Pressure-sensitive adhesive sheet for semiconductor processing
Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent solvent resistance. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer, and a base material. The pressure-sensitive adhesive composition has a swelling degree S A of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour.
1 . A pressure-sensitive adhesive sheet for semiconductor processing, comprising:
a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer; and
a base material,
wherein the pressure-sensitive adhesive composition has a swelling degree S A of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour,
wherein the pressure-sensitive adhesive composition is a UV-curable pressure-sensitive adhesive, and
wherein a content ratio of a cross-linking agent is in a range from 0.01 part by weight to 0.75 part by weight with respect to 100 parts by weight of the base polymer.
2 . The pressure-sensitive adhesive sheet for semiconductor processing according to claim 1 , wherein a content ratio of an ester of one of acrylic acid or methacrylic acid having an alkyl group having 8 or more carbon atoms in all monomer components for forming the base polymer is 50 wt % or more.
3 . The pressure-sensitive adhesive sheet for semiconductor processing according to claim 1 , wherein the base polymer is a polymer having a carbon-carbon double bond introduced thereinto.
4 . The pressure-sensitive adhesive sheet for semiconductor processing according to claim 1 , wherein the base material contains one of a polyester-based resin or a polyolefin-based resin.
5 . The pressure-sensitive adhesive sheet for semiconductor processing according to claim 1 , wherein the pressure-sensitive adhesive composition further contains a phosphoric acid ester-based surfactant.
6 . The pressure-sensitive adhesive sheet for semiconductor processing according to claim 5 , wherein a content of the phosphoric acid ester-based surfactant is 0.03 part by weight or more with respect to 100 parts by weight of the base polymer.
7 . The pressure-sensitive adhesive sheet for semiconductor processing according to claim 1 , wherein the pressure-sensitive adhesive sheet for semiconductor processing is used in a semiconductor processing process including a solvent washing step.