Switching power converter module with a heat dissipation structure
An electronic device is disclosed. In one aspect, the electronic device includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, where the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface; a semiconductor device attached to the second surface of the PCB and overlying the thermally conductive region; a transformer having a magnetic core; a shield arranged to partially enclose the transformer and define an opening; and an insert disposed within the opening, attached to the first surface of the PCB and overlying the thermally conductive region.
1 . An electronic device comprising:
a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, wherein the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface;
a semiconductor device attached to the second surface of the PCB and underlying the thermally conductive region;
a transformer having a magnetic core;
a shield arranged to partially enclose the transformer and define an opening, the shield attached to the first surface of the PCB; and
an insert disposed within the opening, attached to the first surface of the PCB and overlying the thermally conductive region.
2 . The electronic device of claim 1 , wherein the insert is formed from copper, aluminum, or an alloy of copper and/or aluminum.
3 . The electronic device of claim 1 , wherein the insert is directly coupled to the shield.
4 . The electronic device of claim 1 , wherein the semiconductor device is a gallium nitride (GaN) switch, or a silicon carbide (SiC) switch, or a silicon switch.
5 . The electronic device of claim 1 , wherein the semiconductor device is a gallium nitride (GaN) diode, or a silicon carbide (SiC) diode, or a silicon diode.
6 . The electronic device of claim 1 , wherein the semiconductor device is electrically coupled to the PCB.
7 . The electronic device of claim 1 , wherein the opening is filled with thermally conductive material.
8 . The electronic device of claim 1 , wherein the insert is thermally coupled to the shield.
9 . The electronic device of claim 1 , wherein a thermally conductive interface is disposed between the shield and the PCB.
10 . The electronic device of claim 1 , wherein a thermally conductive interface is disposed between the PCB and the semiconductor device.
11 . A method of forming an electronic device, the method comprising:
providing a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, wherein the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface;
attaching a semiconductor device to the second surface of the PCB, the semiconductor device underlying the thermally conductive region;
providing transformer having a magnetic core;
providing a shield arranged to partially enclose the transformer, the shield defining an opening and attached to the first surface of the PCB;
disposing an insert within the opening; and
attaching the insert to the first surface of the PCB, wherein the insert is disposed in a region overlying the thermally conductive region.
12 . The method of claim 11 , wherein the insert is formed from copper, aluminum, or an alloy of copper and/or aluminum.
13 . The method of claim 11 , wherein the insert is directly coupled to the shield.
14 . The method of claim 11 , wherein the semiconductor device is a gallium nitride (GaN) switch, or a silicon carbide (SiC) switch, or a silicon switch.
15 . The method of claim 11 , wherein the semiconductor device is a gallium nitride (GaN) diode, or a silicon carbide (SiC) diode, or a silicon diode.
16 . The method of claim 11 , wherein the semiconductor device is electrically coupled to the PCB.
17 . The method of claim 11 , wherein the opening is filled with thermally conductive material.
18 . The method of claim 11 , wherein the insert is thermally coupled to the shield.
19 . The method of claim 11 , wherein a thermally conductive interface is disposed between the shield and the PCB.
20 . An electronic device comprising:
a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, wherein the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface;
a semiconductor device attached to the second surface of the PCB and underlying the thermally conductive region;
a transformer having a magnetic core;
a shield arranged to partially enclose the transformer and define an opening;
an insert disposed within the opening, attached to the first surface of the PCB and overlying the thermally conductive region; and
wherein:
the shield is disposed on a first side of the PCB; and
the semiconductor device is disposed on a second side of the PCB that is opposite the first side.