Multilayer body composed of cured organopolysiloxane films, use of same, and method for producing same
A laminate body is provided, in which two or more organopolysiloxane cured films are obtained by curing curable organopolysiloxane compositions having different compositions because, e.g., the functions required for a dielectric layer and electrode layer are different. In general, problems such as peeling and defects due to insufficient adhesive strength and trackability do not easily occur at an interface between the cured films forming the laminate body. Applications and methods are also provided. The laminate body comprises a structure with two or more laminated organopolysiloxane cured films with different compositions. At least a portion of functional groups involved in the curing reaction are the same. The laminated cured films have structures chemically bonded at an interface thereof. Typically, the compositions both contain a hydrosilylation reactive group, and a SiH/Vi ratio in the compositions differ, with the laminated cured films having structures chemically bonded by hydrosilylation reactions at an interface thereof.
1 . A laminate body, comprising a structure with two or more laminated organopolysiloxane cured films obtained by curing curable organopolysiloxane compositions with different compositions where at least a portion of functional groups involved in the curing reaction are the same, wherein the laminated organopolysiloxane cured films have structures chemically bonded at an interface thereof: wherein the curable organopolysiloxane compositions, which are cured to provide an organopolysiloxane cured film, at least contain:
(A) an organopolysiloxane with a curing reactive group having at least two carboncarbon double bonds in one molecule;
(B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule, in (in an amount within a range in which the amount of silicon atom-bonded hydrogen atoms in this component is 0.5 to 2.5 mol per 1 mol of the total amount of carbon-carbon double bonds in the composition; and component); and
(C) an effective amount of a hydrosilylation reaction catalyst;
wherein the laminated organopolysiloxane cured films have structures chemically bonded at an interface thereof by a hydrosilylation reaction between the aforementioned component (A) and component (B);
wherein one of the organopolysiloxane cured films contains electrically conductive microparticles, in which the substance amount [SiH/Vi] Elec of silicon atom-bonded hydrogen atoms in an organohydrogenpolysiloxane component is 0.5 mols or more to 1.0 mol or less per 1 mol of the total amount of carbon-carbon double bonds in the composition;
wherein the other of the organopolysiloxane cured films is a dielectric layer and does not contain electrically conductive microparticles, and the substance amount [SiH/Vi] DEAP of silicon atom-bonded hydrogen atoms in an organohydrogenpolysiloxane component per 1 mol of carbon-carbon double bonds in the composition is more than 1.0 mol to 2.0 mol; and
wherein the value of [SiH/ViJriec/[SiH/Vi]pEap is within a range of 0.33 to 0.85.
2 . The laminate body according to claim 1 , wherein at least one of the laminated organopolysiloxane cured films has a volume resistivity of 10 2 Ω·cm or less.
3 . The laminate body according to claim 1 , wherein at least one of the laminated organopolysiloxane cured films has a shear storage modulus (G′) at 120° C. within a range of 5.0×10 4 to 1.5×10 5 Pa.
4 . The laminate body according to claim 1 , wherein at least one of the laminated organopolysiloxane cured films contains electrically conductive microparticles.
5 . The laminate body according to claim 4 , wherein the electrically conductive microparticles contain at least one type of electrically conductive carbon selected from electrically conductive carbon black, graphite, and vapor phase grown carbon (VGCF).
6 . The laminate body according to claim 1 , wherein at least one of the laminated organopolysiloxane cured films is an electrode layer, and the other is a dielectric layer.
7 . The laminate body according to claim 1 , wherein the laminated organopolysiloxane cured films are organopolysiloxane cured films obtained by curing curable organopolysiloxane compositions with mutually different compositions,
one of the organopolysiloxane cured films is a cured film obtained by curing (I) a curable organopolysiloxane composition in which silicon atom-bonded hydrogen atoms in an organohydrogenpolysiloxane component are more than 1.0 mol and 2.0 mols or less per 1 mol of the total amount of carbon-carbon double bonds in the composition, and
the other of the organopolysiloxane cured films is a cured film obtained by curing (II) a curable organopolysiloxane composition in which silicon atom-bonded hydrogen atoms in an organohydrogenpolysiloxane component are 0.5 mols or more and 1.0 mol or less per 1 mol of carbon-carbon double bonds in the composition.
8 . The laminate body according to claim 6 , wherein the organopolysiloxane cured film serving as the electrode layer is laminated on at least one surface of the organopolysiloxane cured film serving as the dielectric layer, and the laminated organopolysiloxane cured films have structures chemically bonded at an interface thereof.
9 . A transducer member, comprising the laminate body according to claim 1 .
10 . A transducer, comprising the laminate body according to claim 1 .
11 . An electronic component or display device, comprising the laminate body according to claim 1 .
12 . A method of manufacturing the laminate body according to claim 1 , comprising:
step I: curing one type of curable organopolysiloxane composition of two or more curable organopolysiloxane compositions with different compositions, in which at least a portion of functional groups involved in a curing reaction are the same into a film shape to obtain an organopolysiloxane cured film; and
step II: coating a curable organopolysiloxane composition different from step I into a film shape onto the organopolysiloxane cured film of step I or a precursor thereof at the same time as step I or after step I and then advancing a curing reaction to laminate a different organopolysiloxane cured film on the organopolysiloxane cured film of step I.
13 . The method of manufacturing the laminate body according to claim 12 , wherein the organopolysiloxane cured film of step I is a dielectric layer and the organopolysiloxane cured film of step II is an electrode layer.
14 . The method of manufacturing the laminate body according to claim 12 , wherein step II includes a step of coating a curable organopolysiloxane composition different from step I into a film shape, further laminating another organopolysiloxane cured film or precursor thereof, in a condition with a coating layer of the curable organopolysiloxane composition in an uncured or semi-cured state, onto the coating layer, optionally repeating the same step two or more times to form a laminated body in which one or more coating layer of the uncured or semi-cured curable organopolysiloxane composition is laminated with the organopolysiloxane cured film or precursor thereof, and then completely advancing the curing reaction on the coating layer of the curable organopolysiloxane composition different from step I to laminate a different organopolysiloxane cured film on the organopolysiloxane cured film of step I.
15 . A method of forming an electrode layer in a transducer member, comprising the method of manufacturing the laminate body according to claim 12 .