Photonic chip having a monolithically integrated reflector unit and method of manufacturing a reflector unit

1. A method of manufacturing a reflector unit on a photonic chip, the method comprising:

providing a substrate having a top surface with a region of interest, the region of interest being covered with a bulge of a removable material;

monolithically integrating a layer of reflective material over a portion of the top surface adjacent to the bulge and over a portion of the bulge, the layer of reflective material forming a base monolithically integrated to the portion of the top surface and a pocket monolithically integrated over the portion of the bulge in a manner leaving a portion of the bulge uncovered;

removing the bulge of the removable material, the pocket having a lateral opening leaving a cavity between the pocket and the region of interest, the cavity receiving an optical axis extending parallel to the top surface, spaced apart from the top surface and through the opening, the layer of reflective material forming a reflector unit for reflecting light at least one of incoming from the region of interest and towards the region of interest; and

recessing a longitudinal trench in the top surface of the substrate and parallel to the optical axis, the longitudinal trench being sized and shaped to receive an end of an external optical waveguide having a propagation axis coinciding with the optical axis.

2. The method of claim 1 further comprising monolithically integrating a layer of dielectric material over the layer of reflective material.

3. The method of claim 1 wherein said providing a substrate includes:

providing a substrate having a top surface with a region of interest;

providing a layer of removable material over the top surface covering the region of interest; and

shaping the layer of removable material to form the bulge.

4. The method of claim 1 further comprising, prior to said step of monolithically integrating, engraving an indentation onto the bulge from one side of the bulge to another side of the bulge, wherein the layer of reflective material extends over the indentation and forms a stiffness enhancement rib across the pocket.

5. The method of claim 1 further comprising adhering the end of the external optical waveguide the longitudinal trench via an adhesive.

6. The method of claim 1 wherein the reflective material is provided in the form of a metallic material.

7. The method of claim 1 wherein said monolithically integrating includes monolithically integrating a layer of reflective material over the bulge and its surrounding and removing a portion of the layer of reflective material over the bulge in a manner to leave a portion of the bulge uncovered.

8. The method of claim 1 wherein said removable material is polyimide and wherein the bulge of removable material is removed using a dry etching process.

9. A method of manufacturing a reflector unit on a photonic chip, the method comprising:

providing a substrate having a top surface with a region of interest, the region of interest being covered with a bulge of a removable material;

engraving an indentation onto the bulge from one side of the bulge to another side of the bulge;

monolithically integrating a layer of reflective material over a portion of the top surface adjacent to the bulge and over a portion of the bulge, the layer of reflective material forming a base monolithically integrated to the portion of the top surface and a pocket monolithically integrated over the portion of the bulge in a manner leaving a portion of the bulge uncovered, wherein the layer of reflective material extends over the indentation and forms a stiffness enhancement rib across the pocket; and

removing the bulge of the removable material, the pocket having a lateral opening leaving a cavity between the pocket and the region of interest, the cavity receiving an optical axis extending parallel to the top surface, spaced apart from the top surface and through the opening, the layer of reflective material forming a reflector unit for reflecting light at least one of incoming from the region of interest and towards the region of interest.

10. The method of claim 9 further comprising monolithically integrating a layer of dielectric material over the layer of reflective material.

11. The method of claim 9 wherein said providing a substrate includes:

providing a substrate having a top surface with a region of interest;

providing a layer of removable material over the top surface covering the region of interest; and

shaping the layer of removable material to form the bulge.

12. The method of claim 9 further comprising recessing a longitudinal trench in the top surface of the substrate and parallel to the optical axis, the longitudinal trench being sized and shaped to receive an end of an external optical waveguide having a propagation axis coinciding with the optical axis.

13. The method of claim 12 further comprising adhering the end of the external optical waveguide to the longitudinal trench via an adhesive.

14. The method of claim 9 wherein the reflective material is provided in the form of a metallic material.

15. The method of claim 9 wherein said monolithically integrating includes monolithically integrating a layer of reflective material over the bulge and its surrounding and removing a portion of the layer of reflective material over the bulge in a manner to leave a portion of the bulge uncovered.

16. The method of claim 9 wherein said removable material is polyimide and wherein the bulge of removable material is removed using a dry etching process.