Image sensor
An image sensor includes a first chip including a first substrate having a plurality of pixels, and a first wiring structure, each of the plurality of pixels including first and second isolated photodiodes; a second chip including a second wiring structure, and a second substrate; and a third chip including a third wiring structure, and a third substrate having logic devices, wherein each of the plurality of pixels includes a first floating diffusion node on the first photodiode, a second floating diffusion node on the second photodiode, a third floating diffusion node between the first and second floating diffusion nodes on the second photodiode, and a first switching transistor on the second substrate, and wherein the first switching transistor is connected to the first floating diffusion node through the first and second wiring structures, and the third floating diffusion node through the first and second wiring structures.
1 . An image sensor, comprising:
a first semiconductor chip including a first semiconductor substrate having a pixel array in which a plurality of pixels are arranged, and a first wiring structure disposed on the first semiconductor substrate, each of the plurality of pixels including a first photodiode and a second photodiode isolated from each other;
a second semiconductor chip including a second wiring structure disposed on the first wiring structure and having a capacitor, and a second semiconductor substrate disposed on the second wiring structure; and
a third semiconductor chip including a third wiring structure disposed on the second semiconductor chip, and a third semiconductor substrate disposed on the third wiring structure and having logic devices formed thereon,
wherein each of the plurality of pixels includes a first floating diffusion node storing electric charges generated by the first photodiode, a second floating diffusion node storing electric charges generated by the second photodiode, a third floating diffusion node disposed between the first and second floating diffusion nodes on the second photodiode, and a first switching transistor formed on a lower surface of the second semiconductor substrate, and
wherein the first switching transistor has a first end connected to the first floating diffusion node through a first path of the first and second wiring structures, and a second end connected to the third floating diffusion node through a second path of the first and second wiring structures.
2 . The image sensor of claim 1 , wherein the second photodiode has an area larger than that of the first photodiode.
3 . The image sensor of claim 2 ,
wherein each of the plurality of pixels further includes a second switching transistor formed on an upper surface of the first semiconductor substrate, and
wherein the second switching transistor has a first end connected to the second floating diffusion node and a second end connected to the third floating diffusion node.
4 . The image sensor of claim 1 ,
wherein each of the plurality of pixels includes:
a first transfer transistor connected between the first photodiode and the first floating diffusion node; and
a second transfer transistor connected between the second photodiode and the second floating diffusion node.
5 . The image sensor of claim 4 ,
wherein each of the plurality of pixels further includes:
a reset transistor having a first end connected to the third floating diffusion node and a second end to which a reset voltage is applied;
a source follower transistor having a gate connected to the second floating diffusion node and one end to which a pixel voltage is applied;
a select transistor connected to the other end of the source follower transistor and outputting a pixel signal based on a select control signal.
6 . The image sensor of claim 5 , wherein at least one of the reset transistor, the source follower transistor, and the select transistor is formed on a lower surface of the second semiconductor substrate.
7 . The image sensor of claim 5 , wherein the capacitor includes a first electrode connected to the first floating diffusion node and a second electrode to which a capacitor voltage is applied.
8 . The image sensor of claim 7 , wherein the capacitor voltage is provided by the pixel voltage.
9 . The image sensor of claim 1 ,
wherein the capacitor includes a first electrode, a second electrode, and a dielectric film therebetween, and
wherein at least one of the first and second electrodes includes a metal material different from a material of a first wiring layer of the first wiring structure.
10 . The image sensor of claim 9 , wherein a least one of the first and second electrodes includes tungsten, and the first wiring layer includes copper.
11 . The image sensor of claim 9 , wherein the capacitor has a cylindrical structure.
12 . The image sensor of claim 1 ,
wherein the first wiring structure includes a first bonding insulating layer disposed on an uppermost portion of the first wiring structure and a first metal pad in the first bonding insulating layer, and
wherein the second wiring structure includes a second bonding insulating layer disposed in a lowermost portion of the second wiring structure and in contact with the first bonding insulating layer, and a second metal pad disposed in the second bonding insulating layer and in contact with the first metal pad.
