IP Library Granted Patent US 12,631,493
Granted Patent B2
US 12,631,493 · App. 18/595,596 · Granted May 19, 2026

Infrared sensor and method for manufacturing the same

Inventors: Noriyuki Tonouchi (Tokyo, JP); Taizo Shibuya (Tokyo, JP)
Assignee: NEC CORPORATION
G01J5/20B82Y20/00
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Quick Facts
Patent No.
US 12,631,493
App. No.
18/595,596
Granted
May 19, 2026
Kind
B2
Abstract

An object of the present invention is to provide an infrared sensor capable of efficient light-to-heat conversion by thickening the light-absorbing layer, and a method for manufacturing the same. An infrared sensor comprising: an infrared reflecting mirror; a first light-absorbing layer formed on the infrared reflecting mirror and being a polymer resin layer in which light-absorbing nanoparticles are dispersed; two electrodes formed on the first light-absorbing layer; a light-detecting part that at least partially overlaps and electrically contacts with the two electrodes; a second light-absorbing layer formed on the light-detecting part and being a polymer resin layer in which light-absorbing nanoparticles are dispersed; and a metal thin film formed on the second light-absorbing layer.

Claims (31)

1 . An infrared sensor comprising:

an infrared reflecting mirror;

a first light-absorbing layer formed on the infrared reflecting mirror and being a polymer resin layer in which light-absorbing nanoparticles are dispersed;

two electrodes formed on the first light-absorbing layer;

a light-detecting part that at least partially overlaps and electrically contacts with the two electrodes;

a second light-absorbing layer formed on the light-detecting part and being a polymer resin layer in which light-absorbing nanoparticles are dispersed; and

a metal thin film formed on the second light-absorbing layer.

2 . The infrared sensor according to claim 1 , wherein the light-absorbing nanoparticles are silicon oxide and/or silicon nitride.

3 . The infrared sensor according to claim 1 , wherein a particle size parameter πD/λ of the light-absorbing nanoparticles (D: particle size, λ: detection wavelength) is less than or equal to 1.

4 . The infrared sensor according to claim 1 , wherein the absorption rate of electromagnetic waves with a wavelength of 5 μm or less of the polymer resin is 0.1 or less.

5 . The infrared sensor according to claim 4 , wherein the polymer resin is polystyrene.

6 . The infrared sensor according to claim 1 , wherein the light-detecting part is one or more selected from carbon nanotube, vanadium oxide and amorphous silicon.

7 . The infrared sensor according to claim 1 , wherein the total thickness of the first light-absorbing layer and the second light-absorbing layer is 2.5 μm to 10 μm.

8 . The infrared sensor according to claim 1 , wherein the distance between the infrared reflecting mirror and the metal thin film is an odd multiple of ¼ of the detection wavelength.

9 . The infrared sensor according to claim 1 , further comprising a substrate having a heat insulating surface under the infrared reflecting mirror.

10 . A method of manufacturing an infrared sensor comprising:

preparing an infrared reflecting mirror;

dispersing light-absorbing nanoparticles in a polymer resin to form a material for a first light-absorbing layer;

applying the material for the first light-absorbing layer on the infrared reflecting mirror to form a first light-absorbing layer;

forming two electrodes on the first light-absorbing layer;

forming a light-detecting part that at least partially overlaps and electrically contacts with the two electrodes;

dispersing light-absorbing nanoparticles in a polymer resin to form a material for a second light-absorbing layer;

applying the material for the second light-absorbing layer on the light-detecting part to form a second light-absorbing layer; and

forming a metal thin film on the second light-absorbing layer.

11 . The infrared sensor according to claim 2 , wherein a particle size parameter πD/λ of the light-absorbing nanoparticles (D: particle size, λ: detection wavelength) is less than or equal to 1.

12 . The infrared sensor according to claim 2 , wherein the absorption rate of electromagnetic waves with a wavelength of 5 μm or less of the polymer resin is 0.1 or less.

13 . The infrared sensor according to claim 12 , wherein the polymer resin is polystyrene.

14 . The infrared sensor according to claim 2 , wherein the light-detecting part is one or more selected from carbon nanotube, vanadium oxide and amorphous silicon.

15 . The infrared sensor according to claim 2 , wherein the total thickness of the first light-absorbing layer and the second light-absorbing layer is 2.5 μm to 10 μm.

16 . The infrared sensor according to claim 2 , wherein the distance between the infrared reflecting mirror and the metal thin film is an odd multiple of ¼ of the detection wavelength.

17 . The infrared sensor according to claim 2 , further comprising a substrate having a heat insulating surface under the infrared reflecting mirror.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2024
From: TONOUCHI, NORIYUKI; SHIBUYA, TAIZO
To: NEC CORPORATION
Reel/Frame 066647/0787 →
Priority Claims (1)
JP 2023-045026 · Mar 22, 2023 · national
Continuity (1)
Related Publication 20250003804A1 · Jan 2, 2025
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