Inspection device and inspection method
An inspection device comprises a virtual image generator configured to generate a virtual image based on a plurality of layers shown in a layout drawing, a reference measurement region determiner configured to determine a reference measurement region to be measured in the virtual image, a target measurement region detector configured to detect a target measurement region corresponding to the reference measurement region from a measurement target including a plurality of layers patterned based on the layout drawing, and a measurer configured to measure the target measurement region based on the reference measurement region.
1 . An inspection device comprising:
a virtual image generator configured to receive layout data for a plurality of layers and generate a virtual image based on the plurality of layers shown in a layout drawing by integrating the plurality of layers shown in the layout drawing prior to fabrication;
a reference measurement region determiner configured to determine a reference measurement region to be measured in the virtual image;
a target measurement region detector configured to detect a target measurement region corresponding to the reference measurement region from a measurement target including a plurality of layers patterned based on the layout drawing; and
a measurer configured to measure the target measurement region based on the reference measurement region,
wherein the plurality of layers includes at least one metal layer and at least one organic layer.
2 . The inspection device of claim 1 , wherein the virtual image generator is configured to:
preprocess an image including the plurality of layers shown in the layout drawing to generate a preprocessed image,
capture an image of a plurality of layers stacked based on the layout drawing to acquire an actually captured image, and
generate a first virtual image based on the preprocessed image and the actually captured image.
3 . The inspection device of claim 2 , wherein the virtual image generator is configured to generate the first virtual image by adjusting a loss of the preprocessed image and a loss of the actually captured image so that a loss of the first virtual image is reduced as expressed in Equation below:
L
=
α
L
1
+
β
L
2
[
Equation
]
wherein L denotes the loss of the first virtual image, α denotes a weight of the preprocessed image, L 1 denotes the loss of the preprocessed image, β denotes a weight of the actually captured image, and L 2 denotes the loss of the actually captured image.
4 . The inspection device of claim 2 , wherein the target measurement region detector is configured to detect a target measurement region corresponding to a reference measurement region of the first virtual image from a measurement target in which a photoresist is developed.
5 . The inspection device of claim 1 , wherein the virtual image generator is configured to:
extract two-dimensional images by separating the plurality of layers shown in the layout drawing from one another,
integrate the two-dimensional images to sort the integrated two-dimensional images by types of different overlapping layers, and
conduct image mapping on each of the different overlapping layers to generate a second virtual image.
6 . The inspection device of claim 5 , wherein the virtual image generator is configured to generate the second virtual image by performing the image mapping and then conducting a blurring process for each of the different overlapping layers.
7 . The inspection device of claim 5 , wherein the target measurement region detector is configured to detect a target measurement region corresponding to a reference measurement region of the second virtual image from a measurement target after the target measurement region has been etched by using a developed photoresist and the developed photoresist has been cleaned.
8 . The inspection device of claim 1 , wherein the target measurement region detector is configured to perform pattern matching of the measurement target based on the reference measurement region to detect the target measurement region that satisfies a degree of matching.
9 . The inspection device of claim 1 , wherein the measurer is configured to conduct pattern measurement on at least one of overlay, refractive index, and thickness based on the reference measurement region to measure a line width, a hole, and/or area of the target measurement region.
10 . The inspection device of claim 1 , wherein the target measurement region detector is configured to:
remove noise from an actually captured image of the measurement target, and
detect a target measurement region corresponding to the reference measurement region from the actually captured image after the noise has been removed.
11 . An inspection method comprising:
receiving layout data for a plurality of layers and generating a single composite virtual image based on the plurality of layers shown in a layout drawing by integrating the plurality of layers shown in the layout drawing prior to fabrication;
determining a reference measurement region to be measured in the virtual image;
detecting a target measurement region corresponding to the reference measurement region from a measurement target including a plurality of layers patterned based on the layout drawing; and
measuring the target measurement region based on the reference measurement region,
wherein the plurality of layers includes at least one metal layer and at least one organic layer.
12 . The inspection method of claim 11 , wherein the generating of the virtual image comprises:
preprocessing an image including the plurality of layers shown in the layout drawing to generate a preprocessed image,
capturing an image of a plurality of layers stacked based on the layout drawing to acquire an actually captured image, and
generating a first virtual image based on the preprocessed image and the actually captured image.
13 . The inspection method of claim 12 , wherein the generating of the virtual image comprises generating the first virtual image by adjusting a loss of the preprocessed image and a loss of the actually captured image so that a loss of the first virtual image is reduced as expressed in Equation below:
L
=
α
L
1
+
β
L
2
[
Equation
]
wherein L denotes the loss of the first virtual image, a denotes a weight of the preprocessed image, L 1 denotes the loss of the preprocessed image, β denotes a weight of the actually captured image, and L 2 denotes the loss of the actually captured image.
14 . The inspection method of claim 12 , wherein the detecting of the target measurement region comprises detecting a target measurement region corresponding to a reference measurement region of the first virtual image from a measurement target in which a photoresist is developed.
15 . The inspection method of claim 11 , wherein the generating of the virtual image comprises:
extracting two-dimensional images by separating the plurality of layers shown in the layout drawing from one another,
integrating the two-dimensional images to sort the integrated two-dimensional images by types of different overlapping layers, and
conducting image mapping on each of the different overlapping layers to generate a second virtual image.
16 . The inspection method of claim 15 , wherein the generating of the virtual image comprises generating the second virtual image by performing the image mapping and then conducting a blurring process for each of the different overlapping layers.
17 . The inspection method of claim 15 , wherein the detecting of the target measurement region comprises detecting a target measurement region corresponding to a reference measurement region of the second virtual image from a measurement target after the target measurement region has been etched by using a developed photoresist and the developed photoresist has been cleaned.
18 . The inspection method of claim 11 , wherein the detecting of the target measurement region comprises performing pattern matching of the measurement target based on the reference measurement region to detect the target measurement region that satisfies a degree of matching.
19 . The inspection method of claim 11 , wherein the measuring of the target measurement region comprises conducting pattern measurement on at least one of overlay, refractive index, and thickness based on the reference measurement region to measure a line width, a hole, and/or area of the target measurement region.
20 . The inspection method of claim 11 , wherein the detecting of the target measurement region comprises:
removing noise from an actually captured image of the measurement target, and
detecting a target measurement region corresponding to the reference measurement region from the actually captured image after the noise has been removed.