Electronic component, circuit board, and method of mounting electronic component on circuit board
An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti.
1 . An electronic component, comprising:
a laminate including an inner layer portion including first internal electrodes and second internal electrodes that are laminated in a lamination direction with dielectric layers interposed between the first internal electrodes and the second internal electrodes, outer layer portions that sandwich the inner layer portion in the lamination direction, and side margin portions that sandwich the inner layer portion and the outer layer portions in a width direction orthogonal or substantially orthogonal to the lamination direction, the laminate further including:
a first main surface and a second main surface opposite to each other in the lamination direction;
a first side surface and a second side surface opposite to each other in the width direction; and
a first end surface and a second end surface opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction;
a first external electrode provided on at least the first end surface of the laminate and electrically connected to the first internal electrodes; and
a second external electrode provided on at least the second end surface of the laminate and electrically connected to the second internal electrodes; wherein
the inner layer portions include a dielectric material including Si, Ba, and Ti;
the side margin portions include a dielectric material including Si, Ca, and Ti; and
a molar ratio of Ba/Ti in the inner layer portions is higher than a molar ratio of Ba/Ti in the side margin portion.
2 . The electronic component according to claim 1 , wherein
the electronic component includes:
a dimension in the length direction of about 0.5 mm or more and about 0.7 mm or less;
a dimension in the width direction of about 0.2 mm or more and about 0.4 mm or less; and
a dimension in the lamination direction of about 0.2 mm or more and about 0.6 mm or less.
3 . The electronic component according to claim 1 , wherein
the electronic component includes:
a dimension in the length direction of about 0.9 mm or more and about 1.1 mm or less;
a dimension in the width direction of about 0.4 mm or more and about 0.6 mm or less; and
a dimension in the lamination direction of about 0.4 mm or more and about 0.9 mm or less.
4 . The electronic component according to claim 1 , wherein
the electronic component includes:
a dimension in the length direction of about 1.4 mm or more and about 1.7 mm or less;
a dimension in the width direction of about 0.7 mm or more and about 0.9 mm or less; and
a dimension in the lamination direction of about 0.7 mm or more and about 0.9 mm or less.
5 . The electronic component according to claim 1 , wherein
the first external electrode includes a first underlying layer and a second underlying layer on the first underlying layer;
the first underlying layer includes Ni as a main component; and
the second underlying layer includes Cu as a main component.
6 . The electronic component according to claim 1 , wherein
the first external electrode includes a first underlying layer and a second underlying layer on the first underlying layer;
the first underlying layer includes Cu as a main component; and
the second underlying layer includes a conductive filler and a resin.
7 . The electronic component according to claim 1 , wherein at least a portion of the dielectric layers include different dielectric composition from that of the side margin portions.
8 . An electronic component, comprising:
a laminate including an inner layer portion including first internal electrodes and second internal electrodes that are laminated in a lamination direction with dielectric layers interposed between the first internal electrodes and the second internal electrodes, outer layer portions that sandwich the inner layer portion in the lamination direction, and side margin portions that sandwich the inner layer portion and the outer layer portions in a width direction orthogonal or substantially orthogonal to the lamination direction, the laminate further including:
a first main surface and a second main surface opposite to each other in the lamination direction;
a first side surface and a second side surface opposite to each other in the width direction; and
a first end surface and a second end surface opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction;
a first external electrode provided on at least the first end surface of the laminate and electrically connected to the first internal electrodes; and
a second external electrode provided on at least the second end surface of the laminate and electrically connected to the second internal electrodes; wherein
the inner layer portions include a dielectric material including Si, Ba, and Ti;
the side margin portions include a dielectric material including Si, Ca, and Ti; and
a molar ratio of Ca/Ti in the side margin portions is higher than a molar ratio of Ca/Ti in the inner layer portion.
9 . The electronic component according to claim 8 , wherein
the electronic component includes:
a dimension in the length direction of about 0.5 mm or more and about 0.7 mm or less;
a dimension in the width direction of about 0.2 mm or more and about 0.4 mm or less; and
a dimension in the lamination direction of about 0.2 mm or more and about 0.6 mm or less.