13 . The image sensor of claim 1 ,
wherein the first semiconductor chip includes a pixel region in which the plurality of pixels are arranged and a peripheral circuit region surrounding the pixel region, and
wherein the image sensor further includes a through-electrode penetrating the second semiconductor chip from the peripheral circuit region of the first semiconductor chip and electrically connected to the third semiconductor chip.
14 . An image sensor, comprising:
a pixel array chip including a first semiconductor substrate having a pixel array in which a plurality of pixels are arranged, and a first wiring structure disposed on the first semiconductor substrate, each of the plurality of pixels including a first photodiode and a second photodiode isolated from each other;
a memory chip including a second wiring structure disposed on the first wiring structure and having a capacitor, and a second semiconductor substrate disposed on the second wiring structure; and
a logic chip having a third wiring structure disposed on the memory chip and a third semiconductor substrate disposed on the third wiring structure and having logic devices formed thereon,
wherein each of the plurality of pixels includes:
a first floating diffusion node configured to store electric charges generated by the first photodiode;
a second floating diffusion node configured to store electric charges generated by the second photodiode;
a first switching transistor formed on a lower surface of the second semiconductor substrate and having a first end connected to the first floating diffusion node through a first path of the first and second wiring structures;
a second switching transistor formed on the lower surface of the second semiconductor substrate and having a first end connected to the second floating diffusion node through a second path of the first and second wiring structures; and
a third floating diffusion node formed on the lower surface of the second semiconductor substrate and connected between a second end of the first switching transistor and a second end of the second switching transistor.
15 . The image sensor of claim 14 , wherein each of the plurality of pixels further includes a reset transistor formed on an upper surface of the first semiconductor substrate and having a first end connected to the third floating diffusion node through a third path of the first and second wiring structures, and a second end to which a reset voltage is applied.
16 . The image sensor of claim 14 , wherein each of the plurality of pixels further includes a reset transistor formed on the lower surface of the second semiconductor substrate and having a first end connected to the third floating diffusion node and a second end to which a reset voltage is applied.
17 . The image sensor of claim 14 , wherein each of the plurality of pixels further includes:
a first transfer transistor connected between the first photodiode and the first floating diffusion node;
a second transfer transistor connected between the second photodiode and the second floating diffusion node;
a source follower transistor having a gate connected to the second floating diffusion node and one end to which a pixel voltage is applied; and
a select transistor connected to the other end of the source follower transistor and outputting a pixel signal based on a select control signal.
18 . The image sensor of claim 17 , wherein the source follower transistor and the select transistor are formed on the second semiconductor substrate.
19 . The image sensor of claim 14 ,
wherein the capacitor includes a first electrode, a second electrode, and a dielectric film therebetween, and
wherein at least one of the first and second electrodes includes a metal material different from a material of a first wiring layer of the first wiring structure.
20 . An image sensor, comprising:
a first semiconductor chip including a first semiconductor substrate having a pixel array in which a plurality of pixels are arranged, and a first wiring structure disposed on the first semiconductor substrate, each of the plurality of pixels including a first photodiode and a second photodiode isolated from each other; and
a second semiconductor chip including a second wiring structure disposed on the first wiring structure and having a capacitor and a second semiconductor substrate disposed on the second wiring structure,
wherein the first wiring structure includes a first bonding insulating layer disposed on an uppermost portion of the first wiring structure and a first metal pad in the first bonding insulating layer, the second wiring structure includes a second bonding insulating layer disposed in a lowermost portion of the second wiring structure and in contact with the first bonding insulating layer, and a second metal pad connected to the first metal pad in the second bonding insulating layer, and a connection between the first and second metal pads provides electrical paths for the first and second wiring structures,
wherein each of the plurality of pixels includes:
a first floating diffusion node configured to store electric charges generated by the first photodiode;
a second floating diffusion node configured to store electric charges generated by the second photodiode;
a third floating diffusion node disposed between the first and second floating diffusion nodes on the second photodiode; and
a first switching transistor formed on a lower surface of the second semiconductor substrate, and
wherein the first switching transistor has a first end connected to the first floating diffusion node through a first path of the first and second wiring structures, and a second end connected to the third floating diffusion node through a second path of the first and second wiring structures.