Negative-tone organic dielectric with fine metal pillar resolution
Embodiments of present invention provide a method. The method includes forming a set of metal pillars on a substrate; forming a negative-tone organic dielectric layer covering the set of metal pillars; planarizing the negative-tone organic dielectric layer to expose the set of metal pillars; forming a resist mask on the negative-tone organic dielectric layer, the resist mask having openings that expose the set of metal pillars; and forming a redistribution layer in the openings of the resist mask, the redistribution layer being in direct contact with the set of metal pillars. A structure formed thereby is also provided.
1 . A method comprising:
forming a set of metal pillars on a substrate;
forming a negative-tone organic dielectric layer covering the set of metal pillars;
planarizing the negative-tone organic dielectric layer to expose the set of metal pillars;
forming a resist mask on the negative-tone organic dielectric layer, the resist mask having openings that expose the set of metal pillars; and
forming a redistribution layer in the openings of the resist mask, the redistribution layer being in direct contact with the set of metal pillars.
2 . The method of claim 1 , wherein forming the set of metal pillars comprises:
forming a plating resist layer on top of the substrate;
creating openings in the plating resist layer;
forming the set of metal pillars in the openings of the plating resist layer through an electroplating process; and
stripping the plating resist layer that surrounds the set of metal pillars.
3 . The method of claim 1 , wherein at least one of the metal pillars of the set of metal pillars has a horizontal dimension that is less than 5 μm.
4 . The method of claim 1 , further comprising curing the negative-tone organic dielectric layer through a flood exposure for a duration between about 100 ms and about 1000 ms and under an energy dose ranging from about 200 mJ/cm 2 to about 1000 mJ/cm 2 with ghi-line or i-line wavelengths.
5 . The method of claim 1 , wherein both the redistribution layer and the set of metal pillars are made of copper.
6 . The method of claim 1 , wherein the substrate includes one or more metal layers of a back-end-of-line (BEOL) structure, and the set of metal pillars are conductively connected to the one or more metal layers.
7 . The method of claim 1 , further comprising forming one or more C4 solders on top of and in direct contact with the redistribution layer.
8 . A method comprising:
forming one or more metal pillars on a substrate, the substrate including a back-end-of-line structure, the structure including one or more metal lines;
forming a negative-tone organic dielectric layer on top of and covering the one or more metal pillars and the substrate;
planarizing the negative-tone organic dielectric layer to expose top surfaces of the one or more metal pillars;
forming a resist mask on the negative-tone organic dielectric layer, the resist mask having openings that expose the top surfaces of the one or more metal pillars; and
electroplating a redistribution layer in the openings of the resist mask, the redistribution layer including one or more metal contacts, the one or more metal contacts in direct contact with the one or more metal pillars.
9 . The method of claim 8 , wherein forming the one or more metal pillars comprises:
forming a plating resist layer on top of the substrate;
creating openings in the plating resist layer in a lithographic patterning process;
electroplating the one or more metal pillars in the openings in the plating resist layer; and
stripping the plating resist layer that surrounds the one or more metal pillars.
10 . The method of claim 8 , wherein each of the one or more metal pillars has a horizontal dimension that is less than 5 μm.
11 . The method of claim 8 , wherein the negative-tone organic dielectric layer has a resolution no better than 5 μm.
12 . The method of claim 8 , wherein both the one or more metal contacts of the redistribution layer and the one or more metal pillars are made of copper.
13 . The method of claim 8 , further comprising forming one or more C4 solders on top of and in contact with the one or more metal contacts of the redistribution layer.