IP Library Granted Patent US 12,644,907
Granted Patent B2
US 12,644,907 · App. 18/379,370 · Granted Jun 2, 2026

Automatic wire connection apparatus for circuit board testing

Inventor: Imsu Choi (Yongin-si, KR)
Assignee: SAMSUNG SDI CO., LTD.
G01R1/06722
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Quick Facts
Patent No.
US 12,644,907
App. No.
18/379,370
Granted
Jun 2, 2026
Kind
B2
Abstract

Provided is an apparatus for connecting a wire for circuit board testing to a circuit board and a circuit board verification apparatus, the apparatus including a probe configured to electrically connect a test point included in the circuit board to a wire for circuit board testing by soldering the wire to the test point, and a robot arm configured to place the probe at a preset position on the circuit board.

Claims (15)

1 . An apparatus for connecting a wire for circuit board testing to a circuit board and a circuit board verification apparatus, the apparatus comprising:

a probe configured to electrically connect to a test point included in the circuit board;

a robot arm configured to place the probe at a preset position on the circuit board,

wherein the probe includes:

an upper probe part having a flat end and a sharp end opposite each other in a longitudinal direction of the upper probe part,

a lower probe part having a flat end and a sharp end opposite each other in a longitudinal direction of the lower probe part, the flat end of the lower probe part being connected to the flat end of the upper probe part, and

a spring extending from the flat end into the sharp end in each of the upper probe part and the lower probe part; and

a controller electrically connected to the robot arm and to the test point, the controller being configured to adjust the probe to a minimum length when in the robot arm and to a maximum length when placed at the preset position on the circuit board, the preset position being the test point.

2 . The apparatus as claimed in claim 1 , wherein each of the upper probe part and the lower probe part is elastic from the flat end to the sharp end, each of the upper probe part and the lower probe part being configured to shorten and lengthen in its major axis direction.

3 . The apparatus as claimed in claim 2 , wherein the spring is a built-in elastic spring through a center of the probe.

4 . The apparatus as claimed in claim 1 , wherein the probe is fixed between the circuit board and a fixing board by lengthening when placed at the preset position on the circuit board.

5 . The apparatus as claimed in claim 1 , wherein the sharp end of each of the upper probe part and the lower probe part is integral with a respective one of the upper probe part and the lower probe part.

6 . The apparatus as claimed in claim 1 , wherein each of the upper probe part and the lower probe part includes a portion with a gradually narrowing width, the spring extending into the portion with the gradually narrowing width.

7 . The apparatus as claimed in claim 6 , wherein the portion with the gradually narrowing width has a conical structure that ends with the sharp end, the spring extending into the conical structure.

8 . The apparatus as claimed in claim 1 , wherein the probe is configured to lengthen when placed at the preset position on the circuit board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2023
From: CHOI, IMSU
To: SAMSUNG SDI CO., LTD.
Reel/Frame 065199/0771 →
Priority Claims (2)
KR 10-2023-0039964 · Mar 27, 2023 · national
KR 10-2023-0054967 · Apr 26, 2023 · national
Continuity (1)
Related Publication 20240329081A1 · Oct 3, 2024
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