Wafer chuck table and wafer chuck system
A wafer chuck table includes a center plate having a plurality of first protrusions each having an upper end at least partially defining a first reference plane, segmented plates arranged around the center plate and having a plurality of second protrusions, each having an upper end at least partially defining a second reference plane such that the segmented plates have separate, respective pluralities of second protrusions at least partially defining separate, respective second reference planes, and driving units configured to adjust an inclination angle of the segmented plates with respect to the center plate so that the first reference plane and the separate, respective second reference planes are coplanar.
1 . A wafer chuck table, comprising:
a center plate having a plurality of first protrusions, each first protrusion of the plurality of first protrusions having an upper end at least partially defining a first reference plane;
segmented plates arranged around the center plate, each of the segmented plates having a plurality of second protrusions, each second protrusion of the plurality of second protrusions having an upper end at least partially defining a second reference plane such that the segmented plates have separate, respective pluralities of second protrusions at least partially defining separate, respective second reference planes; and
driving units configured to adjust a respective inclination angle of each of the segmented plates with respect to the center plate so that the first reference plane and the separate, respective second reference planes are coplanar.
2 . The wafer chuck table of claim 1 , wherein
the segmented plates have an inner edge adjacent to a circumference of the center plate and an outer edge opposite the inner edge, and
the wafer chuck table further comprises coupling members connecting the center plate to the inner edge of the segmented plates.
3 . The wafer chuck table of claim 2 , wherein the segmented plates and the center plate are hinge-coupled by the coupling members.
4 . The wafer chuck table of claim 2 , wherein the driving units each include at least one linear actuator adjacent to the outer edge of the segmented plates and at least one lifting shaft configured to press one side of each of the segmented plates according to driving of the at least one linear actuator.
5 . The wafer chuck table of claim 1 , wherein
the center plate has a first surface from which the plurality of first protrusions protrude, and
the segmented plates each have a second surface from which the plurality of second protrusions protrude.
6 . The wafer chuck table of claim 5 , wherein, when the first reference plane and the separate, respective second reference planes are aligned to be coplanar by the driving units, the second surface has a particular inclination angle with respect to the first surface.
7 . The wafer chuck table of claim 1 , wherein the segmented plates have an inner edge adjacent to a circumference of the center plate and an outer edge opposite to the inner edge.
8 . The wafer chuck table of claim 7 , wherein the driving units include
at least one first driving unit adjacent to the outer edge of the segmented plates and configured to adjust a spacing distance of the outer edge of the segmented plates with respect to the first reference plane, and
at least one second driving unit adjacent to the inner edge and configured to adjust a spacing distance of the inner edge of the segmented plates with respect to the first reference plane.
9 . The wafer chuck table of claim 7 , wherein the upper end of each second protrusion of the plurality of second protrusions is inclined toward the outer edge of the segmented plates.
10 . The wafer chuck table of claim 1 , wherein the plurality of second protrusions are integrated with each of the segmented plates to form protrusion groups.
11 . The wafer chuck table of claim 10 , wherein
the protrusion groups define a plurality of corresponding second reference planes, respectively, and
the driving units are configured to adjust an inclination angle of each of the segmented plates with respect to the center plate to be different from an inclination angle of at least one other segmented plate of the segmented plates so that the plurality of corresponding second reference planes are coplanar to the first reference plane.
12 . The wafer chuck table of claim 1 , wherein
the center plate has a first surface from which the plurality of first protrusions protrude, and
the wafer chuck table further comprises,
cover plates on the segmented plates, respectively, and having a plurality of through holes through which the plurality of second protrusions extend and an upper surface coplanar to the first surface, the plurality of second protrusions protruding from the upper surface.
13 . The wafer chuck table of claim 12 , wherein, when the first reference plane and the second reference plane are aligned to be coplanar by the driving units, the upper surfaces of the cover plates are coplanar to the first surface.