Granted Patent B2

US 12,646,907 · App. 18/499,727 · Granted Jun 2, 2026

Inventors: David Gross (Aalen, DE); Stefan Schreitmüller (Auhausen, DE); Tobias Müller (Dürrwangen, DE); Alois Wünsch (Megesheim, DE); Robert Eigner (Harburg, DE); Thomas Gietzold (Unterwilflingen, DE)

Assignee: HS ELEKTRONIK SYSTEME GMBH

H02B1/20B64D31/00H05K1/181B64D2221/00H05K2201/10053

Abstract

Claims (28)

1 . Solid state power switch assembly of an aircraft solid state power controller comprising:

a printed circuit board;

at least one solid state power switch having a first side and an opposing second side, with a power switch electric contact surface formed on the first side and providing a first electric contact internally electrically connected to a semiconductor, which is provided within the solid state power switch, wherein the at least one solid state power switch is arranged on the circuit board with the second side facing the circuit board and with the first side facing away from the circuit board; and

a busbar comprising:

at least one busbar contact electrically contacting the power switch electric contact; and

at least one busbar mounting portion mounted to the circuit board so that the at least one solid state power switch is sandwiched between the at least one busbar contact portion and the circuit board.

2 . A solid state power switch assembly according to claim 1 , wherein the power switch electric contact surface is bonded to the at least one busbar contact portion.

3 . A solid state power switch assembly according to claim 1 , wherein the at least one busbar mounting portion is electrically connected to a corresponding circuit board mounting portion formed on the circuit board, wherein the portion is an electrically conductive path formed on the circuit board.

4 . A solid state power switch assembly according to claim 3 , wherein the at least one busbar mounting portion is soldered to the corresponding circuit board mounting portion.

5 . A solid state power switch assembly according to claim 1 , wherein the at least one busbar mounting portion extends at least partially into or through the printed circuit board, wherein the at least one busbar mounting portion is press fit into an opening or sleeve provided in the printed circuit board.

6 . A solid state power switch assembly according to claim 1 , wherein the busbar is at least partially made of metal, wherein the busbar has an applied surface finish of one or more layers of metal applied by chemical or physical deposition techniques.

7 . A solid state power switch assembly according to claim 1 , wherein the at least one busbar mounting portion comprises a plurality of legs or fingers, which are mounted and/or electrically connected to the electric circuit board.

8 . A solid state power switch assembly according to claim 1 , wherein the busbar comprises two busbar mounting portions, which are formed on opposite ends of the busbar, and wherein the at least one busbar contact portion forms a bridge extending along a longitudinal direction between the two busbar mounting portions.

9 . A solid state power switch assembly according to claim 1 , wherein the at least one solid state power switch includes a plurality of solid state power switches and the bus bar is a single busbar; and

wherein the power switch electric contact surfaces of the plurality of solid state power switches electrically contact the at least one busbar contact portion of the single busbar, wherein the plurality of solid state power switches are along a linear row of solid state power switches.

10 . A solid state power switch assembly according to claim 1 , wherein the at least one solid state power switch includes a plurality of solid state power switches and the bus bar is a plurality of busbars; and

wherein the power switch electric contact surface of each of the plurality of solid state power switches electrically contacts at least one busbar contact portion of one of the plurality of busbars.

11 . A solid state power switch assembly according to claim 1 , wherein the busbar comprises a plurality of cooling fins, wherein the cooling fins extend from the at least one busbar contact portion in a direction facing away from the circuit board.

12 . A solid state power switch assembly according to claim 1 , wherein the at least one solid state power switch comprises second and third electric contacts extending laterally from the at least one solid state power switch, wherein the second and third electric contacts extend transversely to a longitudinal extension of the busbar mounting portion.

13 . An aircraft solid state power controller comprising:

at least one solid state power switch assembly according to claim 1 .

14 . An aircraft comprising:

at least one aircraft solid state power controller according to claim 13 .

15 . A solid state power switch assembly according to claim 1 , wherein the busbar transfers electricity and heat between the busbar and the at least one solid state power switch.

16 . A method of providing a solid state power switch assembly of an aircraft solid state power controller, the method comprising:

arranging a solid state power switch having a first side and an opposing second side and a power switch electric contact surface, which is formed on the first side and which provides an electric contact internally electrically connected to a semiconductor, which is provided within the solid state power switch, on a circuit board with the second side facing the circuit board and the first side facing away from the circuit board;

arranging a busbar on top of the solid state power switch so that at least one busbar contact portion contacts the power switch electric contact surface of the solid state power switch and the solid state power switch is sandwiched between the busbar and the circuit board; and

fixing and electrically connecting at least one busbar mounting portion to at least one corresponding circuit board mounting portion formed on the circuit board.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (34)