Cooling device using multiple fans and heat sinks
View Patent ↗The present invention is directed to a method of constructing a semiconductor chip cooling device consists of multiple fans and heat sinks to provide redundant cooling capability. Heat coming from a semiconductor chip is first distributed to several heat sinks using multiple heat pipes. The heat sinks are placed around the fan outlet such that air is pulled in near the center of the fan and then pushed to across the heat sinks. Multiple fans and heat sinks are stacked up to form a complete cooling device. An external control circuitry is used to monitor and control the fans. In case of one fan fails, the other fans will be speeded up to make up the lost of air flow.
1. A fan-heatsink assembly comprising:
multiple fans;
multiple heat sinks;
multiple heat pipes;
a heat distribution block;
a plurality of sets of said multiple fans and said multiple heatsinks; and
said sets comprise heat sink fins substantially surrounding said fan so that said fan is substantially at the center of said fins.
2. The fan-heatsink assembly of claim 1 wherein said fans are centrifugal fans that pull in air at the inlet around the fan motor shaft from top and bottom.
3. The fan-heatsink assembly of claim 1 wherein said heat sink fins of are substantially oriented perpendicular to the fan motor shaft and arranged in-line or staggered.
4. The fan-heatsink assembly of claim 1 wherein said heat sink fins comprise a plurality of segments or one continuous cycle.
5. The fan-heatsink assembly of claim 1 wherein said heat sink fins of are made of thermally conductive materials.
6. The fan-heatsink assembly of claim 1 wherein said sets are brought into thermal contact with one end of the multiple heat pipes in series.
7. The fan-heatsink assembly of claim 1 wherein said heat sink fins of are soldered or brazed on one end of the said heat pipes.
8. The fan-heatsink assembly of claim 1 wherein said end of the multiple heat pipes are inserted into the said heat distribution block.
9. The fan-heatsink assembly of claim 1 wherein said heat distribution block comprises thermally conductive materials selected from the group consisting of copper, aluminum, and diamond.
10. The fan-heatsink assembly of claim 1 wherein said heat distribution block comprises heat pipes which are bent into “U” shape, embedded therein.
11. The fan-heatsink assembly of claim 1 wherein said sets are placed and stacked up on top of said heat distribution block or placed on the side of the said heat distribution block.
12. The fan-heatsink assembly of claim 1 further comprising a vapor chamber.
13. The fan-heatsink assembly of claim 11 wherein said vapor chamber comprising one end of the said heat pipes inserted therein and wicks covering a portion of the inner surface.
14. The fan-heatsink assembly according to claim 11 wherein the portion of the said heat pipes inside the vapor chamber comprises wicks covered on the outer surface.
15. The fan-heatsink assembly of claim 14 wherein said wicks comprise a material selected from the group consisting of sintered copper, copper fibers, copper meshes, copper foams, and graphite foams.
16. The fan-heatsink assembly of claim 12 wherein said vapor chamber is filled partially with fluids.
17. The fan-heatsink assembly of claim 16 wherein said vapor chamber is made of thermally conductive materials which are compatible to said fluids.
18. A fan-heatsink assembly comprising:
multiple fans;
multiple heat sinks;
multiple heat pipes;
a heat distribution block;
a plurality of sets of said multiple fans and said multiple heatsinks;
a vapor chamber;
said sets are placed and stacked up on top of said heat distribution system block or placed on the side of said heat distribution block;
said heat pipes comprise a portion thereof in said vapor chamber; and
said portion comprises wicks on an outer surface of said portion.