Temperature margin setting method for 3D integrated circuit
A method of designing a 3D integrated circuit includes generating a distance-delay table with respect to at least one of a first chip or a second chip stacked on the first chip, based on a thermal analysis result, calculating a first timing path distance with respect to a first timing path corresponding to the first chip in a 3D signal transfer path, calculating a second timing path distance with respect to a second timing path corresponding to the second chip in the 3D signal transfer path, calculating a 3D timing path distance by summing the first timing path distance and the second timing path distance, and setting a temperature margin with respect to a 3D timing path based on the distance-delay table and the 3D timing path distance.
1 . A method of setting a temperature margin when designing a 3D (three-dimensional) integrated circuit, the method comprising:
generating a distance-delay table with respect to at least one of a first chip and a second chip stacked on the first chip, based on a thermal analysis result;
calculating a first timing path distance with respect to a first timing path corresponding to the first chip in a 3D signal transfer path;
calculating a second timing path distance with respect to a second timing path corresponding to the second chip in the 3D signal transfer path;
calculating a 3D timing path distance by summing the first timing path distance and the second timing path distance; and
setting a temperature margin based on the distance-delay table and the 3D timing path distance.
2 . The method of claim 1 , wherein the distance-delay table is formed based on the thermal analysis result with respect to the first chip, and
wherein the temperature margin is set with reference to the distance-delay table with respect to the first chip.
3 . The method of claim 1 , wherein the distance-delay table is formed based on the thermal analysis result with respect to the second chip located on top of the first chip, and
wherein the temperature margin is set with reference to the distance-delay table with respect to the second chip.
4 . The method of claim 1 , wherein the generating of the distance-delay table includes:
generating a first distance-delay table including delay deviation values for each distance with respect to the first chip; and
generating a second distance-delay table including delay deviation values for each distance with respect to the second chip, and
wherein the delay deviation values of the first distance-delay table are greater than or equal to the delay deviation values of the second distance-delay table of a corresponding distance.
5 . The method of claim 1 , wherein the generating of the distance-delay table includes:
generating a coordinate-temperature table including information on a temperature distribution of devices of a selected chip among the first chip and the second chip;
generating a temperature-delay table including information on thermal gradients of the devices of the selected chip; and
generating a distance-delay table including delay deviation values according to distances in which temperature change information of the devices of the selected chip is reflected by integrating the coordinate-temperature table and the temperature-delay table.
6 . The method of claim 5 , wherein the generating of the distance-delay table further includes:
generating a distance-temperature graph including information on a temperature difference according to a distance difference between the devices of the selected chip based on the coordinate-temperature table.
7 . The method of claim 1 , further comprising:
calculating a third timing path distance with respect to a third timing path corresponding to a contact connecting the first chip and the second chip to each other in a vertical direction in the 3D signal transfer path, and
wherein the 3D timing path distance is calculated by summing the first timing path distance, the second timing path distance, and the third timing path distance.
8 . A method of setting a temperature margin when designing a 3D (three-dimensional) integrated circuit, the method comprising:
generating a first distance-delay table with respect to a first chip, based on a thermal analysis result;
generating a second distance-delay table with respect to a second chip stacked on top of the first chip, based on the thermal analysis result;
calculating a first timing path distance with respect to a first timing path corresponding to the first chip in a 3D signal transfer path;
setting a temperature margin with respect to the first timing path based on the first distance-delay table and the first timing path distance;
calculating a second timing path distance with respect to a second timing path corresponding to the second chip in the 3D signal transfer path; and
setting a temperature margin with respect to the second timing path based on the second distance-delay table and the second timing path distance.
9 . The method of claim 8 , wherein delay deviation values of the first distance-delay table are greater than or equal to delay deviation values of the second distance-delay table of a corresponding distance.
10 . The method of claim 8 , wherein each of the generating of the first distance-delay table and the generating of the second distance-delay table includes:
generating a coordinate-temperature table including information on a temperature distribution of devices of a selected chip among the first chip and the second chip;
generating a temperature-delay table including information on thermal gradients of the devices of the selected chip; and
generating a distance-delay table including delay deviation values according to distances in which temperature change information of the devices of the selected chip is reflected by integrating the coordinate-temperature table and the temperature-delay table.
11 . The method of claim 10 , wherein each of the generating of the first distance-delay table and the generating of the second distance-delay table further includes:
generating a distance-temperature graph including information on a temperature difference according to a distance difference between the devices of the selected chip based on the coordinate-temperature table.
12 . An apparatus of designing a 3D integrated circuit including a processor and a memory device, the apparatus comprising:
the processor is configured to load a design tool into the memory device and execute the design tool that is loaded, and
wherein the design tool includes:
a thermal analysis tool configured to generate a distance-delay table with respect to at least one of a first chip and a second chip stacked on the first chip, based on a thermal analysis result; and
a static timing analysis tool configured to respectively calculate a first timing path distance corresponding to the first chip and a second timing path distance corresponding to the second chip in a 3D signal transfer path, and to set a temperature margin with respect to the 3D signal transfer path based on the first and second timing path distances and the distance-delay table.
13 . The apparatus of claim 12 , wherein the thermal analysis tool includes a thermal gradient analysis module configured to generate a coordinate-temperature table including heat distribution information with respect to devices of a selected chip of the first chip and the second chip.
14 . The apparatus of claim 13 , wherein the thermal analysis tool further includes a temperature-delay analysis module configured to generate a temperature-delay table including delay deviation information depending on a thermal gradient with respect to the 3D signal transfer path.
15 . The apparatus of claim 14 , wherein the thermal analysis tool further includes a distance-delay analysis module configured to generate a distance-delay table including delay deviation information depending on distance of the devices of the selected chip by integrating the coordinate-temperature table and the temperature-delay table.
16 . The apparatus of claim 13 , wherein the thermal gradient analysis module generates a distance-temperature graph including information on a temperature difference according to a distance difference between the devices of the selected chip based on the coordinate-temperature table.
17 . The apparatus of claim 12 , wherein the static timing analysis tool includes:
a 3D distance calculation module configured to separately calculate the first timing path distance and the second timing path distance; and
a temperature margin decision module configured to set the temperature margin with respect to the 3D signal transfer path based on the first and second timing path distances and the distance-delay table.
18 . The apparatus of claim 17 , wherein the 3D distance calculation module calculates a 3D timing path distance by summing the first timing path distance and the second timing path distance, and
wherein the temperature margin decision module sets the temperature margin with respect to the 3D signal transfer path based on the 3D timing path distance and a distance-delay table corresponding to a selected chip among the first chip and the second chip.
19 . The apparatus of claim 17 , wherein the 3D distance calculation module further calculates a third timing path distance with respect to a third timing path corresponding to a contact connecting the first chip and the second chip to each other in a vertical direction, and calculates a 3D timing path distance by summing the first to third timing path distances.
20 . The apparatus of claim 17 , wherein the temperature margin decision module sets a temperature margin with respect to the first chip based on a first distance-delay table corresponding to the first chip, and sets a temperature margin with respect to the second chip based on a second distance-delay table corresponding to the second chip.