Package structure including at least two electronic components and method for manufacturing the same
A package structure and a method of manufacturing a package structure are provided. The package structure includes a first substrate, a first electronic component, a second electronic component and a second substrate. The first electronic component is disposed over and electrically connected to the first substrate. An active surface of the first electronic component faces the first substrate. The second electronic component is disposed under and electrically connected to the first substrate. An active surface of the second electronic component faces the first substrate. The second substrate is disposed under and electrically connected to the first substrate. The second substrate defines a cavity for accommodating the second electronic component.
1 . A package structure, comprising:
a first substrate;
a first electronic component electrically connected to the first substrate;
a second electronic component electrically connected to the first substrate, wherein the first substrate is disposed between the first electronic component and the second electronic component;
a second substrate spaced apart from and electrically connected to the first substrate, wherein at least a portion of the second electronic component is embedded in the second substrate; and
a plurality of external connectors attached to and electrically connected to the second substrate for external connection, wherein at least one of the plurality of external connectors is overlapped with the second electronic component;
wherein a first circuit layout of the first electronic component is a same as a second circuit layout of the second electronic component.
2 . The package structure of claim 1 , wherein the second substrate defines a cavity for accommodating the at least a portion of the second electronic component, wherein the second electronic component is electrically insulated from all of a plurality of walls of the cavity.
3 . The package structure of claim 2 , wherein a depth of the cavity is greater than a thickness of the second electronic component.
4 . The package structure of claim 2 , further comprising an encapsulant encapsulating a bottom surface and a plurality of lateral surfaces of the second electronic component, wherein the encapsulant is disposed between the second electronic component and the plurality of walls of the cavity.
5 . The package structure of claim 1 , further comprising an encapsulant encapsulating the second electronic component, wherein the encapsulant extends to a space between the first substrate and the second substrate.
6 . The package structure of claim 5 , wherein a lateral surface of the encapsulant is aligned with a lateral surface of the second substrate.
7 . The package structure of claim 1 , wherein the first electronic component comprises a first active surface facing the first substrate and at least one first bump provided thereon and electrically connected to the first substrate, the second electronic component comprises a second active surface facing the first substrate and at least one second bump provided thereon electrically connected to the first substrate, and the at least one first bump is aligned with the at least one second bump, wherein the first circuit layout is provided on the first active surface while the second circuit layout is provided on the second active surface.
8 . The package structure of claim 1 , wherein the second substrate further includes a second inner connection structure for electrically connecting a first surface and a second surface of the second substrate, wherein the second inner connection structure includes at least one vertical conductive segment and at least one horizontal conductive segment.
9 . The package structure of claim 8 , wherein the at least one horizontal conductive segment is not exposed from the second substrate.
10 . The package structure of claim 8 , wherein a portion of the at least one horizontal conductive segment is located right under the second electronic component.
11 . The package structure of claim 1 , further comprising at least one internal connector physically connecting and electrically connecting the first substrate and the second substrate, wherein the second electronic component includes at least one second bump electrically connected to the first substrate, and a height of the at least one second bump is greater than a height of the at least one internal connector.