Granted Patent B2

US 12,614,016 · App. 17/747,383 · Granted Apr 28, 2026

Inventors: Chi-Wen Chang (Hsinchu, TW); Mao-Wei Chiu (Hsinchu, TW)

Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

G06F30/392G06F2117/12

Abstract

Claims (97)

1 . A method of modifying a layout for an integrated circuit (IC), said method comprising:

selecting, in the layout, a circuit region to be scaled;

setting a fixed area including a fixed feature in the selected circuit region; and

scaling the selected circuit region, without scaling the fixed area including the fixed feature, to obtain a modified layout for the IC,

wherein

said scaling comprises scaling the selected circuit region by a scaling factor along a first direction,

said setting further comprises setting, as a pushed area, an area overlapping the selected circuit region along the first direction, and

said method further comprises moving the pushed area along the first direction by a distance corresponding to a width of the selected circuit region and the scaling factor.

2 . The method of claim 1 , wherein

said scaling comprises changing, by the scaling factor, a gate pattern pitch between adjacent gate patterns among a plurality of gate patterns in the selected circuit region.

3 . The method of claim 1 , wherein

said scaling comprises changing, by the scaling factor, a gate pattern pitch between adjacent gate patterns among a plurality of gate patterns in the selected circuit region, without changing a gate pattern width of the plurality of gate patterns.

4 . The method of claim 1 , further comprising:

performing a verification on the modified layout, the verification comprising at least one of:

a design rule check, or

a layout-versus-schematic (LVS) check.

5 . The method of claim 1 , wherein

said selecting further comprises selecting, in the layout, a further circuit region to be scaled,

the pushed area overlaps both the selected circuit region and further circuit region along the first direction,

said scaling comprises:

scaling-up the selected circuit region by the scaling factor along the first direction, and

scaling-up the selected further circuit region by a further scaling factor along the first direction, and

said moving comprises:

pushing the pushed area along the first direction by the distance corresponding to the width of the selected circuit region and the scaling factor, and

further pushing the pushed area along the first direction by a further distance corresponding to a width of the selected further circuit region and the further scaling factor.

6 . The method of claim 1 , wherein

the fixed feature comprises a conductive pattern extending across a boundary of the selected circuit region.

7 . The method of claim 1 , further comprising:

after said scaling, adding or modifying at least one routing feature to at least one of

restore an electrical connection between the fixed feature and a corresponding feature in the scaled circuit region, or

satisfy a design rule.

8 . The method of claim 1 , wherein

the selected circuit region comprises:

devices placed at a first gate pattern pitch along the first direction,

first conductive patterns extending along the first direction,

second conductive patterns extending along a second direction transverse to the first direction, and

vias, and

said scaling comprises:

performing re-placement of the devices at a second gate pattern pitch along the first direction, the second gate pattern pitch different from the first gate pattern pitch,

rearranging one or more of the second conductive patterns and the vias along the first direction, based on the scaling factor being a ratio of the second gate pattern pitch to the first gate pattern pitch, and

resizing one or more of the first conductive patterns along the first direction, based on the scaling factor.

9 . The method of claim 1 , wherein

the layout comprises a conductive pattern extending in a second direction transverse to the first direction and across a boundary of the selected circuit region, and

said method further comprises:

before said scaling, disconnecting the conductive pattern into an inner part in the selected circuit region and an outer part outside the selected circuit region, and

after said scaling, reconnecting the inner part in the scaled circuit region and the outer part.

10 . The method of claim 9 , wherein

said reconnecting comprises at least one of

extending the outer part into the scaled circuit region to overlap the inner part, or

adding at least one routing feature.

11 . A system for modifying a layout for an integrated circuit (IC), said system comprising:

at least one processor; and

a non-transitory computer readable storage medium connected to the processor, wherein the processor is configured to execute instructions stored on the computer readable storage medium to:

select, in the layout, a circuit region to be scaled along a first direction,

disconnect a first conductive pattern, which extends in a second direction transverse to the first direction and across a boundary of the selected circuit region, into an inner part in the selected circuit region and an outer part outside the selected circuit region,

scale the selected circuit region along the first direction, and

reconnect the inner part in the scaled circuit region and the outer part, in response to at least one of

a first determination that the inner part in the scaled circuit region and the outer part are electrically disconnected from each other, or

a second determination that at least one of the inner part in the scaled circuit region or the outer part fails a verification.

