Granted Patent B2

US 12,652,760 · App. 18/481,256 · Granted Jun 9, 2026

Inventors: Ming Chang Tsai (Guangdong Province, CN); Ta-Te Hsieh (Guangdong Province, CN)

Assignee: USI Science and Technology (Shenzhen) Co., Ltd.

H05K1/186H05K1/185H05K1/188H10W90/00H05K2201/0715H05K2201/10015H05K2201/1003H05K2201/10454

Abstract

Claims (29)

1 . An electronic package module, comprising:

a circuit substrate including a flat surface;

an electronic component disposed on the circuit substrate and including:

an input end located on the flat surface of the circuit substrate and electrically connected to the circuit substrate;

a main part located on the input end; and

a ground end located on the main part, wherein the input end and the ground end are separately located on two opposite sides of the main part;

an encapsulation layer partially covering the electronic component;

a metal layer located above the encapsulation layer and electrically connected to the ground end;

an insulation film disposed between the encapsulation layer and the metal layer, wherein the insulation film partially covers the electronic component; and

a conductive layer located in the insulation film and partially covering the electronic component;

wherein the insulation film includes a first opening, located on the ground end, and the metal layer extends into the first opening and is connected to the conductive layer and the ground end through the first opening; and

wherein the input end and the main part are located between the ground end and the circuit substrate, and the input end, the main part and the ground end are arranged along a normal direction of the flat surface.

2 . The electronic package module of claim 1 , further comprising:

a conductive pillar disposed between the metal layer and the circuit substrate, wherein the conductive pillar is electrically connected to the metal layer and the circuit substrate.

3 . The electronic package module of claim 2 , wherein the insulation film includes a second opening located on the conductive pillar, and the metal layer extends into the second opening and is connected to the conductive layer and the conductive pillar through the second opening.

4 . The electronic package module of claim 3 , wherein the conductive layer is electrically connected to the ground end and the conductive pillar.

5 . A method for fabricating an electronic package module, comprising:

providing a circuit substrate, and the circuit substrate has a flat surface;

providing an electronic component including a main part, an input end and a ground end separately located on two sides of the main part; and

perpendicularly disposing the electronic component on the flat surface of the circuit substrate, and the input end is connected to the circuit substrate, wherein the ground end is disposed away from the circuit substrate along with a normal direction of the flat surface, wherein the ground end overlaps the input end in the normal direction;

forming an encapsulation layer on the circuit substrate;

exposing a ground surface of the ground end from the encapsulation layer;

disposing a first insulation film on the encapsulation layer and the ground surface of the ground end;

disposing a conductive layer on the first insulation film;

disposing a second insulation film on the conductive layer; and

exposing a part of the ground surface of the ground end by forming an opening extending through the first insulation film, the conductive layer and the second insulation film; and

disposing a metal layer on the second insulation film and the opening, wherein the metal layer directly touches the ground surface of the ground end through the opening.

6 . The method of claim 5 , further comprising:

disposing a conductive pillar on the flat surface of the circuit substrate before the encapsulation layer is formed, wherein the conductive pillar is electrically connected to the metal layer and the circuit substrate.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (11)