Chip transferring apparatus for self-assembly and method for supplying semiconductor light emitting diode
A chip transferring apparatus for supplying a micro-LED provides a chip tray for carrying semiconductor light emitting diodes in a fluid received in an assembly chamber. The transferring apparatus includes a tray unit for receiving a plurality of semiconductor light emitting diodes, a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets, and a transfer unit configured to move the tray unit and the chip alignment unit. The transfer unit can vertically move one of the tray unit and the chip alignment unit with respect to the other one thereof.
1 . A chip transferring apparatus for transferring semiconductor light emitting devices in a fluid accommodated in an assembly chamber to an assembly surface of an assembly substrate, the chip transferring apparatus comprising:
a tray unit for accommodating a plurality of semiconductor light emitting devices, wherein the tray unit comprises a plurality of recesses;
a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets disposed at the same distance as the plurality of recesses;
a transfer unit configured to transfer the tray unit and the chip alignment unit, unit; and
a connection unit connecting the tray unit and the chip alignment unit to the transfer unit,
wherein the transfer unit is configured to vertically move the tray unit with respect to the chip alignment unit.
2 . The chip transferring apparatus according to claim 1 , wherein the transfer unit is configured to bring the tray unit closer to the assembly substrate within a first distance at which some of the plurality of semiconductor light emitting devices accommodated in the tray unit are aligned on a surface of the assembly substrate submerged in the fluid.
3 . The chip transferring apparatus according to claim 2 , wherein the transfer unit is configured to bring the tray unit closer to the assembly substrate within the first distance while the tray unit and the chip alignment unit are spaced apart from each other by a predetermined distance.
4 . The chip transferring apparatus according to claim 3 , wherein the transfer unit is configured to separate the tray unit from the assembly substrate by the first distance or more after some of the plurality of semiconductor light emitting devices accommodated in the tray unit move to the assembly substrate.
5 . The chip transferring apparatus according to claim 4 , wherein the transfer unit is configured to vertically move so that the tray unit and the chip alignment unit are adjacent to each other within the first distance after some of the plurality of semiconductor light emitting devices accommodated in the tray unit are moved to the assembly substrate.
6 . The chip transferring apparatus according to claim 1 , wherein the plurality of recesses and the plurality of magnets are arranged to overlap each other.
7 . The chip transferring apparatus according to claim 1 , wherein the connection unit includes first and second connection units, the first connection unit is configured to connect a portion of the transfer unit in which a vertical movement does not occur and the chip alignment unit.
8 . The chip transferring apparatus according to claim 7 , wherein the second connection unit is configured to connect a portion of the transfer unit in which a vertical movement occurs and the tray unit.
9 . The chip transferring apparatus according to claim 1 , wherein the transfer unit is configured to transport the tray unit and the chip alignment unit together horizontally with respect to a bottom surface of the assembly chamber.
10 . The chip transferring apparatus according to claim 9 , wherein when the chip alignment unit is being fixed, the tray unit is configured to move vertically with respect to the bottom surface of the assembly chamber.
11 . The chip transferring apparatus according to claim 1 , wherein the connection unit include first and second connection units, and
wherein the first connection unit is connected to the chip alignment unit.
12 . The chip transferring apparatus according to claim 11 , wherein the first connection unit is configured to move horizontally and does not move in a vertical direction.
13 . The chip transferring apparatus according to claim 11 , wherein the second connection unit is connected to the tray unit.
14 . The chip transferring apparatus according to claim 13 , wherein the second connection unit is configured to move perpendicularly to a bottom surface of the assembly chamber.