IP Library Granted Patent US 12,638,643
Granted Patent B2
US 12,638,643 · App. 18/334,291 · Granted May 26, 2026

Photonic integrated circuit structure

Inventors: Ping Ming Liu (Hsinchu, TW); Hsiao Che Wu (Hsinchu, TW)
Assignee: PROMOS TECHNOLOGIES INC.
G02B6/4214G02B6/1228G02B6/14G02B6/305
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,638,643
App. No.
18/334,291
Granted
May 26, 2026
Kind
B2
Abstract

A photonic integrated circuit structure includes a substrate, a waveguide structure and a spot size converter. The waveguide structure is disposed over a surface of the substrate and has a receiving end. The spot size converter includes a concave mirror and a curved mirror. The concave mirror and the curved mirror are opposite to each other and have a common focus. The concave mirror is arranged to reflect a parallel beam from a transmitting end such that a first reflected beam is able to converge at the common focus, and the curved mirror is arranged to reflect the first reflected beam such that a second reflected beam is directed parallel to the receiving end of the waveguide structure.

Claims (50)

1 . A method for manufacturing a spot size converter of a photonic integrated circuit, wherein the photonic integrated circuit comprises a substrate, a waveguide structure arranged on one surface of the substrate and a stack structure arranged opposite to the waveguide structure, a groove is defined between the waveguide structure and the stack structure, and the waveguide structure has a receiving end, the method comprising:

forming a curved mirror in the groove; and

forming a concave mirror above the waveguide structure, wherein the curved mirror and the concave mirror are disposed opposite to each other and have a common focus;

wherein the concave mirror is arranged to reflect a parallel beam from a transmitting end such that a first reflected beam is able to converge at the common focus, and the curved mirror is arranged to reflect the first reflected beam such that a second reflected beam is directed parallel to the receiving end of the waveguide structure,

wherein said first reflected beam is configured to propagate along a non-guided optical path before being reflected by said curved mirror into said second reflected beam, and

wherein the step of forming the concave mirror above the waveguide structure further comprises:

fully filling the groove with a removable material and covering an area above the waveguide structure and the stack structure with the removable material;

molding the removable materials according to the common focus so that one upper surface of the removable materials has a curve;

depositing another metal layer on the upper surface of the removable material;

removing a part of the another metal layer so as to form the concave mirror with the another metal layer on said curve; and

removing the removable material from the groove and the area above the waveguide structure and the stack structure.

2 . The method according to claim 1 , wherein the step of forming the curved mirror further comprises:

fully filling the groove with resin to form a resin layer;

patterning the resin layer according to the common focus so as to form the resin layer into a curved surface; and

forming a metal layer on the curved surface.

3 . A method for manufacturing a photonic integrated circuit structure, comprising:

providing a substrate with a surface;

forming a composite layer on the surface;

processing the composite layer to form a waveguide structure;

manufacturing the spot size converter according to the method of claim 2 ; and

disposing the spot size converter on the substrate at one side of the receiving end of the waveguide structure.

4 . The method according to claim 1 , wherein the step of forming the curved mirror further comprises:

processing the stack structure on the opposite side of the receiving end of the waveguide structure to form a curved surface opposite to the receiving end; and

forming a metal layer on the curved surface.

5 . A method for manufacturing a photonic integrated circuit structure, comprising:

providing a substrate with a surface;

forming a composite layer on the surface;

processing the composite layer to form a waveguide structure;

manufacturing the spot size converter according to the method of claim 4 ; and

disposing the spot size converter on the substrate at one side of the receiving end of the waveguide structure.

6 . The method according to claim 1 , wherein the curved mirror is a concave mirror or a convex mirror.

7 . A method for manufacturing a photonic integrated circuit structure, comprising:

providing a substrate with a surface;

forming a composite layer on the surface;

processing the composite layer to form a waveguide structure;

manufacturing the spot size converter according to the method of claim 6 ; and

disposing the spot size converter on the substrate at one side of the receiving end of the waveguide structure.

8 . The method according to claim 1 , wherein a ratio of a curvature radius of the concave mirror to a curvature radius of the curved mirror is equal to a ratio of a core radius of the transmitting end to a core radius of the receiving end.

9 . A method for manufacturing a photonic integrated circuit structure, comprising:

providing a substrate with a surface;

forming a composite layer on the surface;

processing the composite layer to form a waveguide structure;

manufacturing the spot size converter according to the method of claim 8 ; and

disposing the spot size converter on the substrate at one side of the receiving end of the waveguide structure.

10 . A method for manufacturing a photonic integrated circuit structure, comprising:

providing a substrate with a surface;

forming a composite layer on the surface;

processing the composite layer to form a waveguide structure;

manufacturing the spot size converter according to the method of claim 7 ; and

disposing the spot size converter on the substrate at one side of the receiving end of the waveguide structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2023
From: LIU, PING MING; WU, HSIAO CHE
To: PROMOS TECHNOLOGIES INC.
Reel/Frame 063989/0875 →
Continuity (2)
Continuation 18046840 · Oct 14, 2022
Related Publication 20240134123A1 · Apr 25, 2024
References Cited (14)
US 5182787A · Blonder · 1993 [cited by examiner]
US 5263111A · Nurse · 1993 [cited by examiner]
US 10222563B2 · Haase · 2019 [cited by examiner]
US 10564374B2 · Israel et al. · 2020 [cited by applicant]
US 10591694B2 · Paquet et al. · 2020 [cited by applicant]
US 10761279B2 · Shaw · 2020 [cited by examiner]
US 10830951B2 · Noriki et al. · 2020 [cited by applicant]
US 11646794B2 · Sengupta · 2023 [cited by examiner]
US 20180231732A1 · Paquet · 2018 [cited by examiner]
US 20190339450A1 · Noriki · 2019 [cited by examiner]
US 20230077939A1 · Liu · 2023 [cited by examiner]
US 20230204877A1 · Heck · 2023 [cited by examiner]
US 20240027699A1 · Psaila · 2024 [cited by examiner]
US 20240027700A1 · Psaila · 2024 [cited by examiner]