Granted Patent B2

US 12,594,624 · App. 17/642,065 · Granted Apr 7, 2026

Inventor: Colin Woratz (Bern, CH)

Assignee: BYSTRONIC LASER AG

B23K26/0676B23K26/38

Abstract

Claims (38)

1 . A machining apparatus for laser cutting a workpiece, the machining apparatus comprising:

a device for generating a machining laser beam, for rough machining the workpiece and for producing cuts with cut edges in the workpiece;

a device for splitting the machining laser beam into at least two energy intensity ranges including a first energy intensity range and at least one second energy intensity range, wherein the first energy intensity range is for rough machining of the workpiece and has a greater time-integrated radiation energy than the at least one second energy intensity range for at least partially fine machining a cut edge;

wherein:

the device for splitting the machining laser beam is configured to adjust or select the at least two energy intensity ranges independently of each other,

the first energy intensity range is a core region of the machining laser beam and the at least one second energy intensity range is at least one edge region of the machining laser beam,

the first energy intensity range and the at least one second energy intensity range are arranged concentrically, and

the energy intensity ranges are adapted for rough and fine machining by the device for splitting the machining laser beam, and

a control unit,

wherein at least one of the device for splitting the machining laser beam and the device for generating a machining laser beam is connected to the control unit in a wired or wireless data-carrying manner and is controllable with the control unit,

wherein the device for splitting the machining laser beam is configured to modify a geometry of the cut edge,

wherein

the device for generating the machining laser beam includes a machining laser source that has a plurality of laser source modules including at least one first laser source module and at least one second laser source module for generating the energy intensity ranges of the machining laser beam; and

the device for splitting the machining laser beam includes a laser beam transport fibre having a first fibre region which is a fibre core, and at least one second fibre region in a form of a fibre jacket ring;

wherein

the at least one first laser source module is configured for generating the first energy intensity range of the machining laser beam and is coupled to the first fibre region of the laser beam transport fibre in a laser light-conducting manner; and

the at least one second laser source module is configured for generating one of the at least one second energy intensity ranges of the machining laser beam and is coupled to each of the further fibre regions assigned thereto in a laser light-conducting manner.

2 . The machining apparatus according to claim 1 , wherein

the device for generating the machining laser beam comprises a machining laser source and a laser beam transport fibre; and

the device for splitting the machining laser beam includes an optical element for shaping the beam of the machining laser beam.

3 . The machining apparatus according to claim 1 ,

wherein the device for splitting the machining laser beam is configured to adjust or select the time-integrated radiation energy of the at least one second energy intensity range with increasing distance from the first energy intensity range;

and/or

wherein the device for splitting the machining laser beam is configured to round or chamfer the cut edge.

4 . The machining apparatus according to claim 1 ,

wherein the device for splitting the machining laser beam is configured to adjust or select at least one of:

at least one or a plurality of powers of the machining laser source or the laser source modules,

an intensity distribution perpendicular to a direction of propagation of the machining laser beam,

one or a plurality of frequencies of the machining laser beam and/or at least one of the energy intensity ranges of the machining laser beam,

a spatial structure of the machining laser beam, the spatial structure including a width and/or a diameter of the machining laser beam,

a spatial structure and/or arrangement of the first energy intensity range and/or the at least one second energy intensity range,

a feed rate of the machining laser beam, a focus diameter of the machining laser beam and/or of at least one of the energy intensity ranges,

a focal position of the machining laser beam and/or of at least one of the energy intensity ranges, and

a focusing of the machining laser beam and/or of at least one of the energy intensity ranges.

5 . The machining apparatus according to claim 1 ,

further comprising a device for guiding a machining gas the machining gas comprising a cutting gas, onto the workpiece; and/or

wherein the device for guiding the machining gas onto the workpiece comprises a nozzle-shaped outlet with an opening for the machining gas, the opening having a diameter in a range of 0.5 to 30 mm, wherein the nozzle-shaped outlet opening is adjustable in a distance from the workpiece to the cut edge in a range from 0 to 3 mm.

6 . The machining apparatus according to claim 1 , wherein the device for splitting the machining laser beam is configured to at least partially fine machine the cut edge of the workpiece.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (76)