Electronic device comprising heat dissipation structure
According to various embodiments, an electronic device includes: a housing; a support member which is disposed in the inner space of the housing, and which includes a first surface oriented in a first direction and a second surface oriented in a second direction that is opposite to the first surface; at least one pattern formed to have a length in a designated direction in at least a part of the first surface and/or the second surface of the support member; and a heat dissipation coating layer stacked on the first surface and/or the second surface on which the at least one pattern is formed, wherein the at least one pattern may include a plurality of recesses spaced apart from each other at designated intervals and formed on the first surface and/or the second surface.
1 . An electronic device comprising:
a housing;
a support member disposed in an inner space of the housing and comprising a first surface facing a first direction and a second surface facing a second direction opposite to the first direction;
at least one pattern provided in at least one of a portion of the first surface and a portion of the second surface of the support member to have a length in a predetermined direction; and
a heat dissipation coating layer laminated on at least one of the first surface and the second surface on which the at least one pattern is provided,
wherein the at least one pattern comprises multiple recesses spaced apart from each other by a predetermined interval and provided in at least one of the first surface and the second surface, the multiple recesses having a predetermined depth lower than at least one of the first surface and the second surface,
wherein the at least one pattern comprises:
a first pattern comprising multiple first recesses provided in at least one of the first surface and the second surface to have a length along a third direction; and
a second pattern comprising multiple second recesses provided in at least one of the first surface and the second surface to have a length along a fourth direction that is not parallel to the third direction, and
wherein the multiple first recesses and the multiple second recesses are formed on a same surface of the support member, and the same surface of the support member comprises:
a first region comprising only the multiple first recesses having the length along the third direction, among the multiple first recesses and the multiple second recesses; and
a second region, different from the first region, and comprising only the multiple second recesses having the length along the fourth direction, among the multiple first recesses and the multiple second recesses.
2 . The electronic device of claim 1 , wherein the heat dissipation coating layer is further laminated to correspond to shapes of the multiple recesses.
3 . The electronic device of claim 1 , wherein the heat dissipation coating layer is further laminated to fill the multiple recesses and to have a surface parallel to at least one of the first surface and the second surface.
4 . The electronic device of claim 1 , wherein the heat dissipation coating layer comprises a copper plating layer containing carbon mixed in a predetermined ratio.
5 . The electronic device of claim 1 , wherein the multiple first recesses are provided to have a length along a direction parallel to a length direction of the electronic device.
6 . The electronic device of claim 1 , wherein the multiple recesses are provided linearly.
7 . The electronic device of claim 1 , wherein the support member further comprises at least one through hole at least partially provided therein,
wherein the heat dissipation coating layer comprises:
a first heat dissipation coating layer disposed on the first surface;
a second heat dissipation coating layer disposed on the second surface; and
a third heat dissipation coating layer at least partially filled in the at least one through hole, and
wherein the first heat dissipation coating layer disposed on the first surface is thermally connected to the second heat dissipation coating layer via the third heat dissipation coating layer.
8 . The electronic device of claim 7 , further comprising:
a first electric element disposed in the inner space corresponding to the first surface and thermally connected to the first heat dissipation coating layer; and
a second electric element disposed in the inner space corresponding to the second surface and thermally connected to the second heat dissipation coating layer,
wherein the first electric element is disposed at a position that does not overlap the second electric element when the first surface is viewed from above.
9 . The electronic device of claim 1 , further comprising:
at least one electric element disposed in the inner space; and
a heat transfer member disposed between the at least one electric element and the heat dissipation coating layer,
wherein the heat transfer member is thermally connected to the at least one electric element and the heat dissipation coating layer.
10 . The electronic device of claim 9 , wherein the heat transfer member is disposed to be in contact with the at least one electric element and the heat dissipation coating layer.
11 . The electronic device of claim 1 , wherein a width of each of the multiple recesses is equal to or smaller than the interval between the multiple recesses.
12 . The electronic device of claim 1 , wherein the housing includes a front cover disposed to at least partially correspond to the first surface, a rear cover disposed to at least partially correspond to the second surface, and a lateral member surrounding the inner space between the front cover and the rear cover, and
wherein the support member extends from the lateral member to the inner space.
13 . The electronic device of claim 12 , wherein the lateral member and/or the support member is at least partially made of a metal material.
14 . The electronic device of claim 12 , further comprising a display disposed between the first surface and the front cover in the inner space to be at least partially visible from the outside through the front cover.
15 . An electronic device comprising:
a housing;
a support member disposed in an inner space of the housing and having a surface facing a first direction;
at least one pattern provided in at least a portion of the surface of the support member to have a length in a predetermined direction; and
a heat dissipation coating layer laminated on the surface of the support member on which the at least one pattern is provided,
wherein the at least one pattern comprises multiple recesses spaced apart from each other by a predetermined interval and provided on the surface of the support member, the multiple recesses having a predetermined depth lower than the surface of the support member,
wherein the at least one pattern comprises:
a first pattern comprising multiple first recesses having a length along a second direction; and
a second pattern comprising multiple second recesses having a length along a third direction that is not parallel to the second direction, and
wherein the surface of the support member comprises:
a first region comprising only the multiple first recesses having the length along the second direction, among the multiple first recesses and the multiple second recesses; and
a second region, different from the first region, and comprising only the multiple second recesses having the length along the third direction, among the multiple first recesses and the multiple second recesses.