IP Library › Granted Patent US 12,615,737
Granted Patent B2
US 12,615,737 · App. 18/154,929 · Granted Apr 28, 2026

Heat exchanger

Inventors: Jakub Zborowski (Cracow, PL); Grzegorz Puchala (Cracow, PL)
Assignee: Aptiv Technologies AG
H05K7/20254H05K7/20272H05K7/20872
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Quick Facts
Patent No.
US 12,615,737
App. No.
18/154,929
Granted
Apr 28, 2026
Kind
B2
Abstract

A heat exchanger is described herein. Specifically, the heat exchanger contains plates configured to pass a heat transfer fluid therethrough. The plates are interconnected via features that are integrated into the plates. The heat exchanger also contains frames that are connected to the plates and configured to guide electrical components along an insertion axis such that heat generating surfaces of the electrical components are in contact with the plates on insertion. The heat exchanger is thereby configured to allow for reliable heat dissipation for a plurality of electrical components within a small space while allowing the electrical components to be easily installed and serviced.

Claims (51)

1 . A heat exchanger comprising:

a top plate;

a bottom plate disposed parallel to the top plate and offset from the top plate along a stack axis; and

a plurality of frames connected to respective ends of the top plate and the bottom plate, the frames comprising frame guides configured to guide one or more electrical components as they are inserted along an insertion axis such that each of the electrical components are in contact with a respective surface of either the top plate or the bottom plate once inserted, wherein:

the top plate includes:

a top plate manifold configured to:

provide a heat transfer fluid out of or into the heat exchanger;

provide the heat transfer fluid out of or into a top plate cavity;

mate with a bottom plate port of the bottom plate of the heat exchanger; and

provide the heat transfer fluid out of or into the bottom plate port;

a top plate port configured to:

mate directly with a bottom plate manifold of the heat exchanger; and

provide the heat transfer fluid into or out of the top plate cavity; and the bottom plate includes:

the bottom plate manifold configured to:

provide the heat transfer fluid into or out of the heat exchanger;

provide the heat transfer fluid into or out of a bottom plate cavity;

mate with the top plate port; and provide the heat transfer fluid into or out of the top plate port;

the bottom plate port configured to:

mate directly with the top plate manifold; and

provide the heat transfer fluid out of or into the bottom plate cavity.

2 . The heat exchanger of claim 1 , wherein the top plate manifold and the bottom plate manifold are integrated with the top plate and the bottom plate, respectively.

3 . The heat exchanger of claim 2 , wherein:

the top plate further comprises a top plate body and a top plate cover;

the top plate body comprises the top plate manifold;

the bottom plate further comprises a bottom plate body and a bottom plate cover; and

the bottom plate body comprises the bottom plate manifold.

4 . The heat exchanger of claim 3 , wherein:

the top plate manifold, the bottom plate port, the top plate port, and the bottom plate manifold are on a same side of the top plate and the bottom plate; and

the top plate cover and the bottom plate cover have supporting structures on the same side configured to support the top plate manifold, the bottom plate port, the top plate port, the bottom plate manifold, and connections therebetween.

5 . The heat exchanger of claim 3 , wherein the top plate body and the bottom plate body are casted components.

6 . The heat exchanger of claim 1 , wherein the frames are casted or injection molded components.

7 . The heat exchanger of claim 1 , wherein the frame guides comprise channels configured to guide corresponding features on the electrical components.

8 . The heat exchanger of claim 7 , wherein the channels are curved towards rear ends of the channels such that each of the electrical components are translated in the stack axis toward the respective surfaces.

9 . The heat exchanger of claim 1 , wherein the frame guides are further configured to guide two electrical components between the top plate and the bottom plate.

10 . The heat exchanger of claim 9 , wherein the frame guides are further configured to guide a first of the electrical components to be in contact with the bottom plate and a second of the electrical components to be in contact with the top plate.

11 . The heat exchanger of claim 10 , wherein the frame guides are further configured to guide a third electrical component to be in contact with the top plate.

12 . The heat exchanger of claim 1 , further comprising one or more locking mechanisms configured to secure the electrical components in the heat exchanger upon insertion.

13 . The heat exchanger of claim 12 , wherein the locking mechanisms comprise latches.

14 . The heat exchanger of claim 12 , wherein the locking mechanisms are attached to at least one of the top plate or the bottom plate.

15 . The heat exchanger of claim 1 , wherein:

the top plate comprises one or more top plate guides configured to guide and secure one or more of the electrical components in a horizontal axis that is perpendicular to the insertion axis and the stack axis; and

the bottom plate comprises one or more bottom plate guides configured to align another of the electrical components in the horizontal axis.

16 . The heat exchanger of claim 1 , wherein:

the top plate comprises one or more top plate alignment features disposed on a rear side of the top plate and configured to guide and secure one or more of the electrical components in the stack axis; and

the bottom plate comprises one or more bottom plate alignment features disposed on a rear side of the bottom plate and configured to guide and secure one or more of the electrical components in the stack axis.

17 . The heat exchanger of claim 16 , wherein the top plate alignment features and the bottom plate alignment features are configured to guide and secure the electrical components when the electrical components are near final positions of insertion.

18 . The heat exchanger of claim 1 , wherein the top plate and the bottom plate comprise electrical board attachment features on a rear end of the top plate and the bottom plate, the electrical board attachment features configured to secure an electrical board to the top plate and the bottom plate.

19 . The heat exchanger of claim 1 , wherein:

the top plate manifold comprises a top plate heat exchanger port configured for the provision of the heat transfer fluid out of or into the heat exchanger;

the bottom plate manifold comprises a bottom plate heat exchanger port configured for the provision of the heat transfer fluid into or out of the heat exchanger; and

the top plate heat exchanger port and the bottom plate heat exchanger port are located proximate to each other.

Assignments (4)
MERGER Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES (2) S.À R.L.
To: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
Reel/Frame 066566/0173 →
ENTITY CONVERSION Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES LIMITED
To: APTIV TECHNOLOGIES (2) S.À R.L.
Reel/Frame 066746/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2024
From: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
To: APTIV TECHNOLOGIES AG
Reel/Frame 066551/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2023
From: ZBOROWSKI, JAKUB; PUCHALA, GRZEGORZ
To: APTIV TECHNOLOGIES LIMITED
Reel/Frame 062382/0566 →
Continuity (2)
Provisional Application 63268415 · Feb 23, 2022
Related Publication 20230269905A1 · Aug 24, 2023
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