Semiconductor package using substrate block integration
A semiconductor package includes a partitioned package substrate composed of substrate parts arranged in a side-by-side manner; an integrated circuit die mounted on a first surface of the partitioned package substrate; and solder balls mounted on a second surface of the partitioned package substrate opposite to the first surface.
1 . A semiconductor package, comprising:
a partitioned package substrate composed of a plurality of substrate parts arranged in a side-by-side manner, wherein the plurality of substrate parts are rearranged and adjoined together with a gap therebetween, and wherein the plurality of substrate parts are adjoined together by using an adhesive that fills into the gap;
at least one integrated circuit die mounted on a first surface of the partitioned package substrate; and
a plurality of solder balls mounted on a second surface of the partitioned package substrate opposite to the first surface.
2 . The semiconductor package according to claim 1 , wherein the at least one integrated circuit die is electrically connected to the partitioned package substrate through a plurality of conductive elements.
3 . The semiconductor package according to claim 2 , wherein the conductive elements comprise micro-bumps, copper bumps or copper pillars.
4 . The semiconductor package according to claim 1 , wherein the plurality of substrate parts are physically separated from one another.
5 . The semiconductor package according to claim 1 , wherein the gap has a width ranging between 1-3 mm.
6 . The semiconductor package according to claim 1 , wherein the plurality of substrate parts are homogeneous substrates.
7 . The semiconductor package according to claim 1 , wherein the plurality of substrate parts are heterogeneous substrates.
8 . The semiconductor package according to claim 1 , wherein the plurality of substrate parts have the same thickness.
9 . The semiconductor package according to claim 1 , wherein the plurality of substrate parts have different thicknesses.
10 . The semiconductor package according to claim 1 further comprising:
at least one die mounted on the first surface of the partitioned package substrate in a flip-chip manner.
11 . The semiconductor package according to claim 10 , wherein the at least one die is a dummy die.
12 . The semiconductor package according to claim 10 , wherein the at least one die is a memory die.
13 . The semiconductor package according to claim 1 further comprising:
a second integrated circuit die; and
an electronic device mounted on the first surface of the partitioned package substrate.
14 . The semiconductor package according to claim 13 , wherein the electronic device comprises a decoupling capacitor.
15 . The semiconductor package according to claim 13 , wherein the second integrated circuit die and the electronic device do not overlap with the gap.
16 . The semiconductor package according to claim 1 further comprising:
an annular frame mounted on the first surface of the partitioned package substrate.
17 . The semiconductor package according to claim 16 , wherein the frame is a metal frame.
18 . The semiconductor package according to claim 16 , wherein the frame is attached to the first surface of the partitioned package substrate by using joint bumps.
19 . The semiconductor package according to claim 16 , wherein the frame is attached to the first surface of the partitioned package substrate by using adhesive.
20 . The semiconductor package according to claim 16 , wherein the frame comprise an opening for accommodating the at least one integrated circuit die.
21 . The semiconductor package according to claim 1 further comprising:
a lid installed on the first surface of the partitioned package substrate, wherein the at least one integrated circuit die is housed by the lid and encapsulated by a mold cap.
22 . The semiconductor package according to claim 1 further comprising:
a re-distribution layer (RDL) structure on the first surface of the partitioned package substrate, wherein the at least one integrated circuit die is mounted on the RDL structure.