Thermal conductive silicone composition
A thermal conductive silicone composition includes (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm 2 /s; (B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 μm; and (C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of −20 to 100° C. The resulting thermal conductive silicone composition has excellent thermal conduction property.
1 . A thermal conductive silicone composition comprising the following components (A) to (C):
(A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm 2 /s, wherein the organopolysiloxane comprises an organopolysiloxane having a hydrolysable group represented by the following general formula (2) and a linear organopolysiloxane represented by the following formula (3):
wherein R 2 represents an alkyl group having a carbon number of 1 to 6, R 3 each independently represents an unsubstituted or substituted monovalent hydrocarbon group having a carbon number of 1 to 18 without containing an alkenyl group, and b is 5 to 120,
wherein R 1 does not comprise an alkenyl group, and each independently represents an unsubstituted or substituted monovalent hydrocarbon group having a carbon number of 1 to 18, and m is a number with which the organopolysiloxane has a kinematic viscosity at 25° C. of 10 to 500,000 mm 2 /s,
wherein the component (A) comprises the hydrolysable group-containing organopolysiloxane represented by the general formula (2) in an amount of 30 to 90% by mass relative to the total mass of the component (A);
(B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 μm; and
(C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of −20 to 100° C.
2 . The thermal conductive silicone composition according to claim 1 , wherein
the component (B) is one or more selected from a zinc oxide powder, an alumina powder, a boron nitride powder, an aluminum nitride powder, an aluminum hydroxide powder, and a magnesium oxide powder.
3 . The thermal conductive silicone composition according to claim 1 , wherein
the gallium alloy of the component C is one or more selected from a Ga—In alloy, a Ga—Sn—Zn alloy, a Ga—In—Sn alloy, and a Ga—In—Bi—Sn alloy.
4 . The thermal conductive silicone composition according to claim 2 , wherein
the gallium alloy of the component (C) is one or more selected from a Ga—In alloy, a Ga—Sn—Zn alloy, a Ga—In—Sn alloy, and a Ga—In—Bi—Sn alloy.