Photorelay
A photorelay of an embodiment includes a polyimide substrate having a first surface and a second surface on an opposite side of the polyimide substrate from the first surface, the polyimide substrate having a thickness equal to or more than 10 μm and equal to or less than 120 μm, an input terminal provided on the second surface, an output terminal provided on the second surface, a light receiving element provided on the first surface, a light emitting element provided on the light receiving element, and a MOSFET provided on the first surface.
1. A photorelay comprising:
a polyimide substrate having a first surface and a second surface on an opposite side of the polyimide substrate from the first surface, the polyimide substrate having a thickness equal to or more than 10 μm and equal to or less than 120 μm;
an input terminal provided on the second surface;
an output terminal provided on the second surface;
a light receiving element provided on the first surface;
a light emitting element provided on the light receiving element;
a MOSFET provided on the first surface, and
the output terminal is connected to the MOSFET via at least one via wiring provided through the polyimide substrate, the via wiring having a diameter equal to or more than 20 μm and equal to or less than 150 μm.
2. The photorelay according to claim 1 , wherein
the polyimide substrate has a thickness equal to or more than 10 μm and equal to or less than 100 μm.
3. The photorelay according to claim 1 , wherein
the input terminal and the output terminal have a thickness equal to or more than 5 μm and equal to or less than 20 μm.
4. The photorelay according to claim 1 , wherein
the polyimide substrate has a thickness equal to or more than 10 μm and equal to or less than 60 μm.
5. The photorelay according to claim 1 , wherein
the polyimide substrate has a thickness equal to or more than 10 μm and equal to or less than 30 μm.