Multilayer ceramic capacitor and paste for producing bump
A multilayer ceramic capacitor includes a multilayer body including a dielectric layer and an inner electrode layer alternately laminated, an outer electrode layer on each of two end surfaces at both ends in a length direction perpendicular to a lamination direction of the multilayer body and covering end surface sides of two main surfaces at both ends in the lamination direction and end surface sides of two side surfaces in the width direction and including a base electrode layer connected to the inner electrode layer, and a bump on each of the two end surface sides to hold therebetween the base electrode layer, covering the main surface side, and including a resin and a metal. In each bump, an end surface-side portion near the end surface on the side where the bump is located, projects more than a central portion of the bump toward an outside in the lamination direction.
1 . A multilayer ceramic capacitor comprising:
a multilayer body including a dielectric layer and an inner electrode layer alternately laminated;
an outer electrode layer on each of two end surfaces at both ends in a length direction perpendicular to a lamination direction of the multilayer body so as to cover end surface sides of two main surfaces at both ends in the lamination direction of the multilayer body and end surface sides of two side surfaces in a width direction perpendicular to the lamination direction and the length direction and which includes a base electrode layer connected to the inner electrode layers; and
a bump on each of the two end surface sides of one of the two main surfaces of the multilayer body to hold therebetween the base electrode layer, covering a main surface side, and including a resin and a metal; wherein
in each of the bumps, the end surface-side portion adjacent to the end surface on the side, where the bump is located, projects more than a central portion of the bump to an outside in the lamination direction; and
a difference in thickness between the end surface-side portion and the central portion in the lamination direction is about 5% or more and about 30% or less of the thickness of the end surface-side portion of the bump in the lamination direction.
2 . The multilayer ceramic capacitor according to claim 1 , wherein a metal occupies about 43% or more and about 91% or less of a total area of a section of the bump.
3 . The multilayer ceramic capacitor according to claim 1 , wherein a metal occupies about 60% or more to about 80% or less of a total area of a section of the bump.
4 . The multilayer ceramic capacitor according to claim 1 , wherein each of the outer electrode layers includes, on the end surface side, a nickel plating layer and a tin plating layer on an outer periphery of the nickel plating layer, and the nickel plating layer and the tin plating layer cover an outer periphery of the bump on the main surface side.
5 . The multilayer ceramic capacitor according to claim 1 , wherein
each of the outer electrode layers includes, from a base electrode layer side:
a first nickel plating layer on an outer periphery of the base electrode layer;
a first tin plating layer on an outer periphery of the first nickel plating layer;
a second nickel plating layer on an outer periphery of the first tin plating layer; and
a second tin plating layer on an outer periphery of the second nickel plating layer; and
the second nickel plating layer and the second tin plating layer cover an outer periphery of the bump on the main surface side.
6 . A paste for a bump of the multilayer ceramic capacitor according to claim 1 , the paste comprising:
about 86.5% by weight or more and about 94.1% by weight or less of a metal powder including any one of silver, copper, or nickel and having a median diameter D50 of about 2 μm or more and about 10 μm or less;
about 1.13% by weight or more and about 6.38% by weight or less of an epoxy resin;
about 0.90% by weight or more and about 5.06% by weight or less of a phenol resin;
about 0.0113% by weight or more and about 0.0638% by weight or less of imidazole; and
about 1.48% by weight or more and about 3.85% by weight or less of solvent so that a total is 100%.
7 . The paste according to claim 6 , wherein the copper includes copper coated with the silver, and an alloy powder of the copper and the nickel includes an alloy coated with the silver.
8 . The paste according to claim 6 , wherein the metal powder further includes tin.
9 . The paste according to claim 6 , wherein a metal occupies about 43% or more and about 91% or less of a total area of a section of the bump.
10 . The paste according to claim 6 , wherein a metal occupies about 60% or more to about 80% or less of a total area of a section of the bump.
11 . A paste for a bump of the multilayer ceramic capacitor according to claim 1 , the paste comprising:
about 45.3% by volume or more and about 64.9% by volume or less of a metal powder including any one of silver, copper, or nickel and having a median diameter D50 of about 2 μm or more and about 10 μm or less;
about 5.94% by volume or more and about 25.5% by volume or less of an epoxy resin;
about 4.56% by volume or more and about 19.5% by volume or less of a phenol resin;
about 0.0621% by volume or more and about 0.266% by volume or less of imidazole; and
about 8.31% by volume or more and about 24.5% by volume or less of solvent so that a total is 100%.
12 . The paste according to claim 11 , wherein the copper includes copper coated with the silver, and an alloy powder of the copper and the nickel includes an alloy coated with the silver.
13 . The paste according to claim 11 , wherein the metal powder further includes tin.
14 . The paste according to claim 11 , wherein a metal occupies about 43% or more and about 91% or less of a total area of a section of the bump.
15 . The paste according to claim 11 , wherein a metal occupies about 60% or more to about 80% or less of a total area of a section of the bump.