IP Library Granted Patent US 12,648,481
Granted Patent B2
US 12,648,481 · App. 17/902,611 · Granted Jun 2, 2026

Display module and display apparatus having the same

Inventors: Changkyu Chung (Suwon-si, KR); Changsun Kang (Suwon-si, KR); Huigyeong Ahn (Suwon-si, KR); Kyungwoon Jang (Suwon-si, KR); Sangtae Han (Suwon-si, KR); Daesuck Hwang (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H10W90/00G09G3/2096G09G3/32H10H20/857G09G2300/0842H10W72/90H10W90/794
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Quick Facts
Patent No.
US 12,648,481
App. No.
17/902,611
Granted
Jun 2, 2026
Kind
B2
Abstract

A display module includes a first substrate; a plurality of micro-pixel packages provided on an upper surface of the first substrate and including a plurality of pixels arranged in two dimensions; a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate.

Claims (35)

1 . A display module including a plurality of pixels arranged in two dimensions, the display module comprising:

a first substrate;

a plurality of micro-pixel packages provided on an upper surface of the first substrate, each of the plurality of micro-pixel packages including a second substrate and a plurality of inorganic light emitting diodes (LEDs) provided on the second substrate;

a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and

a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers,

wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate,

wherein each inorganic LED of the plurality of inorganic LEDs comprises a light emitting surface, and a pair of electrodes provided on a surface opposite to the light emitting surface,

wherein each micro-pixel controller of the plurality of micro-pixel controllers comprises:

a third substrate; and

at least one thin film transistor (TFT) provided on the third substrate, and

wherein the at least one TFT is configured to switch the plurality of inorganic LEDs and supply a driving current to the plurality of inorganic LEDs.

2 . The display module of claim 1 , wherein each pixel of the plurality of pixels comprises two or more inorganic LEDs among the plurality of inorganic LEDs, and

wherein the plurality of inorganic LEDs of each micro-pixel package of the plurality of micro-pixel packages form two or more pixels among the plurality of pixels.

3 . The display module of claim 1 , wherein heights from the upper surface of the first substrate to upper surfaces of the plurality of inorganic LEDs are greater than heights from the upper surface of the first substrate to the upper ends of the plurality of micro-pixel controllers.

4 . The display module of claim 1 , wherein the second substrate has a thickness that is greater than a thickness of the third substrate.

5 . The display module of claim 4 , wherein the at least one TFT comprises a low temperature polycrystalline silicon TFT.

6 . The display module of claim 5 , wherein the second substrate comprises a glass substrate, and the third substrate comprises a silicon substrate.

7 . The display module of claim 1 , wherein each micro-pixel controller of the plurality of micro-pixel controllers is further configured to control one or more micro-pixel packages adjacent to the micro-pixel controller among the plurality of micro-pixel packages.

8 . The display module of claim 1 , wherein each micro-pixel package of the plurality of micro-pixel packages is configured to be controlled by one or more micro-pixel controllers adjacent to the micro-pixel package among the plurality of micro-pixel controllers.

9 . The display module of claim 1 , further comprising a black matrix layer provided on upper surfaces of the plurality of micro-pixel controllers.

10 . A display module comprising:

a first substrate;

a plurality of micro-pixel packages provided on an upper surface of the first substrate and

comprising a plurality of pixels arranged in two dimensions; and

a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel packages,

wherein each micro-pixel package of the plurality of micro-pixel packages comprises:

a second substrate;

a plurality of inorganic light emitting diodes (LEDs) provided on a first surface of the second substrate; and

a micro-pixel controller provided on the first surface of the second substrate and configured to control the plurality of inorganic LEDs,

wherein lower ends of the plurality of inorganic LEDs are positioned higher than a lower end of the micro-pixel controller with respect to the upper surface of the first substrate, and

wherein each inorganic LED of the plurality of inorganic LEDs comprises a light emitting surface, and a pair of electrodes provided on a surface opposite to the light emitting surface.

11 . The display module of claim 10 , wherein each micro-pixel package of the plurality of micro-pixel packages further comprises a buffer layer provided on the micro-pixel controller of the micro-pixel package, and the plurality of inorganic LEDs are provided on the buffer layer.

12 . The display module of claim 10 , wherein the light emitting surface faces upward, and the pair of electrodes faces downward.

13 . The display module of claim 10 , wherein each pixel of the plurality of pixels comprises two or more inorganic LEDs among the plurality of inorganic LEDs, and

wherein the plurality of inorganic LEDs provided in each micro-pixel package of the plurality of micro-pixel packages form two or more pixels among the plurality of pixels.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2022
From: CHUNG, CHANGKYU; KANG, CHANGSUN; AHN, HUIGYEONG; JANG, KYUNGWOON; HAN, SANGTAE; HWANG, DAESUCK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061377/0129 →
Priority Claims (1)
KR 10-2020-0150030 · Nov 11, 2020 · national
Continuity (2)
Continuation PCTKR2021016317 · Nov 10, 2021
Related Publication 20220415873A1 · Dec 29, 2022
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