Semiconductor device
According to one embodiment, a semiconductor device includes: first, second, and third lead frames; a first transistor which is GaN transistor provided on the first lead frame and electrically connected to the first lead frame; a second transistor which is GaN transistor provided on the second lead frame and electrically connected to the third lead frame; a third transistor which is MOS transistor provided on the third lead frame and electrically connected to the third lead frame and the first transistor; a fourth transistor which is MOS transistor provided on the second lead frame and electrically connected to the second lead frame and the second transistor; and a capacitor electrically connected to the first and the second lead frame; wherein the first, the third, the second, and the fourth transistor are arranged side by side in this order in a first direction.
1 . A semiconductor device comprising:
a first lead frame, a second lead frame, and a third lead frame;
a first transistor provided on the first lead frame and having a first terminal electrically connected to the first lead frame;
a second transistor provided on the second lead frame and having a first terminal electrically connected to the third lead frame;
a third transistor provided on the third lead frame and having a first terminal electrically connected to the third lead frame and a second terminal electrically connected to a second terminal of the first transistor;
a fourth transistor provided on the second lead frame and having a first terminal electrically connected to the second lead frame and a second terminal electrically connected to a second terminal of the second transistor;
a capacitor having a first terminal electrically connected to the first lead frame and a second terminal electrically connected to the second lead frame; and
a sealing resin configured to seal the first transistor, the second transistor, the third transistor, the fourth transistor, and the capacitor; wherein
the first transistor and the second transistor are GaN transistors, the third transistor and the fourth transistor are MOS transistors, and
the first transistor, the third transistor, the second transistor, and the fourth transistor are arranged side by side in this order in a first direction.
2 . The semiconductor device according to claim 1 , wherein
the first transistor and the second transistor are GaN-HEMTs.
3 . The semiconductor device according to claim 1 , wherein
the first transistor and the second transistor are normally-on transistors.
4 . The semiconductor device according to claim 1 , wherein
the third transistor and the fourth transistor are MOSFETS.
5 . The semiconductor device according to claim 1 , wherein
the third transistor and the fourth transistor are normally-off transistors.
6 . The semiconductor device according to claim 1 , wherein
the first lead frame and the first terminal of the first transistor are connected via a plurality of bonding wires,
the bonding wires include a first wire and a second wire extending in a direction different from a direction of the first wire, and
the second wire connects the first terminal of the first transistor and the first terminal of the capacitor with a shorter distance than the first wire.
7 . The semiconductor device according to claim 1 , further comprising
a control circuit configured to control driving of the first transistor, the second transistor, the third transistor, and the fourth transistor, wherein
the control circuit is sealed with the sealing resin.
8 . The semiconductor device according to claim 1 , further comprising
a fifth transistor provided on the second lead frame and having a first terminal electrically connected to the second lead frame, a second terminal electrically connected to the second terminal of the second transistor, and a gate terminal electrically connected to a gate terminal of the fourth transistor, wherein
the capacitor is provided side by side with the third transistor in a second direction intersecting the first direction, on the first lead frame and the second lead frame, and
the fifth transistor is provided side by side in the second direction on the capacitor side with the second transistor.
9 . The semiconductor device according to claim 8 , wherein
the fifth transistor is a MOSFET.
10 . The semiconductor device according to claim 8 , wherein
the fifth transistor is a normally-off transistor.
11 . The semiconductor device according to claim 8 , wherein
a threshold voltage of the fifth transistor is substantially the same as a threshold voltage of the fourth transistor.
12 . The semiconductor device according to claim 8 , wherein
the first lead frame and the first terminal of the first transistor are connected via a plurality of bonding wires,
the bonding wires include a first wire and a second wire extending in a direction different from a direction of the first wire, and
the second wire connects the first terminal of the first transistor and the first terminal of the capacitor with a shorter distance than the first wire.
13 . The semiconductor device according to claim 8 , further comprising
a control circuit configured to control driving of the first transistor, the second transistor, the third transistor, the fourth transistor, and the fifth transistor, wherein
the control circuit is sealed with the sealing resin.
14 . The semiconductor device according to claim 8 , further comprising
a sixth transistor provided on the third lead frame and having a first terminal electrically connected to the third lead frame, a second terminal electrically connected to the second terminal of the first transistor, and a gate terminal electrically connected to a gate terminal of the third transistor, wherein
the sixth transistor is provided so as to be sandwiched between the third transistor and the capacitor in the second direction.
15 . The semiconductor device according to claim 14 , wherein
the sixth transistor is a MOSFET.
16 . The semiconductor device according to claim 14 , wherein
the sixth transistor is a normally-off transistor.
17 . The semiconductor device according to claim 14 , wherein
a threshold voltage of the sixth transistor is substantially the same as a threshold voltage of the third transistor.
18 . The semiconductor device according to claim 14 , wherein
the first lead frame and the first terminal of the first transistor are connected via a plurality of bonding wires,
the bonding wires include a first wire and a second wire extending in a direction different from a direction of the first wire, and
the second wire connects the first terminal of the first transistor and the first terminal of the capacitor with a shorter distance than the first wire.
19 . The semiconductor device according to claim 14 , further comprising
a control circuit configured to control driving of the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor, wherein
the control circuit is sealed with the sealing resin.