Water block with air-cooling module and multi-layer heat-conducting structure
A water block includes an air-cooling module, a multi-layer heat-conducting structure and a water pump. The air-cooling module is provided above the water pump, and a pump bottom casing is provided below the water pump. The multi-layer heat-conducting structure is provided below the pump bottom casing, and a heat-conducting bottom casing is provided below the multi-layer heat-conducting structure. The multi-layer heat-conducting structure is formed, from top to bottom, by a top layer, a main body, an interlayer, and a bottom layer. A multi-layer heat-dissipation fin is provided inside the multi-layer heat-conducting structure.
1 . A water block, comprising:
a water pump;
an air-cooling module; and
a multi-layer heat-conducting structure;
wherein the air-cooling module is provided above the water pump, and a pump bottom casing is provided below the water pump; the multi-layer heat-conducting structure is provided below the pump bottom casing, and a heat-conducting bottom casing is provided below the multi-layer heat-conducting structure; the multi-layer heat-conducting structure comprises a top layer, a main body, an interlayer, and a bottom layer from top to bottom; and a first heat-dissipation fin with a multi-layer structure is provided inside the multi-layer heat-conducting structure, wherein the main body of the multi-layer heat-conducting structure, the interlayer of the multi-layer heat-conducting structure and the bottom layer of the multi-layer heat-conducting structure are configured to together form a first chamber; the top layer of the multi-layer heat-conducting structure and the main body of the multi-layer heat-conducting structure are configured to together form a second chamber; the water pump is provided with a first water inlet and a first water outlet; the pump bottom casing is provided with a second water inlet and a second water outlet; the multi-layer heat-conducting structure is provided with a third water inlet and a third water outlet; and water flows from the second water inlet into the third water inlet, passes through the first chamber to the second chamber and then flows out of the third water outlet, and enters the first water inlet through the second water outlet and then flows out of the first water outlet.
2 . The water block of claim 1 , wherein the air-cooling module comprises an air-cooling top cover, an air-cooling fan blade, and an air-cooling shell.
3 . The water block of claim 2 , wherein the air-cooling shell is cylindrical, and is provided with a notch in an L-shape; a fan chamber is provided inside the air-cooling shell; a snap-fit groove is provided above the fan chamber, and is configured to be matched with the air-cooling top cover; and a separator is provided below the fan chamber.
4 . The water block of claim 3 , wherein a second heat-dissipation fin is provided on an outer circumference of the pump bottom casing; a side of the pump bottom casing is provided with a water inlet; and a position where the water inlet is located is corresponding to a position of the notch of the air-cooling shell.
5 . The water block of claim 1 , wherein the air-cooling module comprises an air-cooling fan blade; and the air-cooling fan blade is connected to a turbine axis of the water pump.
6 . The water block of claim 1 , wherein the water block further comprises a heat pipe; a first portion of the heat pipe is provided above the multi-layer heat-conducting structure, and a second portion of the heat pipe is provided below the multi-layer heat-conducting structure.
7 . The water block of claim 6 , wherein the heat pipe is U-shaped, and the number of the heat pipe is one or more.
8 . The water block of claim 1 , wherein the first heat-dissipation fin comprises a top heat-dissipation fin layer, a heat-dissipation fin interlayer and a bottom heat-dissipation fin layer; the top heat-dissipation fin layer is provided between the top layer of the multi-layer heat-conducting structure and the main body of the multi-layer heat-conducting structure; the heat-dissipation fin interlayer is provided between the main body of the multi-layer heat-conducting structure and the interlayer of the multi-layer heat-conducting structure; and the bottom heat-dissipation fin layer is arranged between the interlayer of the multi-layer heat-conducting structure and the bottom layer of the multi-layer heat-conducting structure.
9 . The water block of claim 1 , wherein a first bracket and a second bracket are provided between the pump bottom casing and the heat-conducting bottom casing.