Electronic package and manufacturing method thereof
An electronic package is provided, in which a package module and a shielding member are disposed on a carrier structure, such that the shielding member covers a top surface and side surfaces of the package module to block the radiation outward from the package module and prevent problem that other electronic components on the carrier structure cannot be transmitted signals normally due to the electromagnetic interference of the package module.
1 . An electronic package, comprising:
a carrier structure;
a package module disposed on one side of the carrier structure, wherein the package module comprises a circuit structure electrically connected to the carrier structure, at least one electronic element disposed on and electrically connected to the circuit structure, an encapsulation layer disposed on the circuit structure and covering the electronic element, and shielding bodies embedded within the encapsulation layer and surrounding the electronic element, wherein end surfaces of the shielding bodies are flush with an inactive surface of the electronic element and a surface of the encapsulation layer;
a shielding member disposed on the carrier structure to cover the package module, wherein the shielding member comprises a metal sheet covering the electronic element and at least one shielding leg for supporting the metal sheet on the carrier structure, such that the shielding leg covers a side surface of the package module, and wherein the shielding bodies are in contact with the metal sheet; and
a heat dissipation member disposed on the carrier structure and connected to the shielding member,
wherein the shielding member is between the at least one electronic element and the heat dissipation member.
2 . The electronic package of claim 1 , wherein a plurality of the electronic elements are disposed on the circuit structure, such that at least one of the shielding bodies is located between two adjacent ones of the electronic elements.
3 . The electronic package of claim 1 , wherein the package module is disposed on the carrier structure via a plurality of conductive elements.
4 . The electronic package of claim 1 , further comprising a plurality of solder balls disposed on the other side of the carrier structure.
5 . The electronic package of claim 1 , wherein the carrier structure has at least one grounding portion electrically connected to the shielding leg.
6 . The electronic package of claim 1 , wherein the carrier structure has at least one grounding portion electrically connected to the heat dissipation member.
7 . A method of manufacturing an electronic package, comprising:
providing a package module, wherein the package module comprises a circuit structure, at least one electronic element disposed on and electrically connected to the circuit structure, an encapsulation layer disposed on the circuit structure and covering the electronic element, and shielding bodies embedded within the encapsulation layer and surrounding the electronic element, wherein end surfaces of the shielding bodies are flush with an inactive surface of the electronic element and a surface of the encapsulation layer;
disposing the package module on one side of a carrier structure, wherein the circuit structure is electrically connected to the carrier structure;
disposing a shielding member on the carrier structure, wherein the shielding member covers the package module, and wherein the shielding element comprises a metal sheet covering the electronic element and at least one shielding leg for supporting the metal sheet on the carrier structure, such that the shielding leg covers a side surface of the package module, and wherein the shielding bodies are in contact with the metal sheet; and
disposing a heat dissipation member on the carrier structure,
wherein the heat dissipation member is connected to the shielding member, and the shielding member is between the at least one electronic element and the heat dissipation member.
8 . The method of claim 7 , wherein a plurality of the electronic elements are disposed on the circuit structure, such that at least one of the shielding bodies is located between two adjacent ones of the electronic elements.
9 . The method of claim 7 , wherein the package module is disposed on the carrier structure via a plurality of conductive elements.
10 . The method of claim 7 , further comprising disposing a plurality of solder balls on the other side of the carrier structure.
11 . The method of claim 7 , wherein the carrier structure has at least one grounding portion electrically connected to the shielding leg.
12 . The method of claim 7 , wherein the carrier structure has at least one grounding portion electrically connected to the heat dissipation member.