IP Library Granted Patent US 12,620,546
Granted Patent B2
US 12,620,546 · App. 18/220,549 · Granted May 5, 2026

Creating ion energy distribution functions (IEDF)

Inventors: Leonid Dorf (San Jose, CA); Travis Koh (Santa Clara, CA); Olivier Luere (San Jose, CA); Olivier Joubert (Meylan, FR); Philip A. Kraus (San Jose, CA); Rajinder Dhindsa (Pleasanton, CA); James Rogers (Los Gatos, CA)
Assignee: APPLIED MATERIALS, INC.
H01J37/08H01J37/248H01J37/32577H01J37/32706H01J37/32715
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Quick Facts
Patent No.
US 12,620,546
App. No.
18/220,549
Granted
May 5, 2026
Kind
B2
Abstract

Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse-bias. In an embodiment, a method includes applying a negative jump voltage to an electrode of a process chamber to set a wafer voltage for a wafer, modulating an amplitude of the wafer voltage to produce a train of groups of pulse bursts with different amplitudes, and repeating the modulating of the amplitude of the wafer voltage to repeat the train of the groups of pulse bursts to create an ion energy distribution function having more than one energy peak. In some embodiments, the negative jump voltage can include a single-cycle voltage waveform with a voltage ramp during an ion-current phase, in which the voltage ramp can be positive or negative and a duration of the ion-current phase can comprise more or less than fifty percent of a period of the waveform.

Claims (30)

1 . A method, comprising:

applying a negative jump voltage to an electrode of a process chamber to set a wafer voltage for a wafer, wherein the negative jump voltage comprises a repeating single-cycle voltage waveform with a voltage ramp during an ion-current phase;

modulating an amplitude of the wafer voltage to produce a train of groups of pulse bursts with different amplitudes, wherein each group of pulse bursts is composed of pulses having a same amplitude; and

repeating the modulating of the amplitude of the wafer voltage to repeat the train of the groups of pulse bursts to create an ion energy distribution function having one or more energy peaks; and

wherein the relative number of bursts with a given amplitude in a train determines the relative portion of ions at a specific energy corresponding to that amplitude.

2 . The method of claim 1 , comprising:

applying a positive jump voltage to the electrode of the process chamber to neutralize a surface of the wafer.

3 . The method of claim 2 , wherein the positive jump voltage is applied to the electrode of the process chamber prior to applying the negative jump voltage.

4 . The method of claim 1 , wherein the desired ion energy distribution function is created to induce a specific bias voltage waveform on the wafer.

5 . The method of claim 1 , comprising:

modulating the wafer voltage at different points in time to create the ion energy distribution function having more than one energy peak.

6 . The method of claim 5 , wherein an ion fraction for each of the energy peaks is determined by a number of pulses produced during a respective modulation of the wafer voltage at the different points in time.

7 . The method of claim 1 , further comprising:

applying a positive jump voltage to an electrode of a process chamber to neutralize a surface of a wafer; and

applying a ramp voltage to the electrode that at least one of overcompensates or undercompensates for ion current on the wafer.

8 . The method of claim 7 , wherein applying a ramp voltage to the electrode that overcompensates for ion current on the wafer comprises applying a ramp voltage to the electrode that comprises a slope that is more negative than is required to maintain a constant voltage on the wafer.

9 . The method of claim 8 , wherein a minimum voltage and a maximum voltage of a current induced on the wafer determine a width of a resulting ion energy distribution function.

10 . The method of claim 7 , wherein applying a ramp voltage to the electrode that undercompensates for ion current on the wafer comprises applying a ramp voltage to the electrode that comprises a slope that is less negative than is required to maintain a constant voltage on the wafer.

11 . The method of claim 10 , wherein a minimum voltage and a maximum voltage of a current induced on the wafer determine a width of a resulting ion energy distribution function.

12 . The method of claim 7 , comprising:

adjusting a slope of the ramp voltage to create a desired ion energy distribution function to induce a specific bias voltage waveform on the wafer.

13 . The method of claim 1 , further comprising:

a period in between the groups of pulses where no voltage pulses are provided to the electrode.

14 . The method of claim 1 , wherein the voltage ramp during the ion-current phase comprises a positive voltage ramp.

15 . The method of claim 1 , wherein the voltage ramp during the ion-current phase comprises a negative voltage ramp.

16 . The method of claim 1 , wherein the voltage ramp during the ion-current phase comprises no voltage ramp.

17 . The method of claim 1 , wherein a duration of the ion-current phase comprises less than fifty percent of a period of the waveform.

18 . The method of claim 1 , wherein a duration of the ion-current phase comprises more than fifty percent of a period of the waveform.

19 . The method of claim 1 , wherein the waveform comprises a positive peak voltage.