10 . The electronic component according to claim 8 , wherein
the electronic component includes:
a dimension in the length direction of about 0.9 mm or more and about 1.1 mm or less;
a dimension in the width direction of about 0.4 mm or more and about 0.6 mm or less; and
a dimension in the lamination direction of about 0.4 mm or more and about 0.9 mm or less.
11 . The electronic component according to claim 8 , wherein
the electronic component includes:
a dimension in the length direction of about 1.4 mm or more and about 1.7 mm or less;
a dimension in the width direction of about 0.7 mm or more and about 0.9 mm or less; and
a dimension in the lamination direction of about 0.7 mm or more and about 0.9 mm or less.
12 . The electronic component according to claim 8 , wherein
the first external electrode includes a first underlying layer and a second underlying layer on the first underlying layer;
the first underlying layer includes Ni as a main component; and
the second underlying layer includes Cu as a main component.
13 . The electronic component according to claim 8 , wherein
the first external electrode includes a first underlying layer and a second underlying layer on the first underlying layer;
the first underlying layer includes Cu as a main component; and
the second underlying layer includes a conductive filler and a resin.
14 . The electronic component according to claim 8 , wherein at least a portion of the dielectric layers include different dielectric composition from that of the side margin portions.
15 . An electronic component, comprising:
a laminate including an inner layer portion including first internal electrodes and second internal electrodes that are laminated in a lamination direction with dielectric layers interposed between the first internal electrodes and the second internal electrodes, outer layer portions that sandwich the inner layer portion in the lamination direction, and side margin portions that sandwich the inner layer portion and the outer layer portions in a width direction orthogonal or substantially orthogonal to the lamination direction, the laminate further including:
a first main surface and a second main surface opposite to each other in the lamination direction;
a first side surface and a second side surface opposite to each other in the width direction; and
a first end surface and a second end surface opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction;
a first external electrode provided on at least the first end surface of the laminate and electrically connected to the first internal electrodes; and
a second external electrode provided on at least the second end surface of the laminate and electrically connected to the second internal electrodes; wherein
the inner layer portions include a dielectric material including Si, Ba, and Ti;
the side margin portions include a dielectric material including Si, Ca, and Ti;
at least one of the dielectric layers includes a different dielectric composition from that of the side margin portions;
each of the side margin portions includes a first portion and a second portion, and the first portion of each of the side margin portions is closer to the first and second internal electrodes than the corresponding second portion of each of the side margin portions in the width direction; and
each of the side margin portions includes Si, and a molar ratio of Si/Ti in the second portion of each of the side margin portions is higher than a molar ratio of Si/Ti in the first portion of each of the side margin portions.
16 . The electronic component according to claim 15 , wherein
the electronic component includes:
a dimension in the length direction of about 0.5 mm or more and about 0.7 mm or less;
a dimension in the width direction of about 0.2 mm or more and about 0.4 mm or less; and
a dimension in the lamination direction of about 0.2 mm or more and about 0.6 mm or less.
17 . The electronic component according to claim 15 , wherein
the electronic component includes:
a dimension in the length direction of about 0.9 mm or more and about 1.1 mm or less;
a dimension in the width direction of about 0.4 mm or more and about 0.6 mm or less; and
a dimension in the lamination direction of about 0.4 mm or more and about 0.9 mm or less.
18 . The electronic component according to claim 15 , wherein
the electronic component includes:
a dimension in the length direction of about 1.4 mm or more and about 1.7 mm or less;
a dimension in the width direction of about 0.7 mm or more and about 0.9 mm or less; and
a dimension in the lamination direction of about 0.7 mm or more and about 0.9 mm or less.
19 . The electronic component according to claim 15 , wherein
the first external electrode includes a first underlying layer and a second underlying layer on the first underlying layer;
the first underlying layer includes Ni as a main component; and
the second underlying layer includes Cu as a main component.
20 . The electronic component according to claim 15 , wherein
the first external electrode includes a first underlying layer and a second underlying layer on the first underlying layer;
the first underlying layer includes Cu as a main component; and
the second underlying layer includes a conductive filler and a resin.