12 . The system of claim 11 , wherein the at least one processor is further configured to execute instructions stored on the computer readable storage medium to:

perform the verification which comprises at least one of

a design rule check, or

a layout-versus-schematic (LVS) check.

13 . The system of claim 11 , wherein the at least one processor is further configured to execute instructions stored on the computer readable storage medium to:

make no attempt to reconnect the inner part in the scaled circuit region and the outer part, in response to a third determination that the inner part in the scaled circuit region and the outer part overlap each other over a distance greater than a predetermined minimal conductive pattern width.

14 . The system of claim 11 , wherein the at least one processor is further configured to execute instructions stored on the computer readable storage medium to:

reconnect the inner part in the scaled circuit region and the outer part by at least one of extending the outer part into the scaled circuit region to overlap the inner part, or adding at least one routing feature.

15 . The system of claim 11 , wherein the at least one processor is further configured to execute instructions stored on the computer readable storage medium to:

before disconnecting the first conductive pattern, set a first anchor on the inner part and a second anchor on the outer part,

after scaling the selected circuit region, make at least one of the first determination or the second determination, based on a first coordinate of the first anchor on the inner part in the scaled circuit region and a second coordinate of the second anchor on the outer part.

16 . The system of claim 11 , wherein the at least one processor is further configured to execute instructions stored on the computer readable storage medium to:

in response to setting of a fixed area in the layout, the fixed area comprising a second conductive pattern which extends in the second direction across the boundary of the selected circuit region,

not disconnect the second conductive pattern, and

scale the selected circuit region, without scaling the fixed area.

17 . The system of claim 11 , wherein the at least one processor is further configured to execute instructions stored on the computer readable storage medium to:

in response to setting of a pushed area in the layout, the pushed area overlapping the selected circuit region along the first direction,

scale-up the selected circuit region by a scaling factor, and

push the pushed area along the first direction by a distance corresponding to a width of the selected circuit region and the scaling factor.

18 . A computer program product, comprising a non-transitory, computer-readable medium containing instructions therein which, when executed by a processor, cause the processor to perform:

selecting, in a layout for an integrated circuit (IC), a circuit region to be scaled along a first direction, wherein the selected circuit region comprises:

devices having a plurality of gate patterns arranged at a first gate pattern pitch along the first direction,

first conductive patterns extending along the first direction,

second conductive patterns extending along a second direction transverse to the first direction, and

vias; and

scaling the selected circuit region along the first direction without changing a gate pattern width of the plurality of gate patterns to obtain a modified layout, wherein said scaling comprises

performing re-placement of the devices with the plurality of gate patterns arranged at a second gate pattern pitch along the first direction, the second gate pattern pitch different from the first gate pattern pitch,

rearranging one or more of the second conductive patterns and the vias along the first direction, based on a scaling factor being a ratio of the second gate pattern pitch to the first gate pattern pitch, and

resizing one or more of the first conductive patterns along the first direction, based on the scaling factor.

19 . The computer program product of claim 18 , wherein

at least one second conductive pattern among the second conductive patterns extends in the second direction across a boundary of the selected circuit region, and

the instructions, when executed by the processor, further cause the processor to

before said scaling, perform disconnecting the at least one second conductive pattern into an inner part in the selected circuit region and an outer part outside the selected circuit region, and

after said scaling, perform routing to reconnect the inner part in the scaled circuit region and the outer part.

20 . The computer program product of claim 19 , wherein the instructions, when executed by the processor, further cause the processor to:

in response to setting of a fixed area in the layout, the fixed area comprising a fixed conductive pattern which extends in the second direction across the boundary of the selected circuit region,

perform said disconnecting the at least one second conductive pattern without disconnecting the fixed conductive pattern, and

perform said scaling the selected circuit region, without scaling the fixed area.

Assignments (1)

Continuity (3)

References Cited (10)