Integrated machining device for grinding and polishing diamond and method thereof
An integrated device for grinding and polishing a diamond and a method thereof are provided. The integrated device for grinding and polishing the diamond comprises a base device and a grinding and polishing device, the base device comprises a base configured rotate around a vertical direction, the base comprises a fixture configured to clamp the diamond, the grinding and polishing device comprises a shaft disposed along the vertical direction, the outer polishing wheel surrounds the inner grinding wheel, the shaft drives the inner grinding wheel and the outer polishing wheel to rotate together, an upper and lower position relationship between the inner grinding wheel and the outer polishing wheel along the vertical direction is configured to be adjusted, and the diamond on the fixture is ground and polished by rotations of the inner grinding wheel and the outer polishing wheel, feeding, and a rotation of the base.
1 . A machining method using an integrated device for grinding and polishing a diamond, wherein:
the integrated device for grinding and polishing the diamond, comprises:
a base device, and
a grinding and polishing device, wherein:
the base device comprises a sliding base configured to feed along a lateral direction and a base configured to be rotatably connected to the sliding base around a vertical direction,
the base comprises a fixture configured to clamp the diamond,
the grinding and polishing device comprises a shaft disposed along the vertical direction,
an inner grinding wheel and an outer polishing wheel are respectively sleeved on the shaft,
the outer polishing wheel surrounds the inner grinding wheel,
the shaft drives the inner grinding wheel and the outer polishing wheel to rotate together,
an upper and lower position relationship between the inner grinding wheel and the outer polishing wheel along the vertical direction is configured to be adjusted,
the diamond on the fixture is ground and polished by rotations of the inner grinding wheel and the outer polishing wheel, feeding of the sliding base, and a rotation of the base,
the fixture comprises a body, two sliding blocks, and two adjusting screws,
a top wall of the body comprises a base wall and a protruding platform protruding from the base wall,
the protruding platform comprises two positioning walls facing the base wall and vertically disposed,
the base wall of the body is recessed to define two sliding grooves leading to a side wall of the body,
the two sliding grooves are respectively disposed along the two positioning walls,
tops of the two sliding blocks horizontally protrude to define two protruding portions,
the two sliding blocks are respectively slidably connected to the two sliding grooves,
the two protruding portions are disposed on the base wall,
the two protruding portions form two locking walls,
the two locking walls of the two sliding blocks and the two positioning walls respectively face each other,
the two adjusting screws are respectively connected to the two sliding blocks and the body to adjust the two sliding blocks to slide along the two sliding grooves by the two adjusting screws, and
the diamond that is stuck to the base wall is clamped by the two locking walls and the two positioning walls, and
the machining method comprises:
sticking the diamond to the fixture with adhesives,
assembling the fixture to the base,
adjusting the upper and lower position relationship of the inner grinding wheel to enable a bottom surface of the inner grinding wheel to be lower than a bottom surface of the outer polishing wheel,
rotating the inner grinding wheel, rotating the base, and feeding the sliding base to grind the diamond,
adjusting the upper and lower position relationship of the inner grinding wheel to enable the bottom surface of the inner grinding wheel to be higher than the bottom surface of the outer polishing wheel, and
rotating the outer polishing wheel, rotating the base, and feeding the sliding base to polish the diamond.
2 . The machining method according to claim 1 , wherein:
the outer polishing wheel is fixedly disposed on the shaft,
the inner grinding wheel is configured to slide upward and downward along the vertical direction relative to the shaft,
the inner grinding wheel and the shaft rotate synchronously, and
the inner grinding wheel slides upward and downward to enable the upper and lower position relationship between the inner grinding wheel and the outer polishing wheel to be adjusted.
3 . The machining method according to claim 1 , wherein an outer diameter of the inner grinding wheel is smaller than an inner diameter of the outer polishing wheel.
4 . The machining method according to claim 1 , wherein:
the inner grinding wheel comprises an inner wheel body and hard abrasives adhered to the inner wheel body by the adhesives,
the adhesives are at least one of ceramic, metal, resin, or rubber,
the hard abrasives are at least one of diamonds, cubic boron nitride, boron carbide, silicon carbide, or aluminum oxide, and
particle sizes of the hard abrasives are 0.5-60 μm.
5 . The machining method according to claim 1 , wherein:
the outer polishing wheel is made by a sol-gel method,
the outer polishing wheel has hard abrasives,
the hard abrasives are at least one of diamonds, cubic boron nitride, boron carbide, silicon carbide, or aluminum oxide, and
particle sizes of the hard abrasives are 0.5-60 μm.
6 . The machining method according to claim 1 , wherein:
a center of an upper end surface of the base is recessed to define an installation groove,
a vacuum pad is disposed in the installation groove,
the fixture is disposed on the vacuum pad, and
the fixture is stuck to the base by the vacuum pad.
7 . The machining method according to claim 1 , wherein:
an upper end surface of the fixture is recessed to define a placement groove,
the diamond is disposed in the placement groove, and
the diamond is stuck in the placement groove of the fixture by the adhesives.
8 . The machining method according to claim 7 , wherein:
the fixture uses an inch-thick hard substrate as a substrate,
the inch-thick hard substrate is a silicon carbide substrate, a sapphire substrate, a silicon substrate, or a ceramic substrate, and
the adhesives are selected from one or more of yellow wax, AB adhesives, epoxy resin, ultraviolet (UV) adhesives, hot-melt adhesives, pressure sensitive adhesives, or latex.
9 . The machining method according to claim 1 , wherein the shaft rotates to drive the inner grinding wheel and the outer polishing wheel to rotate together.