Method for manufacturing electronic device
A method for manufacturing an electronic device includes: providing a base layer; forming a patterned circuit layer on the base layer, the patterned circuit layer having a first opening; placing an electronic element on the patterned circuit layer; and patterning the base layer to form a second opening which is at least partially overlapped with the first opening. The step of placing the electronic element is performed after the step of forming the patterned circuit layer.
1 . A method for manufacturing an electronic device, comprising:
providing a base layer;
forming a patterned circuit layer on the base layer, the patterned circuit layer having a first opening;
placing an electronic element on the patterned circuit layer; forming a first encapsulation portion on the electronic element after the step of placing the electronic element;
forming a second encapsulation portion on the first encapsulation portion and a sidewall of the first opening; and
patterning the base layer to form a second opening which is at least partially overlapped with the first opening after the step of forming the second encapsulation portion;
wherein the step of placing the electronic element is performed after the step of forming the patterned circuit layer.
2 . The method according to claim 1 , wherein the step of forming the patterned circuit layer comprises:
forming an insulation layer on the base layer;
forming a patterned conductive layer on the insulation layer; and
patterning the insulation layer to form at least a part of the first opening after the step of forming the patterned conductive layer.
3 . The method according to claim 2 , wherein the insulation layer and the base layer are patterned by different processes.
4 . The method according to claim 3 , wherein the insulation layer is patterned by an etching process, and the base layer is patterned by a laser drilling process.
5 . The method according to claim 1 , wherein the step of forming the patterned circuit layer comprises:
forming an insulation layer on the base layer;
patterning the insulation layer to form at least a part of the first opening; and
forming a patterned conductive layer after the step of patterning the insulation layer.
6 . The method according to claim 5 , wherein the insulation layer and the base layer are patterned by different processes.
7 . The method according to claim 6 , wherein the insulation layer is patterned by an etching process, and the base layer is patterned by a laser drilling process.
8 . The method according to claim 1 , further comprising filling an elastic material in the first opening.
9 . The method according to claim 8 , wherein the step of patterning the base layer is performed after the step of filling the elastic material in the first opening.
10 . The method according to claim 1 , further comprising filling an elastic material in the first opening and the second opening after the step of patterning the base layer.
11 . The method according to claim 1 , further comprising:
providing a carrier;
attaching the base layer on the carrier;
flipping the carrier and the base layer as a whole;
removing the carrier; and
attaching an elastic substrate under the base layer.
12 . The method according to claim 1 , wherein the first opening is communicated with the second opening.