfer position within the substrate process station to position the object above the pedestal;

moving the pedestal from a first position to the pedestal transfer position beneath the object;

extending lift pins to raise the object from a supporting surface of the carrier;

moving the carrier to a park position within the substrate process station by use of the magnetic levitation assembly;

retracting the lift pins to lower the object onto a supporting surface of the pedestal; and

moving the pedestal from the pedestal transfer position to the process position.

17 . The method of claim 16 , further comprising:

moving the pedestal from the process position to the pedestal transfer position; and

extending the lift pins to raise the object from the supporting surface of the pedestal.

18 . The method of claim 17 , further comprising:

moving the carrier from the park position to the carrier transfer position, by use of the magnetic levitation assembly, such that the supporting surface of the carrier is beneath the object.

19 . The method of claim 18 , further comprising:

retracting the lift pins to engage the object with the supporting surface of the carrier; and

moving the pedestal to the first position; and

conveying the carrier with the object disposed thereon out of the process station by use of the magnetic levitation assembly.

20 . The method of claim 16 , wherein the lift pins are second lift pins disposed around first lift pins of the pedestal, and wherein the object is a deposition ring.

Assignments (1)

Continuity (2)

References Cited (136)