20 . The method of claim 1 , wherein the waveform comprises a negative peak voltage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2023
From: DORF, LEONID; KOH, TRAVIS; LUERE, OLIVIER; JOUBERT, OLIVIER; KRAUS, PHILIP A.; DHINDSA, RAJINDER; ROGERS, JAMES
To: APPLIED MATERIALS, INC.
Reel/Frame 064448/0508 →
Continuity (6)
Continuation In Part 17377639 · Jul 16, 2021
Continuation 16867034 · May 5, 2020
Continuation 16405377 · May 7, 2019
Continuation 15834939 · Dec 7, 2017
Provisional Application 62433204 · Dec 12, 2016
Related Publication 20230352264A1 · Nov 2, 2023
References Cited (59)
US 6201208B1 · Wendt · 2001 [cited by examiner]
US 6544895B1 · Donohoe · 2003 [cited by examiner]
US 8140292B2 · Wendt · 2012 [cited by examiner]
US 8980760B2 · Agarwal · 2015 [cited by examiner]
US 9105447B2 · Brouk · 2015 [cited by examiner]
US 9208992B2 · Brouk · 2015 [cited by examiner]
US 9210790B2 · Hoffman et al. · 2015 [cited by applicant]
US 9287086B2 · Brouk et al. · 2016 [cited by applicant]
US 9287092B2 · Brouk · 2016 [cited by examiner]
US 9309594B2 · Hoffman et al. · 2016 [cited by applicant]
US 9362089B2 · Brouk · 2016 [cited by examiner]
US 9685297B2 · Carter · 2017 [cited by examiner]
US 9704690B2 · Kim · 2017 [cited by examiner]
US 9767988B2 · Brouk · 2017 [cited by examiner]
US 9887069B2 · Fischer · 2018 [cited by examiner]
US 10312048B2 · Dorf · 2019 [cited by examiner]
US 10510575B2 · Kraus et al. · 2019 [cited by applicant]
US 10685807B2 · Dorf · 2020 [cited by examiner]
US 11069504B2 · Dorf · 2021 [cited by examiner]
US 20060088655A1 · Collins · 2006 [cited by examiner]
US 20070188104A1 · Chistyakov et al. · 2007 [cited by applicant]
US 20080032427A1 · Lee et al. · 2008 [cited by applicant]
US 20100072172A1 · Ui et al. · 2010 [cited by applicant]
US 20100190350A1 · Yatsuda et al. · 2010 [cited by applicant]
US 20110000896A1 · Hadidi et al. · 2011 [cited by applicant]
US 20120052599A1 · Brouk et al. · 2012 [cited by applicant]
US 20120228263A1 · Ui et al. · 2012 [cited by applicant]
US 20140061156A1 · Brouk et al. · 2014 [cited by applicant]
US 20140062303A1 · Hoffman et al. · 2014 [cited by applicant]
US 20150144596A1 · Brouk et al. · 2015 [cited by applicant]
US 20160020072A1 · Brouk · 2016 [cited by examiner]
US 20160163514A1 · Fisk, II et al. · 2016 [cited by applicant]
US 20160260384A1 · Marakhtanov et al. · 2016 [cited by applicant]
US 20170062186A1 · Coumou et al. · 2017 [cited by applicant]
US 20170250056A1 · Boswell et al. · 2017 [cited by applicant]
US 20170278665A1 · Carter et al. · 2017 [cited by applicant]
US 20170358431A1 · Dorf · 2017 [cited by examiner]
US 20180005802A1 · Chen et al. · 2018 [cited by applicant]
US 20180019100A1 · Brouk et al. · 2018 [cited by applicant]
US 20180166249A1 · Dorf · 2018 [cited by examiner]
US 20200020510A1 · Shoeb et al. · 2020 [cited by applicant]
US 20210343496A1 · Dorf · 2021 [cited by examiner]
US 20230352264A1 · Dorf · 2023 [cited by examiner]
US 20240404785A1 · Futakuchi · 2024 [cited by examiner]
EP 3321953B1 · 2019 [cited by examiner]
JP H0821355B2 · 1996 [cited by examiner]
JP H09326383A · 1997 [cited by applicant]
JP 2004193564A · 2004 [cited by applicant]
JP 2012104382 · 2012 [cited by applicant]
JP 7703507B2 · 2025 [cited by examiner]
KR 1020150032638A · 2015 [cited by applicant]
WO WO9213268A1 · 1992 [cited by examiner]
WO WO2014035897A1 · 2014 [cited by applicant]
WO WO2014036000A1 · 2014 [cited by applicant]
WO WO2014035899A1 · 2014 [cited by applicant]
WO WO2019194970A1 · 2019 [cited by examiner]
PCT International Search Report and Written Opinion for PCT/US2024/037502 dated Oct. 25, 2024. [cited by applicant]
International Search Report and Written Opinion mailed Mar. 30, 2018 for PCT Application No. PCT/US 2017/065546. [cited by applicant]
Search Report for CN2020115891131, dated Jul. 20, 2023. [cited by applicant]