Bump-forming device, bump-forming method, and non-transitory computer-readable medium
A bump-forming device includes a bonding tool and a bonding controller. The bonding controller is configured to execute a crimping step, a delivery step, a pressing step, and a cutting step, and of the trajectories of the bonding tool, at least the trajectory in the delivery step is determined on the basis of a first parameter relating to a wire (w) and a second parameter relating to the shape of the bonding tool.
1 . A bump-forming device comprising:
a bonding tool bonding a wire to a bond point as a bonding target; and
a bonding controller controlling the bonding tool to form a bump on the bond point,
wherein
the bonding controller is configured to execute:
a crimping step in which a ball part formed at a tip of the wire extending from a tip of the bonding tool is crimped to the bond point by the tip of the bonding tool;
a delivery step in which the bonding tool is moved while the wire is delivered from the ball part crimped to the bond point;
a pressing step in which a portion of the ball part crimped to the bond point is pressed by the tip of the bonding tool, and the ball part crimped to the bond point is deformed; and
a cutting step in which the wire is cut and the bump is formed on the bond point;
based on a first parameter relating to the wire and a second parameter relating to shape of the bonding tool, at least a trajectory in the delivery step in the trajectory of the bonding tool is determined;
wherein the first parameter comprises a diameter of the ball part before being crimped and a diameter and a thickness of a crimp lower portion of the ball part crimped to the bond point, the crimp lower portion being formed between the bonding tool and the bond point; and
wherein the second parameter comprises a hole diameter of a hole of the bonding tool through which the wire is inserted, and a chamfer diameter and a chamfer angle of a chamfer provided on a tip side of the hole of the bonding tool.
2 . The bump-forming device according to claim 1 , wherein
the bonding controller acquires the first parameter input by an input device and the second parameter input by the input device, and calculates the trajectory of the bonding tool.
3 . The bump-forming device according to claim 2 , wherein
the bonding controller calculates a volume of a crimp upper portion of the ball part crimped to the bond point, wherein the crimp upper portion being formed inside the bonding tool.
4 . The bump-forming device according to claim 3 , wherein
the trajectory of the bonding tool comprises an ascending path away from the bond point; and
the bonding controller calculates a distance of the ascending path based on the volume of the crimp upper portion.
5 . The bump-forming device according to claim 4 , wherein
the trajectory of the bonding tool further comprises a slide path moving in a direction intersecting the ascending path;
the first parameter comprises a diameter and a material of the wire; and
the bonding controller calculates a distance of the slide path based on the chamfer diameter and the diameter and the material of the wire.
6 . The bump-forming device according to claim 5 , wherein
the trajectory of the bonding tool further comprises a descending path approaching to the bond point; and
the bonding controller calculates a distance of the descending path based on the distance of the ascending path and the material of the wire.
7 . A bump-forming method comprising:
a crimping step in which a ball part formed at a tip of a wire extending from a tip of a bonding tool is crimped to a bond point by the tip of the bonding tool;
a delivery step in which the bonding tool is moved while the wire is delivered from the ball part crimped to the bond point;
a pressing step in which a portion of the ball part crimped to the bond point is pressed by the tip of the bonding tool, and the ball part crimped to the bond point is deformed; and
a cutting step in which the wire is cut and a bump is formed on the bond point,
wherein
based on a first parameter relating to the wire and a second parameter relating to shape of the bonding tool, at least a trajectory in the delivery step in the trajectory of the bonding tool is determined;
wherein the first parameter comprises a diameter of the ball part before being crimped and a diameter and a thickness of a crimp lower portion of the ball part crimped to the bond point, the crimp lower portion being formed between the bonding tool and the bond point; and
wherein the second parameter comprises a hole diameter of a hole of the bonding tool through which the wire is inserted, and a chamfer diameter and a chamfer angle of a chamfer provided on a tip side of the hole of the bonding tool.
8 . The bump-forming method according to claim 7 , wherein,
between a first bond point and a second bond point electrically connected by a wire bonding, the bump is formed at the first bond point; and
the bump has a greater thickness on a side close to the second bond point than on a side far from the second bond point.
9 . A non-transitory computer-readable medium recording a bump-forming program that causes a computer to execute:
crimping processing in which a ball part formed at a tip of a wire extending from a tip of a bonding tool is crimped to a bond point by the tip of the bonding tool;
delivery processing in which the bonding tool is moved while the wire is delivered from the ball part crimped to the bond point;
pressing processing in which a portion of the ball part crimped to the bond point is pressed by the tip of the bonding tool, and the ball part crimped to the bond point is deformed; and
cutting processing in which the wire is cut and a bump is formed on the bond point,
wherein
based on a first parameter relating to the wire and a second parameter relating to shape of the bonding tool, at least a trajectory in the delivery processing in the trajectory of the bonding tool is determined;
wherein the first parameter comprises a diameter of the ball part before being crimped and a diameter and a thickness of a crimp lower portion of the ball part crimped to the bond point, the crimp lower portion being formed between the bonding tool and the bond point; and
wherein the second parameter comprises a hole diameter of a hole of the bonding tool through which the wire is inserted, and a chamfer diameter and a chamfer angle of a chamfer provided on a tip side of the hole of the bonding tool.