Sublimable film formation composition and method for producing substrate
The sublimable film formation composition of the present invention includes a sublimable substance and a solvent in which a saturation solubility of the sublimable substance is more than 10% by mass.
1 . A sublimable film formation composition comprising:
a sublimable substance; and
a solvent A1 in which a saturation solubility of the sublimable substance is 76% by mass or more and a boiling point is lower by 5° C. or more than a boiling point of the sublimable substance at 1 atm.
2 . The sublimable film formation composition according to claim 1 , further comprising:
a solvent B1 in which a boiling point is less than the boiling point of the solvent A1.
3 . The sublimable film formation composition according to claim 1 ,
wherein a content of the solvent A1 in the sublimable film formation composition is 50% by mass or more.
4 . The sublimable film formation composition according to claim 1 ,
wherein a coagulation heat of the sublimable substance is 200 J/g or less.
5 . The sublimable film formation composition according to claim 1 ,
wherein a coagulation point of the sublimable substance at 1 atm is 5° C. or higher.
6 . The sublimable film formation composition according to claim 1 ,
wherein the boiling point of the sublimable substance at 1 atm is 300° C. or lower.
7 . The sublimable film formation composition according to claim 1 ,
wherein a content of the sublimable substance is 80% by mass or less in the sublimable film formation composition.
8 . The sublimable film formation composition according to claim 1 , wherein the sublimable substance is at least one selected from the group consisting of norbornene, norbornane, camphor, pyrazine, 2,3-dichloropyrazine, 2, 6-dichloropyrazine, 2,6-dichloropyridine, tetrahydrodicyclopentadiene, dimethyl oxalate, isoborneol, neopentyl alcohol, neopentyl glycol, and ethylene carbonate.
9 . A method for producing a substrate, the method comprising:
a step of preparing a substrate having an uneven structure on a surface;
a step of supplying a sublimable film formation composition including a sublimable substance to the surface,
a step of causing the sublimable film formation composition to coagulate and forming a sublimable film on the surface; and
a step of removing the sublimable film by sublimating the sublimable substance,
wherein the sublimable film formation composition including the sublimable substance is the sublimable film formation composition according to claim 1 .
10 . The method for producing a substrate according to claim 9 ,
wherein the substrate has the uneven structure with a pattern dimension of 30 nm or less on the surface.
11 . The method for producing a substrate according to claim 10 ,
wherein the substrate has the uneven structure with the pattern dimension of 20 nm or less on the surface.