Methods of manufacturing plasma generating cells for a plasma source
A method of manufacturing a dielectric barrier discharge (DBD) structure includes forming a patterned electrode layer around an outer perimeter of a substrate composed of a dielectric material. The patterned electrode layer includes multiple electrodes around the outer perimeter of the substrate and gaps between adjacent electrodes. The method further includes depositing a dielectric layer over at least a first region of the patterned electrode layer to form a DBD region of the DBD structure.
1 . A method of manufacturing a dielectric barrier discharge (DBD) structure, the method comprising:
forming a patterned electrode layer around an outer surface of a substrate composed of a dielectric material, wherein the substrate is a dielectric rod, the patterned electrode layer comprising a plurality of electrodes around the outer surface of the substrate and gaps between adjacent electrodes of the plurality of electrodes, wherein the plurality of electrodes extend longitudinally along the dielectric rod from a first end of the dielectric rod to a second end of the dielectric rod; and
depositing a dielectric layer over at least a first region of the patterned electrode layer to form a DBD region of the DBD structure.
2 . The method of claim 1 , further comprising:
positioning a dielectric sleeve over at least a second region of the patterned electrode layer to form an insulating region of the DBD structure, wherein a first thickness of the dielectric sleeve is greater than a second thickness of the dielectric layer; and
applying a gap filler to fill any gap between the dielectric sleeve and the substrate and to bond the dielectric sleeve to the substrate.
3 . The method of claim 1 , wherein the patterned electrode layer is between approximately 0.1 microns and 20 microns thick, and wherein the dielectric layer is between approximately 25 and 1000 microns thick.
4 . The method of claim 1 , further comprising:
depositing an electrically conductive material on the outer surface of the substrate to form an electrode layer; and
patterning the electrode layer to form the patterned electrode layer, wherein the patterned electrode layer comprises one to eight pairs of electrodes.
5 . The method of claim 4 , wherein patterning the electrode layer is performed using a process selected from a group consisting of:
a) machining;
b) laser etching; and
c) depositing a mask layer over the electrode layer;
patterning the mask;
etching portions of the electrode layer exposed by the patterned mask; and
removing the mask.
6 . The method of claim 4 , further comprising:
roughening a surface of the substrate along an outer perimeter of the substrate; and
performing a metallization process to deposit the metal on the roughened surface.
7 . The method of claim 4 , wherein depositing the electrically conductive material comprises performing electron beam ion assisted deposition (EB-IAD) to deposit the electrically conductive material, wherein the electrically conductive material comprises at least one of a metal, a metal alloy, a conductive oxide, or a conductive ceramic.
8 . The method of claim 7 , wherein the electrically conductive material comprises at least one of Cr, Ni, Au, Cu, Ag, Pd, Pt, ITO, TiN, TiB 2 , MoSi 2 , BaTiO 3 , Fe 2 O 3 , TiO 3 , ReO 3 , RuO 2 , IrO 2 , TiO, or V 2 O 3 .
9 . The method of claim 7 , further comprising:
polishing a surface of the substrate along an outer perimeter of the substrate prior to performing the EB-IAD.
10 . The method of claim 1 , wherein the patterned electrode layer comprises one of a manganese-molybdenum alloy or a silver-palladium alloy.
11 . The method of claim 1 , wherein the dielectric layer comprises a first oxide layer selected from a group comprising alumina, yttria, silica, and magnesia.
12 . The method of claim 1 , wherein depositing the dielectric layer comprises performing a plasma spray (PS) process, a physical vapor deposition (PVD) process, or a glaze process.
13 . The method of claim 1 , further comprising:
depositing a metal oxide layer over the dielectric layer.
14 . The method of claim 13 , wherein the metal oxide layer comprises at least one of alumina or yttria.
15 . The method of claim 1 , wherein forming the patterned electrode layer comprises:
depositing a mask layer over the outer surface of the substrate;
patterning the mask layer to expose a plurality of surface regions of the substrate;
depositing a metal layer over the mask layer and the plurality of exposed surface regions of the substrate; and
removing the mask layer.
16 . The method of claim 1 , wherein a cross section of the substrate has a shape selected from a group consisting of a circle, an oval, a square, a rectangle, a pentagon, and a hexagon.
17 . The method of claim 1 , wherein each of the gaps has a gap size of between 0.5 mm and 8 mm.
18 . The method of claim 1 , wherein the dielectric material comprises at least one of alumina, quartz, or sapphire.
19 . A method comprising:
roughening an outer surface of a dielectric rod by an abrasive machining operation or a media blasting operation to form a roughened outer surface of the dielectric rod;
depositing an electrode layer on the roughened outer surface of the dielectric rod by a metallization process or by an electron beam ion assisted deposition (EB-IAD) process, wherein the electrode layer comprises at least one of a metal, a metal alloy, or a conductive oxide;
removing at least a portion of the electrode layer by a machining process or by an etching process to form a plurality of gaps in the electrode layer, wherein each gap of the plurality of gaps separates an electrode from an adjacent electrode, and wherein the electrode and the adjacent electrode extend longitudinally along the dielectric rod from a first end of the dielectric rod to a second end of the dielectric rod; and
depositing a dielectric layer over at least a first region of the electrode layer to form a dielectric barrier discharge region.
20 . A method comprising:
smoothing a surface of a dielectric rod by a polishing operation to form a smoothed surface of the dielectric rod;
depositing a mask layer over at least the smoothed surface of the dielectric rod;
patterning the mask layer to expose a plurality of electrode regions on the smoothed surface of the dielectric rod;
depositing a metal layer or a conductive oxide layer over the mask layer and the plurality of electrode regions to form a plurality of electrodes on the plurality of electrode regions;
removing the mask layer to form a plurality of gaps, wherein each gap of the plurality of gaps separates an electrode from an adjacent electrode; and
depositing a dielectric layer over at least a first region of the plurality of electrodes to form a dielectric barrier discharge region,
wherein the electrode and the adjacent electrode extend longitudinally along the dielectric rod from a first end of the dielectric rod to a second end of the dielectric rod.