Electromagnetic shielding structure, manufacturing method, and communication terminal
Disclosed in the present invention are an electromagnetic shielding structure, a manufacturing method and a communication terminal. The electromagnetic shielding structure comprises a module substrate, which is formed with a plurality of grounding holes penetrating through the module substrate, and the plurality of grounding holes jointly define a mounting area; a device to be shielded, which is attached to the module substrate and located in the mounting area; a plurality of grounding bonding pads, which are respectively arranged in the grounding holes in a penetrating manner; and a plurality of wires, wherein the two ends of each wire are respectively connected to two different grounding bonding pads, such that the plurality of wires jointly form a shielding layer erected above the device to be shielded.
1 . An electromagnetic shielding structure, comprising:
a module substrate, wherein a plurality of ground holes running through the module substrate are provided on the module substrate, and the plurality of ground holes are arranged on all four sides of the module substrate to jointly define a mounting area, wherein the mounting area is an enclosed area or an open area;
a to-be-shielded component, mounted on the module substrate and located in the mounting area;
a plurality of ground pads, wherein each ground pad is disposed in a respective ground hole, and both ends of each ground pad extend out of the corresponding ground hole; and
a plurality of wires, wherein the plurality of wires are divided into a first group and a second group; wherein
two ends of each wire in the first group are respectively connected to two different ground pads on a first pair of opposite sides of the module substrate, such that the wires of the first group are arranged over the to-be-shielded component in a first direction;
two ends of each wire in the second group are respectively connected to two different ground pads on a second pair of opposite sides of the module substrate, such that the wires of the second group are arranged over the to-be-shielded component in a second direction;
the wires of the first group and the second group cross each other to jointly form a grid-like shield layer over the to-be-shielded component, and a set included angle α is formed between the first direction and the second direction.
2 . The electromagnetic shielding structure according to claim 1 , wherein
the plurality of ground holes are divided into M groups, each group of ground holes defines a mounting area, the mounting areas are not overlapped with each other, and Mis a positive integer greater than 1.
3 . The electromagnetic shielding structure according to claim 2 , wherein
a quantity of the to-be-shielded components is M, and each to-be-shielded component is located in a respective one of the mounting areas.
4 . The electromagnetic shielding structure according to claim 1 , wherein a value of the set included angle α ranges from 0° to 90°.
5 . The electromagnetic shielding structure according to claim 1 , wherein
the mounting area is an open area, the plurality of wires are divided into two groups, each wire in one group of wires is arranged over the to-be-shielded component in a third direction, and each wire in the other group of wires is connected between two adjacent ground pads.
6 . The electromagnetic shielding structure according to claim 1 , wherein
a height of each wire is adjustable, so that a distance between the shield layer and the to-be-shielded component is adjustable.
7 . The electromagnetic shielding structure according to claim 1 , further comprising a plastic package body, wherein the plastic package body is injection molded on the module substrate to seal the shield layer and the to-be-shielded component.
8 . A communication terminal, comprising the electromagnetic shielding structure according to claim 1 .
9 . A manufacturing method for an electromagnetic shielding structure, comprising the following steps:
providing a rectangular module substrate, and forming a plurality of ground holes running through the module substrate on all four sides of the rectangular module substrate, so that the plurality of ground holes jointly define an enclosed mounting area or an open mounting area;
mounting a to-be-shielded component on the module substrate, so that the to-be-shielded component is located in the mounting area of the module substrate;
disposing a plurality of ground pads in the plurality of ground holes of the module substrate in sequence, and enabling both ends of each ground pad to extend out of the corresponding ground hole;
dividing a plurality of wires into two groups, wherein two ends of each wire in one group of wires cross over the to-be-shielded component in a first direction and are connected to two ground pads on the upper and lower sides respectively, so that the plurality of wires in the one group are arranged over the to-be-shielded component in the first direction; and two ends of each wire in the other group of wires cross over the to-be-shielded component in a second direction and are connected to two ground pads on the left and right sides respectively, so that the plurality of wires in the other group are arranged over the to-be-shielded component in the second direction, thereby jointly forming a grid-like shield layer through the crossing of the two groups of wires to replace additional shielding materials; wherein a set included angle α is formed between the first direction and the second direction; and
based on product requirements, adjusting a height of each wire, thereby adjusting a distance between the grid-like shield layer and the to-be-shielded component;
injection molding a plastic material directly on the module substrate to seal the shield layer and the to-be-shielded component.