IP Library › Granted Patent US 12,646,934
Granted Patent B2
US 12,646,934 · App. 18/614,483 · Granted Jun 2, 2026

Semiconductor device, electronic device, and vehicle

Inventor: Naoki Takahashi (Kyoto, JP)
Assignee: Rohm Co., Ltd.
H02H9/046H03K5/00H03K2005/00013H10D30/668H10D62/127H10D64/117
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Quick Facts
Patent No.
US 12,646,934
App. No.
18/614,483
Granted
Jun 2, 2026
Kind
B2
Abstract

A semiconductor device includes: an output transistor of a split-gate type configured to have a plurality of channel regions controlled individually according to a plurality of gate control signals; an active clamp circuit configured to limit the terminal-to-terminal voltage across the output transistor to or below a predetermined clamp voltage after a control signal turns to a logic level requesting the output transistor to be off; a delay circuit configured to generate a delayed internal signal by giving a predetermined delay to an internal signal indicating whether the terminal-to-terminal voltage across the output transistor is higher than a predetermined threshold voltage lower than the clamp voltage; and a gate control circuit configured to control the plurality of gate control signals individually so as to raise the on resistance of the output transistor according to the delayed internal signal.

Claims (34)

1 . A semiconductor device, comprising:

an output transistor of a split-gate type configured to have a plurality of channel regions controlled individually according to a plurality of gate control signals;

an active clamp circuit configured to limit a terminal-to-terminal voltage across the output transistor to or below a predetermined clamp voltage after a control signal turns to a logic level requesting the output transistor to be off;

a delay circuit configured to generate a delayed internal signal by giving a predetermined delay to an internal signal indicating whether the terminal-to-terminal voltage across the output transistor is higher than a predetermined threshold voltage lower than the clamp voltage; and

a gate control circuit configured to control the plurality of gate control signals individually so as to raise an on resistance of the output transistor according to the delayed internal signal.

2 . The semiconductor device according to claim 1 ,

the delay circuit includes:

a capacitor; and

a charge current generator configured to generate a charge current for the capacitor according to the internal signal, and

the delay circuit outputs as the delayed internal signal a charge voltage across the capacitor.

3 . The semiconductor device according to claim 2 ,

the charge current generator includes:

a current mirror configured to generate the charge current according to a reference current; and

a discharge switch circuit configured to switch whether to discharge the capacitor according to the internal signal.

4 . The semiconductor device according to claim 3 ,

the current mirror receives the internal signal as a driving voltage for driving an output stage for the charge current.

5 . The semiconductor device according to claim 1 ,

the active clamp circuit includes:

a transistor configured to be connected between a drain and a gate of the output transistor;

at least one Zener diode configured to have a cathode connected to a drain of the transistor; and

at least one diode configured to have an anode connected to an anode of the Zener diode and to have a cathode connected to a gate of the transistor.

6 . The semiconductor device according to claim 5 ,

the internal signal is an internal node voltage in the active clamp circuit.

7 . The semiconductor device according to claim 1 ,

the output transistor has a non-clamp gate to which the active clamp circuit is not connected, and the gate control circuit disables the non-clamp gate according to the delayed internal signal.

8 . The semiconductor device according to claim 1 ,

the output transistor functions as

a high-side switch that switches between a conducting state and a cut-off state a path between a power terminal and a load or

a low-side switch that switches between a conducting state and a cut-off state a path between the load and a ground terminal.

9 . An electronic device, comprising:

the semiconductor device according to claim 1 ; and

a load connected to the semiconductor device.

10 . A vehicle, comprising:

the electronic device according to claim 9 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2024
From: TAKAHASHI, NAOKI
To: ROHM CO., LTD.
Reel/Frame 066988/0063 →
Priority Claims (1)
JP 2021-156468 · Sep 27, 2021 · national
Continuity (2)
Continuation PCTJP2022025736 · Jun 28, 2022
Related Publication 20240235190A1 · Jul 11, 2024
References Cited (6)
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WO WO2017187785 · 2017 [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/JP2022/025736, mailed on Oct. 4, 2022, 13 pages (with machine translation). [cited by applicant]