Dry resist system and method of using
A method of operating a manufacturing platform includes moving a substrate through the manufacturing platform using one or more transfer modules. A dry resist is deposited on the substrate using a resist deposition module of the manufacturing platform. The substrate is examined for distortion with a metrology system that is part of a transfer module. The dry resist is exposed to UV or EUV radiation using an exposure tool of the manufacturing platform. Exposed or unexposed portions of the dry resist are removed using an etch module of the manufacturing platform.
1 . A method of operating a manufacturing platform, the method comprising:
moving a substrate through the manufacturing platform using one or more transfer modules;
depositing a dry resist on the substrate using a resist deposition module of the manufacturing platform;
examining the substrate for bow distortion with a metrology system, wherein the metrology system is part of a transfer module of the one or more transfer modules;
correcting the bow distortion by applying pressure to portions of the substrate with one or more actuators;
exposing the dry resist to UV or EUV radiation using an exposure tool of the manufacturing platform; and
removing exposed or unexposed portions of the dry resist using an etch module of the manufacturing platform.
2 . The method of claim 1 , wherein the dry resist comprises a metal oxide dry resist or a metal alkoxide dry resist.
3 . The method of claim 2 , wherein the metal oxide dry resist or the metal alkoxide dry resist comprises tin (Sn), antimony (Sb), hafnium (Hf), zirconium (Zr), or zinc (Zn).
4 . The method of claim 2 , wherein the metal alkoxide dry resist is deposited using an oxidizing agent that comprises glycol.
5 . The method of claim 2 , wherein the metal alkoxide dry resist comprises tin alkoxide or antimony alkoxide.
6 . A method of an exposure process, the method comprising:
forming a film over a substrate in a deposition module, wherein the film is formed in vacuum;
moving the substrate from the deposition module to a resist deposition module with a transfer module;
depositing a dry resist over the substrate in the resist deposition module, the dry resist comprising a metal and oxygen;
examining the substrate for bow with a metrology system, wherein the metrology system is part of the transfer module;
applying pressure to portions of the substrate to correct the bow with one or more actuators; and
moving the substrate to an exposure tool with the transfer module, wherein the exposure tool exposes the dry resist to UV or EUV radiation, wherein the substrate has been in vacuum from forming the film to exposing the dry resist.
7 . The method of claim 6 , wherein depositing the dry resist comprises flowing a metal-containing precursor and an oxygen-containing precursor over the substrate.
8 . The method of claim 7 , wherein the metal-containing precursor comprises antimony.
9 . The method of claim 7 , wherein the oxygen-containing precursor comprises antimony alkoxide.
10 . The method of claim 7 , wherein the metal-containing precursor comprises an alkoxide.
11 . The method of claim 6 , further comprising examining the substrate with optical metrology for thickness measurement, roughness measurement, critical dimension measurement, or carbon content measurement, wherein the optical metrology is part of the transfer module.
12 . A method of operating a manufacturing platform, the method comprising:
forming a film over a substrate in a deposition module, the film being formed under vacuum conditions;
moving the substrate through the manufacturing platform using one or more transfer modules while maintaining vacuum conditions;
depositing a dry resist on the substrate using a resist deposition module of the manufacturing platform while maintaining vacuum conditions, wherein depositing the dry resist comprises:
flowing a metal-containing precursor over the substrate;
purging the resist deposition module of the metal-containing precursor by flowing an inert gas; and
flowing an oxygen-containing precursor over the substrate after purging the resist deposition module of the metal-containing precursor;
examining the substrate for distortion with an optical metrology system while maintaining vacuum conditions, the optical metrology system being part of a transfer module of the one or more transfer modules;
correcting the distortion by applying pressure to portions of the substrate with one or more actuators;
exposing the dry resist to UV or EUV radiation using an exposure tool of the manufacturing platform while maintaining vacuum conditions; and
removing exposed or unexposed portions of the dry resist using an etch module of the manufacturing platform while maintaining vacuum conditions.
13 . The method of claim 12 , further comprising examining the substrate for thickness measurement with the optical metrology system.
14 . The method of claim 12 , further comprising examining the substrate for roughness measurement with the optical metrology system.
15 . The method of claim 12 , further comprising examining the substrate for critical dimension measurement with the optical metrology system.
16 . The method of claim 12 , further comprising examining the substrate for carbon content measurement with the optical metrology system.
17 . The method of claim 12 , wherein the metal-containing precursor comprises antimony.
18 . The method of claim 12 , wherein the oxygen-containing precursor comprises antimony alkoxide.
19 . The method of claim 12 , wherein the metal-containing precursor comprises an alkoxide.
20 . The method of claim 12 , further comprising adding fluorine to the oxygen-containing precursor.