Semiconductor light-emitting device self-assembly apparatus to solve assembly defect generated during self-assembly
Discussed is a self-assembly apparatus of a semiconductor light emitting diode. The self-assembly apparatus can include a fluid chamber including a space to accommodate a fluid and semiconductor light emitting diodes having a magnetic metal, a magnet to apply a magnetic force to the semiconductor light emitting diodes in a state where an assembly surface of a board is submerged in the fluid, a power supply portion to induce an electric field between assembly electrodes provided on the board so that the semiconductor light emitting diodes become seated at predetermined positions of the board while the semiconductor light emitting diodes are moved by a change in a position of the magnet, and a repair portion disposed in the fluid chamber and to separate some of the semiconductor light emitting diodes seated on the board from the board. The repair portion can be configured to spray and suction the fluid.
1 . A self-assembly apparatus of a semiconductor light emitting diode, the self-assembly apparatus comprising:
a fluid chamber including a space configured to accommodate a fluid and a plurality of semiconductor light emitting diodes having a magnetic metal;
a magnet configured to apply a magnetic force to the plurality of semiconductor light emitting diodes in a state where an assembly surface of a board is submerged in the fluid;
a power supply portion configured to induce an electric field between assembly electrodes provided on the board so that the plurality of semiconductor light emitting diodes become seated at predetermined positions of the board while the plurality of semiconductor light emitting diodes are moved by a change in a position of the magnet; and
a repair portion disposed in the fluid chamber,
wherein the repair portion comprises a body portion,
wherein the body portion includes:
an upper surface disposed to face the assembly surface of the board;
a lower surface spaced apart from the upper surface; and
a plurality of sidewalls disposed between the upper surface and the lower surface,
wherein at least one hole is formed in the upper surface,
wherein the repair portion includes a fluid controller configured to supply the fluid to an inner space of the body portion and suction the fluid in the inner space,
wherein the repair portion further includes:
a position adjusting portion configured to move a position of the fluid controller; and
a controller configured to control the position adjusting portion and the fluid controller, and
wherein the controller is configured to:
control the position adjusting portion so that the at least one hole overlaps a semiconductor light emitting diode in which an assembly defect has occurred from among the plurality of semiconductor light emitting diodes on the board; and
control the fluid controller so that the fluid is suctioned into the inner space of the body portion in a state where the at least one hole overlaps the semiconductor light emitting diode in which the assembly defect has occurred.
2 . The self-assembly apparatus of a semiconductor light emitting diode of claim 1 , wherein the controller is configured to control the fluid controller so that the fluid is suctioned into the inner space of the body portion until the semiconductor light emitting diode in which the assembly defect has occurred is adsorbed on the upper surface of the body portion.
3 . The self-assembly apparatus of a semiconductor light emitting diode of claim 1 , wherein the controller is configured to,
before the fluid is suctioned into the inner space of the body portion, control the position adjusting portion so that the at least one hole overlaps another semiconductor light emitting diode that is adjacent to the semiconductor light emitting diode in which the assembly defect has occurred from among the plurality of semiconductor light emitting diodes, and
in a state where the hole overlaps the another semiconductor light emitting diode, control the fluid controller so that the fluid is sprayed through the at least one hole.